View 2605_965168.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Bulletin I0506J rev. C 05/01
SC170.....5. Series
SCHOTTKY DIE 115 x 170 mils
a c
0.35 0.01 (14 0.4)
NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS).
C A D b d
O 40 (157)
3. DIMENSIONS AND TOLERANCES: a = 4.32 + 0, - 0.01 (170 + 0, - 0.4) b = 2.92 + 0, - 0.01 (115 + 0, - 0.4) c = 4.17 + 0, - 0.01 (164 + 0, - 0.4) d = 2.77 + 0, - 0.01 (109 + 0, - 0.4) O = 1 0.15 (40 6) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, - 0.005 (2 + 0, - 0.2)
Wafer flat alligned with side b of the die
O 125 (492)
NOT TO SCALE
NOTE:
10 mils die thickness is available on specific request only. Contact factory for information.
www.irf.com
1
SC170.....5.
Bulletin I0506J rev. C 05/01
Electrical Characteristics
Device # SC170R015x5x SC170S020x5x SC170S030x5x SC170S045x5x SC170S060x5x SC170H045x5x SC170H100x5x SC170H150x5x TJ Max. (C) 125 150 150 150 150 175 175 175 VR (V) 15 20 30 45 60 45 100 150 350 250 140 40 15 Typ. IR @ 25C (A) 5000 Typ. IR @ 125C (mA) 600 Max. VF @ IF (V) 0.41 @ 19A Package Style TO-220
n.a. contact factory 140 100 70 14 8 0.48 @ 20A 0.57 @ 20A 0.61 @ 20A 0.60 @ 18A 0.80 @ 20A TO-220 TO-220 TO-220 TO-220 TO-220
n.a. contact factory
Mechanical Data
Device # SC170xxxxA5x SC170xxxxS5x Wire Bondable Solderable -Ti 2 kA Metal Thickness Front Metal Al 30 kA Ni 1 kA -Ag 35 kA Cr 1 kA Cr 1 kA Metal Thickness Back Metal Ni 2 kA Ni 2 kA Ag 3 kA Ag 3 kA
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device # SC170xxxxx5B SC170xxxxx5R SC170xxxxx5P SC170xxxxx5F Description Minimum Order Quantity Die in Sale Package 800 n.a. 800 800
Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film
2
www.irf.com
SC170.....5.
Bulletin I0506J rev. C 05/01
Ordering Information Table
Device Code
SC 170
1 1 2 3 4 5 6 7 Schottky Die Chip Dimension in Mils Process (see Electrical Characteristics Table) Voltage code: Code = VRRM 2
H
3
100
4
S
5
5
6
B
7
H = 830 Process R = OR'ing Process S = Standard Process
Chip surface metallization (see Mechanical Data Table) Wafer Diameter in inches Packaging (see Packaging Table)
Wafer on Film
www.irf.com
3
SC170.....5.
Bulletin I0506J rev. C 05/01
Wafer in Box
ROUND CONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIP TRAY POCKET
4
www.irf.com
SC170.....5.
Bulletin I0506J rev. C 05/01
Tape and Reel
REEL FRAME
BARE DIE CARRIER TAPE
WORLD HEADQUARTERS: EUROPEAN HEADQUARTERS: IR CANADA: IR GERMANY: IR ITALY: IR FAR EAST: IR SOUTHEAST ASIA: IR TAIWAN: http://www.irf.com
233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332. Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408. 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801. Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933. Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220. K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086. 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630. 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936. Data and specifications subject to change without notice.
Fax-On-Demand: +44 1883 733420
www.irf.com
5

▲Up To Search▲

Price & Availability of 2605

	To Download 2605 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .