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| MOTOROLA Order this data sheet by MMBZ15VDLT1/D SEMICONDUCTOR TECHNICAL DATA 15 Volt SOT-23 Bipolar Zener Overvoltage Transient Suppressor This monolithic silicon zener device is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, business machines, communication systems, medical equipment and other applications. The convenient SOT-23 package allows for easy handling and is ideal for situations where space is at a premium. Specification Features: MMBZ15VDLT1 SOT-23 BIPOLAR ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 15 VOLT 40 WATTS PEAK POWER * Dual Package Provides for Bidirectional or Separate Unidirectional * * * * Configurations Economical SOT-23 Surface Mount Package Peak Power -- 40 Watts @ 1 ms (Bidirectional) Maximum Clamping Voltage @ Peak Pulse Current Low Leakage < 100 nA 3 1 3 2 1 2 Mechanical Characteristics: Case: Void free, transfer-molded, thermosetting plastic Finish: All external surfaces are corrosion resistant and leads are readily solderable Packaging: Available in 8 mm embossed tape and reel (3000 devices per reel) Pinout: Terminal 1 -- Anode Pinout: Terminal 2 -- Anode Pinout: Terminal 3 -- Cathode CASE 318-07 TO-236AB LOW PROFILE SOT-23 MAXIMUM RATINGS (TC = 25C Unless Otherwise Noted.) Rating Peak Power Dissipation (1) @ TA 25C Total Power Dissipation on FR-5 Board (2) @ TA = 25C Derate above 25C Total Power Dissipation on Alumina Substrate (3) @ TA = 25C Derate above 25C Operating and Storage Temperature Range (1) Nonrepetitive current pulse per Figure 5 and derate above TA = 25C per Figure 6. (2) FR-5 = 1.0 x 0.75 x 0.62 in. (3) Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Symbol Ppk PD PD TJ, Tstg Value 40 225 1.8 300 2.4 -55 to +150 Unit Watts mW mW/C mW mW/C C THERMAL CHARACTERISTICS Thermal Resistance -- Junction to Ambient Maximum Lead Temperature for Soldering Purposes (10 seconds max.) RJA TL 556 230 C/W C ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) BIDIRECTIONAL (Circuit tied to pins 1 and 2) Breakdown Voltage VBR (Volts) Min 14.3 Nom 15 Max 15.8 Working Peak Reverse Voltage VRWM (Volts) 12.8 Maximum Reverse Maximum Reverse Maximum Reverse Voltage @ IRSM Leakage Current Surge Current (Clamping Voltage) IRWM IRSM VRSM IR (nA) (Amps) (Volts) 100 1.9 21.2 Maximum Temperature Coefficient of VBR (mV/C) 12 @ IT mA 1.0 Surge current waveform per Figure 5 and derate per Figure 6. VBR measured at pulse test current IT at an ambient temperature of 25C. (c) MOTOROLA INC., 1991 17 VBR @ IT 16 VBR (V) BIDIRECTIONAL 1000 100 15 IR (nA) UNIDIRECTIONAL +25 +85 TEMPERATURE (C) +125 10 1 14 0.1 13 -40 0.01 -40 +25 +85 TEMPERATURE (C) +125 Figure 1. Typical VBR versus Temperature Figure 2. Typical Leakage Current versus Temperature 100 90 PD , POWER DISSIPATION (mW) 80 70 C, (pF) 60 50 40 30 20 10 0 0 1 BIAS (V) 12.8 BIDIRECTIONAL UNIDIRECTIONAL 300 250 ALUMINA SUBSTRATE 200 150 100 FR-5 BOARD 50 0 0 25 50 75 100 125 T, TEMPERATURE (C) 150 175 Figure 3. Typical Capacitance versus Bias Voltage Figure 4. Steady State Power Derating Curve tr 100 VALUE (%) PEAK VALUE -- IRSM PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr 10 s PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 C 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) 175 200 IRSM HALF VALUE -- 2 50 tP 00 1 2 3 t, TIME (ms) 4 Figure 5. Pulse Waveform Figure 6. Pulse Derating Curve 2 Transient Voltage Suppressors -- Surface Mounted 40 Watt Peak Power NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0180 0.0236 0.0350 0.0401 0.0830 0.0984 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.45 0.60 0.89 1.02 2.10 2.50 0.45 0.60 0.037 0.95 0.037 0.95 A L 3 STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE 0.079 2.0 0.035 0.9 0.031 0.8 inches mm B 1 2 S V G C D H K J CASE 318-07 PLASTIC (Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.) SOT-23 Footprint MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS Package Option Tape and Reel Tape and Reel Type No. Suffix T1 T3 MPQ (Units) 3K 10K (Refer to Section 10 for more information on Packaging Specifications.) 3 |
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