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| T2550H SnubberlessTM high temperature 25 A Triacs Main features A2 Symbol IT(RMS) VDRM/VRRM IGT (Q1) Value 25 600 50 Unit A V mA G A1 A2 Description Specifically designed for use in high temperature environment (found in hot appliances such as cookers, ovens, hobs, electric heaters, coffee machines...), the new 25 A T2550H triacs provide an enhanced performance in terms of power loss and thermal dissipation. This allows for optimization of the heatsinking dimensioning, leading to space and cost effectivness when compared to electro-mechanical solutions. Based on ST snubberless technology, they offer high commutation switching capabilities and high noise immunity levels. And, thanks to their clip assembly technique, they provide a superior performance in surge current handling. Table 1. Symbol IT(RMS) ITSM I t dI/dt VDSM/VRSM IGM PG(AV) Tstg Tj A1 A2 G T0-220AB T2550H-600TRG Order code Part Number T2550H-600TRG Marking T2550H600T Absolute maximum ratings Parameter RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, Tj initial = 25 C) It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Non repetitive surge peak off-state voltage Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range F = 50 Hz F = 60 Hz tp = 10 ms F = 120 Hz tp = 10 ms tp = 20 s Tj = 150C Tj = 25C Tj = 150C Tj = 150C Tc = 125C t = 20 ms t = 16.7 ms Value 25 250 260 340 50 700 4 1 - 40 to + 150 - 40 to + 150 Unit A A A s A/s V A W C June 2006 Rev 7 1/8 www.st.com 8 Characteristics T2550H 1 Characteristics Table 2. Symbol IGT (1) VGT VGD IH (2) IL dV/dt(2) (dI/dt)c(2) Electrical Characteristics (Tj = 25C, unless otherwise specified) Test Conditions VD = 12 V RL = 33 VD = VDRM RL = 3.3 k IT = 500 mA IG = 1.2 IGT VD = 67% VDRM gate open Without snubber Tj = 150 C I - II - III Tj = 150 C Quadrant I - II - III I - II - III I - II - III MAX. MAX. MIN. MAX. MAX. MIN. MIN. Value 50 1.3 0.15 75 90 500 11.1 Unit mA V V mA mA V/s A/ms Tj = 150 C 1. minimum IGT is guaranted at 10% of IGT max. 2. for both polarities of A2 referenced to A1. Table 3. Symbol VT (1) Vto (1) Static Characteristics Test Conditions ITM = 35 A tp = 380 s Tj = 25C Tj = 150C Tj = 150C Tj = 25C Tj = 150C Tj = 150C MAX. MAX. MAX. MAX. Value 1.5 0.80 19 5 8.5 mA 5.5 Unit V V m A Threshold voltage Dynamic resistance VDRM = VRRM VDRM/VRRM = 400 V (at mains peak voltage) Rd (1) IDRM IRRM 1. for both polarities of A2 referenced to A1. Table 4. Symbol Rth(j-c) Thermal resistance Parameter Junction to case (AC) Value 0.8 Unit C/W 2/8 T2550H Characteristics Figure 1. Maximum power dissipation versus Figure 2. RMS on-state current (full cycle) 30 25 20 15 RMS on-state current versus case temperature (full cycle) P(W) 35 30 25 20 15 10 5 10 5 IT(RMS)(A) IT(RMS)(A) 0 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 22.5 25.0 0 0 25 50 TC(C) 75 100 125 150 Figure 3. Relative variation of thermal impedance versus pulse duration Figure 4. On-state characteristics (maximum values) K=[Zth/Rth] 1.00 Zth(j-c) ITM(A) 300 Tj max. Vt0 = 0.80V Rd = 19 m 100 Tj = Tj max. 0.10 Zth(j-a) 10 Tj = 25C. tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 1 0.0 0.5 1.0 1.5 2.0 VTM(V) 2.5 3.0 3.5 4.0 4.5 5.0 Figure 5. Surge peak on-state current versus Figure 6. number of cycles Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t ITSM(A) 300 250 t=20ms 10000 ITSM(A), I2t (A2s) Tj initial=25 C dI/dt limitation: 50 A/s 200 150 100 50 Repetitive TC=125C Non repetitive Tj initial=25C One cycle 1000 ITSM It Number of cycles 0 1 10 100 1000 tp(ms) 100 0.01 0.10 1.00 10.00 3/8 Characteristics T2550H Figure 7. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) Figure 8. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C] 2.5 (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 1.6 2.0 IGT 1.4 1.5 IH & IL 1.2 1.0 1.0 0.5 0.8 Tj(C) 0.0 -40 -20 0 20 40 60 80 100 120 140 160 (dV/dt)c (V/s) 0.6 0.1 1.0 10.0 100.0 Figure 9. Relative variation of critical rate of decrease of main current versus junction temperature Figure 10. Leakage current versus junction temperature for different values of blocking voltage (typical values) IDRM / IRRM (mA) 1E+1 (dI/dt)c [Tj] / (dI/dt)c [Tj = 150C] 8 7 6 5 1E+0 VD = VR = 600V VD = VR = 400V 4 3 2 1 0 25 50 75 1E-1 VD = VR = 200V 1E-2 Tj(C) 100 125 150 Tj(C) 1E-3 50 75 100 125 150 Figure 11. Acceptable repetitive peak off-state voltage versus case-ambient thermal resistance Rth(c-a)(C/W) 10 9 8 7 6 5 4 3 2 1 0 300 Rth(j-c)=0.8 C/W TJ=150 C VDRM / VRRM (V) 350 400 450 500 550 600 4/8 T2550H Ordering information scheme 2 Ordering information scheme T 25 50 H - 600 Triac series Current 25 = 25A Sensitivity 50 = 50mA Temperature H = High Voltage 600 = 600V Package T = TO-220AB Packing mode RG = Tube T RG 5/8 Package information T2550H 3 Package information Table 5. TO-220AB Dimensions Dimensions Ref. Millimeters Min. A a1 B OI L F A I4 l3 a1 l2 c2 b2 C Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.90 0.598 a2 B b1 b2 C c1 c2 14.00 0.511 10.40 0.393 0.88 0.024 1.32 0.048 4.60 0.173 0.70 0.019 2.72 0.094 2.70 0.094 6.60 0.244 3.85 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 a2 e M F c1 b1 e OI I4 L l2 l3 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 0.104 1.70 0.044 1.70 0.044 0.102 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 T2550H Ordering information 4 Ordering information Ordering type T2550H-600TRG Marking T2550H600T Package TO-220AB Weight 2.3 g Base qty Delivery mode 50 Tube 5 Revision history Date Apr-2002 13-Feb-2006 20-Jun-2006 Revision 5A 6 7 Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Reformatted to current standards. Figures 6 and 11 replaced. Changes 7/8 T2550H Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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