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 HY62SF16201A Series
128Kx16bit full CMOS SRAM
Document Title
128K x16 bit 1.8V Super Low Power Full CMOS Slow SRAM
Revision History
Revision No 05 History Divide output load into two factors - tCLZ,tOLZ,tBLZ,tCHZ,tOHZ,tBHZ,tWHZ,tOW - Others Add marking information Change AC Characteristic - tBLZ Draft Date Dec.10. 2000 Remark Final
06
Mar. 24. 2002
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev.06 /Mar. 2002 Hynix Semiconductor
HY62SF16201A
DESCRIPTION
The HY62SF16201A is a high speed, low power and 2M bit full CMOS SRAM organized as 131,072 words by 16bit. The HY62SF16201A uses high performance full CMOS process technology and designed for high speed low power circuit technology. It is particularly well suited for used in high density low power system application. This device has a data retention mode that guarantees data to remain valid at a minimum power supply voltage of 1.2V. Product Voltage Speed No. (V) (ns) HY62SF16201A 1.7~2.3V 85/100/120 HY62SF16201A-I 1.7~2.3V 85/100/120 Notes : 1. Blank : Commercial, I : Industrial 2. Current value is max.
FEATURES
* Fully static operation and Tri-state output * TTL compatible inputs and outputs * Battery backup(LL-part) -. 1.2V(min) data retention * Standard pin configuration -. 48-FBGA
Operation Current/Icc(mA) 3 3
Standby Current(uA) LL SL 3 1 3 1
Temperature (C) 0~70 -40~85(I)
PIN CONNECTION
/LB /OE A0 A1 A4 A6 A7 A2 NC
A0
BLOCK DIAGRAM
ROW DECODER SENSE AMP ADD INPUT BUFFER
IO9 /UB A3 IO10 IO11 A5 Vss IO12 NC Vcc IO13 NC
/CS IO1 IO2 IO3 IO4 Vcc
I/O1
COLUMNDECODER
DATA I/O BUFFER
A16 IO5 Vss
MEMORY ARRAY 128K x 16
WRITE DRIVER
IO15 IO14 A14 A15 IO6 IO7 IO16 NC NC A8 A12 A13 /WE IO8 A9 A10 A11 NC
/CS /OE /LB /UB /WE CONTRO LLOGIC A16
I/O16
48-FBGA(Top View)
PIN DESCRIPTION
Pin Name /CS /WE /OE /LB /UB Pin Function Chip Select Write Enable Output Enable Lower Byte Control(I/O1~I/O8) Upper Byte Control(I/O9~I/O16) Pin Name I/O1~I/O16 A0~A16 Vcc Vss NC Pin Function Data Inputs / Outputs Address Inputs Power( 1.7V ~ 2.3V ) Ground No Connection
Rev.06 /Mar. 2002
2
HY62SF16201A
ORDERING INFORMATION
Part No. Speed HY62SF16201ALLF 85/100/120 HY62SF16201ALLF 85/100/120 HY62SF16201ALLF-I 85/100/120 HY62SF16201ALLF-I 85/100/120 Note : 1. Blank : Commercial, I : Industrial Power LL-part SL-part LL-part SL-part Temp. Package FBGA FBGA FBGA FBGA
I I
ABSOLUTE MAXIMUM RATING (1)
Symbol VIN, VOUT Vcc TA Parameter Input/Output Voltage Power Supply Operating Temperature Rating -0.2 to 3.6 -0.2 to 4.6 0 to 70 -40 to 85 -55 to 150 1.0 260 * 10 Unit V V C C C W C * sec Remark
HY62SF16201A HY62SF16201A-I
TSTG Storage Temperature PD Power Dissipation TSOLDER Ball Soldering Temperature & Time Note : 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and the functional operation of the device under these or any other conditions above those indicated in the operation of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect reliability.
TRUTH TABLE
/CS H X L L L /WE X X H H H /OE X X H H L /LB X H L X L H L L H L /UB X H X L H L L H L L Mode Deselected Deselected Output Disabled Output Disabled Read I/O1~I/O8 High-Z High-Z High-Z High-Z DOUT High-Z DOUT DIN High-Z DIN I/O I/O9~I/O16 High-Z High-Z High-Z High-Z High-Z DOUT DOUT High-Z DIN DIN Power Standby Standby Active Active Active
L
L
X
Write
Active
Note : 1. H=VIH, L=VIL, X=don't care 2. UB, LB(Upper, Lower Byte enable) These active LOW inputs allow individual bytes to be written or read. When LB is LOW, data is written or read to the lower byte, I/O 1 -I/O 8. When UB is LOW, data is written or read to the Upper byte, I/O 9 -I/O 16.
Rev.06 /Mar. 2002
2
HY62SF16201A
RECOMMENDED DC OPERATING CONDITION
Symbol Parameter Min. Vcc Supply Voltage 1.7 Vss Ground 0 VIH Input High Voltage 1.4 VIL Input Low Voltage -0.3(1) Note : 1. VIL = -1.5V for pulse width less than 30ns 2. Typical values is not 100% tested Typ. 1.8 0 Max. 2.3 0 Vcc+0.3 0.4 Unit V V V V
DC ELECTRICAL CHARACTERISTICS
Vcc = 1.7V~2.3V, TA = 0C to 70C/-40C to 85C (I) Symbol Parameter Test Condition ILI Input Leakage Current Vss < VIN < Vcc ILO Output Leakage Current Vss < VOUT < Vcc, /CS = VIH or /OE = VIH or /WE = VIL, /UB = /LB = VIH Icc Operating Power Supply /CS = VIL, VIN = VIH or VIL, Current II/O = 0mA ICC1 Average Operating Cycle Time=Min.100% duty, Current /CS = VIL,VIN = VIH or VIL, II/O = 0mA, Cycle time = 1us, /CS < 0.2V, VIN<0.2V, II/O = 0mA, ISB Standby Current /CS = VIH or (TTL Input) /UB = /LB = VIH, VIN = VIH or VIL ISB1 Standby Current /CS > Vcc - 0.2V or SL (CMOS Input) /UB = /LB > Vcc - 0.2V, VIN > Vcc - 0.2V or LL VIN < Vss + 0.2V VOL Output Low Voltage IOL = 0.1mA VOH Output High Voltage IOH = -0.1mA Notes : 1. Typical values are at Vcc = 1.8V, TA = 25C 2. Typical values are sampled and not 100% tested Min. -1 -1 Typ. Max. 1 1 Unit uA uA
-
-
3 20 3
mA mA mA mA uA uA V V
1.6
0.5 -
0.15 1 3 0.2 -
CAPACITANCE
(Temp = 25C, f= 1.0MHz) Symbol Parameter CIN Input Capacitance(Add, /CS, /WE, /UB, /LB, /OE) COUT Output Capacitance(I/O) Note : 1. These parameters are sampled and not 100% tested Condition VIN = 0V VI/O = 0V Max. 8 10 Unit pF pF
Rev.06 /Mar. 2002
3
HY62SF16201A
AC CHARACTERISTICS
Vcc = 1.7V~2.3V, TA = 0C to 70C/ -40C to 85C(I), unless otherwise specified -85 -10 Parameter Symbol # Min. Max. Min. Max. READ CYCLE 1 tRC Read Cycle Time 85 100 2 tAA Address Access Time 85 100 3 tACS Chip Select Access Time 85 100 4 tOE Output Enable to Output Valid 40 50 5 tBA /LB, /UB Access Time 85 100 6 tCLZ Chip Select to Output in Low Z 10 20 7 tOLZ Output Enable to Output in Low Z 5 5 8 tBLZ /LB, /UB Enable to Output in Low Z 10 20 9 tCHZ Chip Deselection to Output in High Z 0 30 0 30 10 tOHZ Out Disable to Output in High Z 0 30 0 30 11 tBHZ /LB, /UB Disable to Output in High Z 0 30 0 30 12 tOH Output Hold from Address Change 10 15 WRITE CYCLE 13 tWC Write Cycle Time 85 100 14 tCW Chip Selection to End of Write 70 80 15 tAW Address Valid to End of Write 70 80 16 tBW /LB, /UB Valid to End of Write 70 80 17 tAS Address Set-up Time 0 0 18 tWP Write Pulse Width 55 75 19 tWR Write Recovery Time 0 0 20 tWHZ Write to Output in High Z 0 30 0 35 21 tDW Data to Write Time Overlap 35 45 22 tDH Data Hold from Write Time 0 0 23 tOW Output Active from End of Write 5 10 Min. 120 20 10 20 0 0 0 15 120 100 100 100 0 85 0 0 50 0 10 -12 Max. 120 120 60 120 40 40 40 40 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
AC TEST CONDITIONS
TA = 0C to 70C (Normal) /-40C to 85C (I), unless otherwise specified Parameter Value Input Pulse Level 0.4V to 1.6V Input Rise and Fall Time 5ns Input and Output Timing Reference Level 0.9V Output Load tCLZ,tOLZ,tBLZ,tCHZ,tOHZ,tBHZ,tWHZ,tOW CL = 5pF + 1TTL Load Others CL = 30pF + 1TTL Load
AC TEST LOADS
VTM = 1.7V
4091 Ohm DOUT CL(1) 3273 Ohm
Note : 1. Including jig and scope capacitance
Rev.06 /Mar. 2002
4
HY62SF16201A
TIMING DIAGRAM
READ CYCLE 1(Note 1,4)
tRC ADDR tAA tACS /CS tCHZ(3) tBA /UB ,/ LB tOE tOLZ(3) tBLZ(3) tCLZ(3) Data Valid tBHZ(3) tOH
/OE
tOHZ(3)
Data Out
High-Z
READ CYCLE 2(Note 2,3,4)
tRC ADDR tAA tOH Data Out Previous Data Data Valid tOH
READ CYCLE 3(Note 1,2,4)
/CS /UB, /LB
tACS tCLZ(3) Data Out Data Valid tCHZ(3)
Notes: A read occurs during the overlap of a low /OE, a high /WE, a low /CS1 and low /UB and/or /LB. 2. /OE = VIL 3. Transition is measured + 200mV from steady state voltage. This parameter is sampled and not 100% tested. 4. /CS in high for the standby, low for active /UB and /LB in high for the standby, low for active
Rev.06 /Mar. 2002
5
HY62SF16201A
WRITE CYCLE 1 (1,4,8) (/WE Controlled)
tWC ADDR tWR(2) tCW /CS tAW tBW /UB,/LB tWP /WE tAS Data In High-Z tWHZ(3,7) Data Out tDW Data Valid tOW (5) (6) tDH
WRITE CYCLE 2 (1,4,8) (/CS Controlled)
tWC ADDR tAS /CS tAW tBW /UB,/LB tWP /WE tDW Data In High-Z Data Valid tDH tCW tWR(2)
Data Out
High-Z
Notes: 1. A write occurs during the overlap of a low /WE, a low /CS1 and low /UB and/or /LB. 2. tWR is measured from the earlier of /CS, /LB, /UB, or /WE going high to the end of write cycle. 3. During this period, I/O pins are in the output state so that the input signals of opposite phase to the output must not be applied. 4. If the /CS, /LB and /UB low transition occur simultaneously with the /WE low transition or after the /WE transition, outputs remain in a high impedance state. 5. Q(data out) is the same phase with the write data of this write cycle. 6. Q(data out) is the read data of the next address. 7. Transition is measured +200mV from steady state. This parameter is sampled and not 100% tested. 8. /CS in high for the standby, low for active /UB and /LB in high for the standby, low for active
Rev.06 /Mar. 2002
6
HY62SF16201A
DATA RETENTION ELECTRIC CHARACTERISTIC
TA = 0C to 70C /-40C to 85C (I) Symbol Parameter VDR Vcc for Data Retention Test Condition /CS > Vcc - 0.2V or /UB = /LB > Vcc-0.2V, VIN > Vcc - 0.2V or VIN < Vss + 0.2V Vcc=1.5V, /CS > Vcc - 0.2V or LL /UB = /LB > Vcc-0.2V, VIN > Vcc - 0.2V or SL VIN < Vss + 0.2V See Data Retention Timing Diagram Min. 1.2 Typ. Max. 2.3 Unit V
ICCDR
Data Retention Current
0 tRC(3)
-
3 1 -
uA uA ns ns
tCDR
tR Notes: 1. Typical values are under the condition of TA = 25C. 2. Typical Values are sampled and not 100% tested 3. tRC is read cycle time.
Chip Deselect to Data Retention Time Operating Recovery Time
DATA RETENTION TIMING DIAGRAM
VCC 1.7V tCDR DATA RETENTION MODE tR
VDR CS or /UB &/LB VSS CS > VCC-0.2V or /UB = /LB > Vcc - 0.2V
Rev.06 /Mar. 2002
7
HY62SF16201A
PACKAGE INFORMATION
48ball Fine Pitch Ball Grid Array Package(F)
BOTTOM VIEW
B A A1 CORNER INDEX AREA 6 A A B C D C E F G H C1/2 C1/2 C1 5 4 3 2 1 B1/2
TOP VIEW
B1/2
B1
SIDE VIEW
5
C
E1 E2 E SEATING PLANE A 4
r
3 D(DIAMETER)
Note
Symbol A B B1 C C1 D E E1 E2 r
Min. 6.9 7.9 0.3 0.74 0.17 -
Typ. 0.75 3.75 7.0 5.25 8.0 0.35 1.0 0.78 0.22 -
Max. 7.1 8.1 0.4 1.1 0.82 0.27 0.08
1. DIMENSIONING and TOLERANCING PER ASME Y14. 5M-1994. 2. ALL DIMENSIONS ARE MILLIMETERS. 3. DIMENSION "D" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE CROWN OF THE SOLDER BALLS. 5. THIS IS A CONTROLLING DIMENSION.
Rev.06 /Mar. 2002
8
HY62SF16201A
MARKING INSTRUCTION
Package
H Y
Marking Example
S F 6 2 1 A c
FBGA
s
s
t
y
y
w
w
p
x
x
x
x
x
K
O
R
Index
* HYSF621Ac c : Part Name : Power Consumption -L -S : Speed - 85 - 10 - 12 *t : Temperature -C -I : 85ns : 100ns : 120ns : Industrial ( -0 ~ 70 C ) : Industrial ( -40 ~ 85 C ) : Low Low Power : Super Low Power
* ss
* yy * ww *p * xxxxx * KOR Note - Capital Letter - Small Letter
: Year (ex : 00 = year 2000, 01= year 2001) : Work Week ( ex : 12 = work week 12 ) : Process Code : Lot No. : Origin Country
: Fixed Item : Non-fixed Item
Rev.06 /Mar. 2002
9


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