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| PD - 94315 IRGC5B120UB IRGC5B120UB IGBT Die in Wafer Form * * * * * * * * * * Features GEN5 Non Punch Through (NPT) Technology UltraFast 10s Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient Benchmark Efficiency above 20KHz Optimized for Welding, UPS, and Induction Heating Rugged with UltraFast Performance Excellent Current Sharing in Parallel Operation Qualified for Industrial Market C Benefits G E 1200 V IC(nom) = 5A VCE(on) typ. = 4.01V @ IC(nom) @ 25C UltraFast IGBT Short Circuit Rated 150mm Wafer Electrical Characteristics ( Wafer Form ) Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Guaranteed (Min/Max) Collector-to-Emitter Saturation Voltage 2.54V Min., 3.64V Max. Collector-to-Emitter Breakdown Voltage 1200V Min. Gate Threshold Voltage 4.4V Min., 6.0V Max. Zero Gate Voltage Collector Current 5.0 A Max. Gate-to-Emitter Leakage Current 1.1 A Max. Test Conditions IC = 2.5A, TJ = 25C, VGE = 15V TJ = 25C, ICES = 100A, VGE = 0V VGE = VCE , TJ =25C, IC =125A TJ = 25C, VCE = 1200V TJ = 25C, VGE = +/- 20V Mechanical Data Norminal Backmetal Composition, Thickness: Norminal Front Metal Composition, Thickness: Dimensions: Wafer Diameter: Wafer thickness: Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location Recommended Storage Environment: Recommended Die Attach Conditions Al-Ti-NiV-Ag ( 1kA-1kA-4kA-6kA ) 99% Al, 1% Si (4 microns) 0.112" x 0.150" 150mm, with std. < 100 > flat 185 +/- 15 Microns 01-5428 100 Microns 0.25mm Diameter Minimum Consistent throughout same wafer lot Store in original container, in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300C Die Outline 2.845 [.112] 1.454 [.057] NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMET ERS [INCHES]. 2. CONTROLLING DIMENSION: [INCH]. 3. LET TER DESIGNAT ION: S = SOURCE 3.810 [.150] 0.646 [.025] EMIT TE R 2.325 [.091] G = GAT E SK = SOURCE KELVIN IS = CURRENT SENS E < 0.635 T OLERANCE = + /- 0.013 < [.0250] TOLERANCE = + /- [.0005] > 0.635 T OLERANCE = + /- 0.025 > [.0250] TOLERANCE = + /- [.0010] < 1.270 T OLERANCE = + /- 0.102 < [.050] T OLE RANCE = + /- [.004] > 1.270 T OLERANCE = + /- 0.203 > [.050] T OLE RANCE = + /- [.008] E = EMITT ER 4. DIMENSIONAL T OLERANCES: BONDING PADS : WIDTH & LENGTH G OVERALL DIE: WIDTH 0.617 [.024] & LENGTH 10/02/01 |
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