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MSD2714AT1
Preferred Device
VHF/UHF Transistor
NPN Silicon
http://onsemi.com MAXIMUM RATINGS
Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Symbol VCEO VCBO VEBO Max 25 30 3.0 Unit Vdc Vdc Vdc 2 BASE 1 EMITTER COLLECTOR 3
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR-5 Board TA = 25C Derate above 25C Thermal Resistance, Junction to Ambient Total Device Dissipation Alumina Substrate, TA = 25C Derate above 25C Thermal Resistance, Junction to Ambient Junction and Storage Temperature Range Symbol PD (1) Max 225 1.8 RJA PD (2) 556 300 2.4 RJA TJ, Tstg 625 -55 to +150 Unit mW mW/C C/W mW mW/C C/W C 2 1 CASE 318D SC-59 STYLE 1 3
(1) FR- 5 = 1.0 X 0.75 X 0.062 in. (2) Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina
DEVICE MARKING
14A
ORDERING INFORMATION
Device MSD2714AT1 Package SC-59 Shipping TBD
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2000
1
March, 2000 - Rev. 0
Publication Order Number: MSD2714AT1/D
MSD2714AT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector - Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) Collector - Base Breakdown Voltage (IC = 10 mAdc, IE = 0) Emitter - Base Breakdown Voltage (IE = 10 mAdc, IC = 0) Collector Cutoff Current (VCB = 35 Vdc, IE = 0) Emitter Cutoff Current (VEB = 3.5 Vdc, IC = 0) V(BR)CEO 25 V(BR)CBO 30 V(BR)EBO 3.0 ICBO -- IEBO -- -- 500 -- 500 nAdc -- -- nAdc -- -- Vdc -- -- Vdc Vdc
ON CHARACTERISTICS
DC Current Gain (IC = 1.0 mAdc, VCE = 6.0 Vdc) Base - Emitter On Voltage (IC = 4.0 mAdc, VCE = 10 Vdc) hFE 90 VBE -- -- 0.95 -- 180 Vdc --
SMALL-SIGNAL CHARACTERISTICS
Current-Gain - Bandwidth Product (IC = 4.0 mAdc, VCE = 10 Vdc, f = 100 MHz) Collector-Base Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Common-Base Feedback Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Collector Base Time Constant (IC = 4.0 mAdc, VCB = 10 Vdc, f = 31.8 MHz) fT Ccb Crb rbCc 650 -- -- -- -- -- -- -- -- 0.7 0.65 9.0 MHz pF pF ps
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MSD2714AT1
TYPICAL CHARACTERISTICS
COMMON-BASE y PARAMETERS versus FREQUENCY (VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25C) yib, INPUT ADMITTANCE
80 y ib , INPUT ADMITTANCE (mmhos) 70 60 - bib jb ib (mmhos) 50 40 30 20 10 0 100 200 300 400 500 f, FREQUENCY (MHz) 700 1000 - 50 - 60 - 20 1000 MHz - 30 - 40 700 400 200 100 gib 0 - 10
0
10
20
30
40 50 gib (mmhos)
60
70
80
Figure 1. Rectangular Form yfb, FORWARD TRANSFER ADMITTANCE
y ib , FORWARD TRANSFER ADMITTANCE (mmhos) 70 60 50 40 30 20 10 0 - 10 - 20 - 30 10 100 200 300 400 500 f, FREQUENCY (MHz) 700 1000 70 60 50 20 jb fb (mmhos) - gfb 40 bfb 50 100 60 200
Figure 2. Polar Form
400 600 700
30 1000 MHz
40
10 30 20 gfb (mmhos)
0
- 10
- 20 - 30
Figure 3. Rectangular Form
Figure 4. Polar Form
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MSD2714AT1
TYPICAL CHARACTERISTICS
COMMON-BASE y PARAMETERS versus FREQUENCY (VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25C) yrb, REVERSE TRANSFER ADMITTANCE
y rb , REVERSE TRANSFER ADMITTANCE (mmhos) 5.0 0 100 4.0 MPS H11 3.0 -brb 2.0 MPS H10 - 4.0 -grb 0 100 200 300 400 500 f, FREQUENCY (MHz) 700 1000 - 5.0 -2.0 -1.8 -1.2 -0.8 1000 MHz 0 -0.4 0.4 grb (mmhos) 0.8 1.2 1.6 2.0 -brb - 1.0 jb rb (mmhos) 200
- 2.0
400
- 3.0 700
1.0
Figure 5. Rectangular Form yob, OUTPUT ADMITTANCE
10 yob, OUTPUT ADMITTANCE (mmhos) 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 100 200 300 400 500 f, FREQUENCY (MHz) 700 1000 gob 0 0 2.0 2.0 100 bob jb ob(mmhos) 6.0 8.0 700 10
Figure 6. Polar Form
1000 MHz
4.0
400 200
4.0 6.0 gob (mmhos)
8.0
10
Figure 7. Rectangular Form
Figure 8. Polar Form
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MSD2714AT1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.037 0.95
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95
0.098-0.118 2.5-3.0 0.094 2.4 0.039 1.0 0.031 0.8
inches mm
SC-59 POWER DISSIPATION The power dissipation of the SC-59 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows:
PD = TJ(max) - TA RJA
into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 200 milliwatts.
PD = 150C - 25C = 200 milliwatts 625C/W
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values
The 625C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, a power dissipation of 400 milliwatts can be achieved using the same footprint.
SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
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MSD2714AT1
SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SC-59 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 9 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints.
STEP 1 PREHEAT ZONE 1 "RAMP" 200C
STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP"
DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C
STEP 4 STEP 5 STEP 6 STEP 7 HEATING HEATING VENT COOLING ZONES 3 & 6 ZONES 4 & 7 205 TO 219C "SOAK" "SPIKE" PEAK AT 170C SOLDER JOINT 160C
150C 100C 100C DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C 140C
SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY)
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 9. Typical Solder Heating Profile
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MSD2714AT1
PACKAGE DIMENSIONS SC-59 CASE 318D-04 ISSUE F
A L
3 2 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. DIM A B C D G H J K L S MILLIMETERS MIN MAX 2.70 3.10 1.30 1.70 1.00 1.30 0.35 0.50 1.70 2.10 0.013 0.100 0.09 0.18 0.20 0.60 1.25 1.65 2.50 3.00 INCHES MIN MAX 0.1063 0.1220 0.0512 0.0669 0.0394 0.0511 0.0138 0.0196 0.0670 0.0826 0.0005 0.0040 0.0034 0.0070 0.0079 0.0236 0.0493 0.0649 0.0985 0.1181
S
B
D G
C H K
J
STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR
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MSD2714AT1
Thermal Clad is a trademark of the Bergquist Company
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
North America Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor - European Support German Phone: (+1) 303-308-7140 (M-F 2:30pm to 5:00pm Munich Time) Email: ONlit-german@hibbertco.com French Phone: (+1) 303-308-7141 (M-F 2:30pm to 5:00pm Toulouse Time) Email: ONlit-french@hibbertco.com English Phone: (+1) 303-308-7142 (M-F 1:30pm to 5:00pm UK Time) Email: ONlit@hibbertco.com ASIA/PACIFIC: LDC for ON Semiconductor - Asia Support Phone: 303-675-2121 (Tue-Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong 800-4422-3781 Email: ONlit-asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-8549 Phone: 81-3-5487-8345 Email: r14153@onsemi.com Fax Response Line: 303-675-2167 800-344-3810 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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MSD2714AT1/D

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