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| MICROCIRCUIT DATA SHEET MNLM2991-X REV 0D1 Original Creation Date: 09/06/95 Last Update Date: 12/15/98 Last Major Revision Date: 09/06/95 NEGATIVE LOW DROPOUT ADJUSTABLE REGULATOR General Description The LM2991 is a low dropout adjustable negative regulator with a output voltage range between -2V to -25V. The LM2991 provides up to 1A of load current and features a ON/Off pin for remote shutdown capability. The LM2991 uses new circuit design techniques to provide a low dropout voltage, low quiescent current and low temperature coefficient precision reference. The dropout voltage at 1A load current is typically 0.6V and a guaranteed worst-case maximum of 1V over the entire operating temperature range. The quiescent current is typically 1mA with a 1A load current and an input-output voltage differential greater than 3V. A unique circuit design of the internal bias supply limits the quiescent current to only 9mA (typical) when the regulator is in the dropout mode (Vout - Vin < 3V). The LM2991 is short-circuit proof, and thermal shutdown includes hysteresis to enhance the reliability of the device when inadvertently overloaded for extended periods. Industry Part Number LM2991 NS Part Numbers LM2991J-QML* LM2991J-QMLV** LM2991WG-QML*** Prime Die LM2991 Controlling Document See Features Page Processing MIL-STD-883, Method 5004 Subgrp Description 1 2 3 4 5 6 7 8A 8B 9 10 11 Static tests at Static tests at Static tests at Dynamic tests at Dynamic tests at Dynamic tests at Functional tests at Functional tests at Functional tests at Switching tests at Switching tests at Switching tests at Temp ( oC) +25 +125 -55 +25 +125 -55 +25 +125 -55 +25 +125 -55 Quality Conformance Inspection MIL-STD-883, Method 5005 1 MNLM2991-X REV 0D1 MICROCIRCUIT DATA SHEET Features Output voltage adjustable from -2V to -25V Output current in excess of 1A Dropout voltage typically 0.6V at 1A load Low quiescent current Internal short circuit current limit Internal thermal shutdown with hysteresis TTL, CMOS compatible ON/OFF switch Functional complement to the LM2941 series SMD : 5962-9650501QEA*, VEA**, QXA*** Applications - Post switcher regulator - Local, on-card, regulation - Battery operated equipment 2 MNLM2991-X REV 0D1 MICROCIRCUIT DATA SHEET (Absolute Maximum Ratings) (Note 1) Input Voltage -26V to +0.3V Power Dissipation (Note 2, 3) Internally Limited Operating Temperature Range (Tj) -55 C to +125 C Maximum Junction Temperature (Tjmax) 150 C Storage Temperature Range -65 C to +150 C Thermal Resistance (Note 3) ThetaJA CERAMIC DIP CERAMIC SOIC (Still Air (500LF/Min (Still Air (500LF/Min @ 0.5 C/W) Air flow @ 0.5 C/W) @ 0.5 C/W) Air flow @ 0.5 C/W) 75 35 119 73 C/W C/W C/W C/W ThetaJC CERAMIC DIP CERAMIC SOIC Package Weight (Typical) Lead Temperature (Soldering, 10 seconds) ESD Susceptibility (Note 4) 5 C/W 3 C/W TBD 260 C 1.5kV Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specification apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax -TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. If this dissipation is exceeded, the die temperature will rise above 125 C and the LM2991 will go into thermal shutdown. The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. Human body model, 100pF discharge through a 1.5K Ohms resistor. Note 2: Note 3: Note 4: 3 MNLM2991-X REV 0D1 MICROCIRCUIT DATA SHEET Recommended Operating Conditions (Note 1) Maximum Input Voltage (Operational) -26V Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. 4 MNLM2991-X REV 0D1 MICROCIRCUIT DATA SHEET Electrical Characteristics DC PARAMETERS (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin = -10V, Vo = -3V, Io = 1A, Co = 47uF, R1 = 2.7K, Tj = 25 C SYMBOL Vref PARAMETER Reference Voltage 5mA < Io < 1A 5mA < Io < 1A, Vo - 1V > Vin > -26V Vout Output Voltage Range Vin = -26V -24 +25 VRLN VRLD Line Regulation Load Regulation Io = 5mA, Vo - 1V > Vin > -26V 50mA < Io < 1A 50mA < Io < 1A V DO Dropout Voltage Io = 0.1A, Delta Vo < 100mV Io = 0.1A, Delta Vo < 100mV Io = 1A, Delta Vo < 100mV Io = 1A, Delta Vo < 100mV Iq Quiescent Current Dropout Quiescent Current RR VON Ripple Rejection Output Noise Io < 1A Vin = Vo, Io < 1A Vripple = 1Vrms, Fripple = 1KHz, Io = 5mA 10Hz - 100KHz, Io = 5mA 50 450 500 ON/OFF Input Voltage ON/OFF Input Voltage ON/OFF Input Current ON/OFF Input Current ON/OFF Input Current ON/OFF Input Current Il Output Leakage Current (Vout:ON) (Vout:OFF) VON/OFF = 0.8V (Vout:ON) VON/OFF = 0.8V (Vout:ON) VON/OFF = 2.4V (Vout:OFF) VON/OFF = 2.4V (Vout:OFF) Vin = -26V, VON/OFF = 2.4V, Vout = 0V Vin = -26V, VON/OFF = 2.4V, Vout = 0V 2.4 10 25 100 150 250 300 0.8 -26 -12 -15 +26 +12 +15 0.2 0.3 0.8 1 5 50 CONDITIONS NOTES PINNAME MIN MAX UNIT SUBGROUPS 1 2, 3 1 1 2, 3 1, 2, 3 1 2, 3 1 2, 3 1 2, 3 1, 2, 3 1, 2, 3 1 1 2, 3 1, 2, 3 1, 2, 3 1 2, 3 1 2, 3 1 2, 3 -1.234 -1.186 V -1.27 -1.15 -3 V V V V mV mV mV V V V V mA mA dB uV uV V V uA uA uA uA uA uA 5 MNLM2991-X REV 0D1 MICROCIRCUIT DATA SHEET Electrical Characteristics DC PARAMETERS(Continued) (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin = -10V, Vo = -3V, Io = 1A, Co = 47uF, R1 = 2.7K, Tj = 25 C SYMBOL I Limit PARAMETER Current Limit Vout = 0V CONDITIONS NOTES PINNAME MIN 1.5 1.0 MAX 2.5 4.0 UNIT A A SUBGROUPS 1 2, 3 Graphics and Diagrams GRAPHICS# 06323HRB3 06349HRA2 J16ARL P000384A P000388A WG16ARC CERDIP (J), 16 LEAD (B/I CKT) CERPACK (W), 16 LEAD (B/I CKT) CERDIP (J), 16 LEAD (P/P DWG) CERAMIC SOIC (WG), 16 LEAD (PINOUT) CERDIP (J), 16 LEAD (PINOUT) CERAMIC SOIC (WG), 16 LEAD (P/P DWG) DESCRIPTION See attached graphics following this page. 6 N/C ADJUST ON/OFF GROUND N/C N/C OUTPUT N/C 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 INPUT N/C N/C N/C N/C N/C N/C N/C LM2991WG 16 - LEAD CERAMIC SOIC CONNECTION DIAGRAM TOP VIEW P000384A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 N/C N/C INPUT ON/OFF GND OUTPUT N/C N/C 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 N/C N/C ADJ N/C N/C N/C N/C N/C LM2991J 16 - LEAD DIP CONNECTION DIAGRAM TOP VIEW P000388A MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 N MNLM2991-X REV 0D1 MICROCIRCUIT DATA SHEET Revision History Rev 0B0 ECN # Rel Date Originator Barbara Lopez Changes Changed: MNLM2991-X Rev. 0A0 to MNLM2991-X Rev. 0B0. Added power dissipation note for Aluminum Nitride package. Updated MDS: MNLM2991-X Rev. 0B0 to MNLM2991-X Rev. 0C1. Added WG package to MDS. Updated B/I CKT and Pinout for J package. Added WG package graphics. Added Package Weight to Absolute section. Update MDS: MNLM2991-X, Rev. 0C1 to MNLM2991-X, Rev. 0D1. M0001490 05/19/98 0C1 M0002862 12/15/98 Barbara Lopez 0D1 M0003138 12/15/98 Rose Malone 7 |
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