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| Datasheet File OCR Text: |
| PDF: 2002 Jun 07 Philips Semiconductors Package outline LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm SOT389-1 c y X A 33 34 23 22 ZE e E HE wM bp 44 1 bp D HD wM 11 ZD B vM B vM A 12 detail X L Lp A A2 A1 pin 1 index (A 3) e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.45 0.30 c 0.20 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.2 y 0.1 Z D (1) Z E (1) 1.14 0.85 1.14 0.85 7 0o o 12.15 12.15 11.85 11.85 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT389-1 REFERENCES IEC 136E08 JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 02-06-07 |
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