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| Bulletin I0508J rev. B 05/01 SC202.....5.. Series SCHOTTKY DIE 200 x 200 mils (Monolithic Dual) a 0.25 0.01 (10 0.4) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). Anode d b Anode D c O 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 5.08 + 0, - 0.01 (200 + 0, - 0.4) b = 5.08 + 0, - 0.01 (200 + 0, - 0.4) c = 4.92 + 0, - 0.01 (193 + 0, - 0.4) d = 2.43 + 0, - 0.01 (95 + 0, - 0.4) O = 1 0.15 (40 6) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, - 0.005 (2 + 0, - 0.2) Wafer flat alligned with side b of the die NOT TO SCALE 1 SC202.....5. Series Preliminary Data Sheet I0508J rev. B 05/01 Electrical Characteristics Device # SC202S020A5 SC202S030A5 SC202S045A5 SC202S060A5 SC202H100A5 TJ Max. (C) 150 150 150 150 150 VR (V) 20 30 45 60 100 Max. IR @ 25C (mA) 8 2 2 2 0.55 (*) Max. VF @ IF (V) 0.42 V @ 40A per die, TJ= 25C 0.46V @ 30A per die, TJ= 25C 0.51 V @ 20A per die, TJ= 25C 0.54V @ 15A per die, TJ= 25C 0.69 V @ 10A per die, TJ= 25C (*) For reference only, VF do not include voltage drop across wire bonding resistance Mechanical Data Device # Metal Thickness Front Metal Metal Thickness Back Metal SC202....A5.. Bondable -- Al/Si 30 kA -- Ti 1 kA Ni 4 kA Ag 6 kA Visual Inspection : see IR internal Spec. # 6373-2064 Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months. Packaging Device # SC202....5B. Description Minimum Order Quantity Wafer in Sale Package 48 Inked Probed Unsawn Wafer (Wafer in Box) 2 SC202.....5. Series Preliminary Data Sheet I0508J rev. B 05/01 Ordering Information Table Device Code SC 202 1 2 S 3 060 4 A 5 5 6 B 7 1 2 3 4 5 6 7 - Schottky Die Chip Dimension in Mils: 200 x 200 Dual Monolithic Process (see Electrical Characteristics Table) Voltage code: Code = VRRM Chip surface metallization (Al) Wafer Diameter in inches Packaging: B = inked probed unsawn wafers (in box) H = 830 Process R = OR' ing Process S = Standard Process Wafer in Box ROUND CONTAINER TYVEK DISK FOAM DISK 3 SC202.....5. Series Preliminary Data Sheet I0508J rev. B 05/01 WORLD HEADQUARTERS: EUROPEAN HEADQUARTERS: IR CANADA: IR GERMANY: IR ITALY: IR FAR EAST: IR SOUTHEAST ASIA: IR TAIWAN: http://www.irf.com 233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332. Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408. 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801. Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933. Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220. K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086. 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630. 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936. Data and specifications subject to change without notice. Fax-On-Demand: +44 1883 733420 4 |
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