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RF5125
3V TO 5V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER
RoHS Compliant & Pb-Free Product Package Style: QFN, 16-Pin, 3 x 3
VCC
VC1
NC
16 NC 1
15
14
13 12 RF OUT/ VC2
Features
Single Power Supply 3.0V to 5.0V +21dBm, <4.0%EVM, 185mA@VCC =3.3V 28dB Typical Small Signal Gain 50 Input and Interstage Matching 2400MHz to 2500MHz Frequency Range +23dBm, <4%EVM, 250mA@VCC =5.0V
NC 4 5 NC 6 VREG1 7 VREG2 8 PDTECT RF IN 3 RF IN 2
NC
11 RF OUT
Input Match
Interstage Match
10 RF OUT
Bias Circuit
Power Detector 9 NC
Applications
IEEE802.11b/g/n WLAN Applications 2.5GHz ISM Band Applications Commercial and Consumer Systems Portable Battery-Powered Equipment Spread-Spectrum and MMDS Systems
Functional Block Diagram
Product Description
The RF5125 is a linear, medium-power, high-efficiency, two-stage amplifier IC designed specifically for battery-powered WLAN applications such as PC cards, mini PCI, and compact flash applications. The device is manufactured on an advanced InGaP Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in 2.5GHz OFDM and other spreadspectrum transmitters. The device is provided in a 3mmx3mm, 16-pin, QFN with a backside ground. The RF5125 is designed to maintain linearity over a wide range of supply voltage and power output.
Ordering Information
RF5125 RF5125PCBA-41X 3V to 5V, 2.4GHz to 2.5GHz Linear Power Amplifier Fully Assembled Evaluation Board
Optimum Technology Matching(R) Applied
GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT
RF MICRO DEVICES(R), RFMD(R), Optimum Technology Matching(R), Enabling Wireless ConnectivityTM, PowerStar(R), POLARISTM TOTAL RADIOTM and UltimateBlueTM are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. (c)2006, RF Micro Devices, Inc.
Rev A23 DS070515
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RF5125
Absolute Maximum Ratings Parameter
Supply Voltage Power Control Voltage (VREG) DC Supply Current Input RF Power Operating Ambient Temperature Storage Temperature Moisture Sensitivity
Rating
-0.5 to +6.0 -0.5 to 3.5 600 +5 -30 to +85 -40 to +150 JEDEC Level 2
Unit
VDC V mA dBm C C
Caution! ESD sensitive device.
The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. RoHS status based on EUDirective2002/95/EC (at time of this document revision).
Parameter
Overall 54Mbps OFDM Signal
Frequency Range Maximum Linear Output Power VCC =3.3V VCC =5.0V EVM Gain Input Impedance Output VSWR
Min.
Specification Typ.
Max.
Unit
Condition
T=+25C, VCC =3.3V, VREG =2.8V, Freq=2450MHz, circuit per evaluation board schematic.
2400 to 2500
MHz With 802.11g modulation (54Mbit/s) meeting 802.11g spectral mask.
20.0 22.0 2.0 2.0 26 49
21.0 23.0 3.0 3.5 29 50
22.0 24.0 4.0 4.0 33 51 10:1
dBm dBm % % dB POUT =+21dBm, 54M OFDM, VCC =3.3VDC POUT =+23dBm, 54M OFDM, VCC =5.0VDC POUT =+21dBm, 54M OFDM, VCC =3.3VDC Internally Matched Input and Interstage No spurs above -43dBm VDC VDC V VCC =3.3V VCC =3.3V VCC =5.0V 5V operation requires output match revision
Power Detector (P_detect)
POUT =8dBm POUT =21dBm POUT =23dBm 0.2 0.85 0.22 1.05 1.3 3.0 2.7 170 3.3 2.8 185 250 Quiescent Current Leakage Current VREG (Bias) Current (Total) 10 1 1 95 25 2 2 150 5 6 mA nA mA mA 3.6 3.0 220 0.25 1.2
Power Supply
Operating Voltage VREG (Bias) Voltage (VREG1, VREG2) Current Consumption VDC VDC mA RF POUT =+21dBm, VCC =3.3V, 54Mbps OFDM RF POUT =+23dBm, VCC =5.0V, 54Mbps OFDM RF=OFF VCC =+3.3VDC; RF In=OFF; VREG OFF VCC =3.3V VCC =5.0V
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Rev A23 DS070515
RF5125
Pin 1 2 Function NC RF IN Description
Not connected. May be connected to ground (GND). RF input. See evaluation board schematic for details.
VCC INTERSTAGE MATCH INPUT MATCH
Interface Schematic
3 4 5 6 7 8 9 10
RF IN NC NC VREG1 VREG2 PDETECT (or N/C*) NC RF OUT
RF input. See evaluation board schematic for details. Not connected. May be connected to ground (GND). Do not connect. Note: VCC voltage may be applied to this pin without damage to, or affecting the performance of, the RF5125. Bias current control voltage for the first stage. Bias current control voltage for the second stage. The VREG2 pin may be connected to VREG1 through an external resistor bridge. Provides an output voltage proportional to the output RF level. *In applications where the PDETECT function is not desired, this pin may be left unconnected. No-connect. RF output.
See pin 2.
RF OUT
BIAS
11 12 13 14 15 16 Pkg Base
RF OUT RF OUT/ VC2 NC VC1 NC VCC GND
Same as pin 10. Power supply for second stage amplifier. Connect as shown on evaluation board schematic. Not connected. May be connected to ground (GND). Power supply for first stage amplifier. Connect as shown on evaluation board schematic. Not connected. May be connected to ground (GND). Supply voltage for the bias reference and control circuits. May be connected with VC1 and VC2 (single-supply voltage). The center metal base of the QFN package provides DC and RF ground as well as heat sink for the amplifier.
See pin 10.
Rev A23 DS070515
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5125
Package Drawing
0.10 C A -A0.05 C
2 PLCS
3.00
1.50 TYP
2 PLCS
0.90 0.85 0.70 0.65
0.10 C B
0.05 0.00
3.00 12 MAX
2 PLCS
0.10 C B
-B-
1.37 TYP
2 PLCS
-C-
SEATING PLANE
2.75 SQ
0.10 M C A B
0.10 C A
0.60 0.24 TYP
0.30 0.18 PIN 1 ID R.20
1.65 SQ. 1.35 0.50 0.30
Dimensions in mm.
Shaded lead is pin 1.
0.50
Pin Out
VCC VC1 NC NC 13
16
15
14
NC 1
12 RF OUT/VC2
RF IN 2
11 RF OUT
RF IN 3
10 RF OUT
NC 4
9 NC
5 NC
6 VREG1
7 VREG2
8 PDETECT
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Rev A23 DS070515
RF5125
Theory of Operation and Application Information
The RF5125 is a two-stage (2-stage) power amplifier (PA) with a minimum gain of 26dB (29dB typical) in the 2.4GHz to 2.5GHz Industrial, Scientific, and Medical (ISM) band. The RF5125 has a 50 internal input and interstage match. Only the RF5125 output stage requires matching. The RF5125 is designed primarily for IEEE802.11g/n wireless local area network (WLAN) applications where the available supply voltage and current are limited. This amplifier will operate to and below the lowest expected voltage made available by a typical PC Card (PCMCIA or CardBus) slot in a laptop personal computer (PC). The RF5125 maintains required linearity at decreased supply voltages. The RF5125 operates from a single supply voltage of 3.0VDC to 5.0VDC to deliver specified performance. Power control is provided through two (2) bias control input pins (VREG1 and VREG2). For the best performance and lower current, there is a 68 resistor placed as R2. In most applications these two (2) bias control input pins are connected together (before R1 and R2) and employed as a single control input. There is no required matching on the RF5125 input or interstage circuits. Only the RF5125 output stage requires matching allowing the RF5125 to be implemented in applications requiring the fewest end product bill of materials (BOM) parts count and lowest BOM cost. In most cases the capacitor used as part of the RF5125 output matching circuit is also employed to accomplish DC-blocking. The RF5125PCBA evaluation board (available from RF Micro Devices, Inc. (RFMD)) is optimized for 3.3VDC supply input. For best results, the RF5125PCBA evaluation board circuit layout should be copied as closely as possible. In particular, the RF5125PCBA evaluation board ground layout, ground vias, and output matching components and location should be copied without deviation. Other PCB layout configurations may provide acceptable RF5125 performance; however, the end product design process will be faster and manufacturing first time yield (FTY) better if the RF5125PCBA evaluation board design is followed. RFMD provides RF5125PCBA design and Gerber files upon request. Though not difficult to implement to achieve state-of the-art performance, the RF5125 is employed at frequencies greater than 2GHz, where care in circuit layout and component selection is advisable. Of primary concern with RF5125 PCB layout is the selection and placement of output matching components (RF5125PCBA bill of materials (BOM) is available upon request). High-Q (quality factor) capacitors and inductors are not required in every RF5125 based design; however, it is highly recommended that the RF5125PCBA evaluation board BOM be followed exactly for all initial end product designs. Upon initial baseline of RF5125 based PCB performance, less costly (Lower-Q) output matching circuit components may be substituted and evaluated against the initial design performance. RFMD experience indicates that end product FTY improvements more than offset the cost difference between "High-Q" and "Low-Q" components. The output matching capacitor is C10 (or C11) which is connected between the RF5125 and the connector J2 (RFOUT) as shown on the RF5125PCBA Evaluation Board Schematic. This capacitor is selected in value and positioned with reference to the 50 transmission line. This matching capacitor is a single 2.2pF shunt capacitor whose placement depends on the supply voltage applied. With the nominal 3.0VDC to 3.6VDC supply voltage, the distance of the transmission line should be 115mils (this is marked as the placement for C10). For a supply voltage of 5V, the length of the transmission line should be 101mils (which is marked as the placement for C11). Notice, only one of the shunt output capacitors is placed at one time (C10 or C11). The transmission line length and thickness should be duplicated as closely as possible in any customer PCB layout. Due to PCB material variation (e.g., FR4) and PCB manufacturing variations, the customer may benefit from small adjustments made to the length of the transmission line when the RF5125PCBA evaluation board is duplicated to produce an end product PCB design. The initial PCB layout should include exposed ground area near C10 or C11 to allow ease of RF5125 output circuit optimization; Smith Chart-based design tools may be used to assist in determining the desired capacitor value and transmission line physical characteristics. Note that the use of a single capacitor output circuit match results in a more sensitive match and slightly reduced RF5125 bandwidth. In this configuration, the RF5125 will exhibit sufficient output spectrum bandwidth to meet IEEE802.11b/g requirements when matched properly.
Rev A23 DS070515
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5125
The RF5125 had been primarily characterized with a VREG voltage of 2.8VDC. However, the RF5125 will operate from a wide range of bias control voltages and within a wide range of frequencies (typically 1800MHz to 2800MHz). If a bias control voltage other than 2.8VDC is preferred or if a different frequency range (other than 2.4GHz to 2.5GHz) is desired, please contact RFMD Sales or Applications Engineering for assistance.
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Rev A23 DS070515
RF5125
Evaluation Board Schematic
VCC 27 C6 1 F C1 1 nF L1 7.5 nH C7 1 F P2-3 P2-4
1 1
P2 P2-1 1 2 3 4 HDR_1x4 PDETECT GND VREG2 VREG1
16
1
15
14
13 12
L2 6.8 nH
Coilcraft TL = 101 mils (50 ) from IC TL = 115 mils (50 ) from IC
1
TL J1 RF IN 50 strip 2 11 C11 3
1
3
TL C10
2
see note
see note
C12 10 pF
50 strip
J2 RF OUT
10
4 5 6 7 8 C3 1 nF
9
5125400, r.-
C2 1 nF
PDETECT C9 330 pF P1 P1-1 C8 4.7 F P3-1 1 2 P3 1 P4 1 VCC GND
R1 0
R3*
R2 68
1
Notes: 1. Pins 1, 4, 13, and 15 may be left as No Connect. R3 may be used to connect the VREGS with a 0 resistor. 2. For VCC = 3.3 VDC operation, C10 is to be populated with a 2.2 pF capacitor, 101 mils from the IC. C11 not populated. 3. For VCC = 5.0 VDC operation, C11 is to be populated with a 2.2 pF capacitor, 115 mils from the IC. C10 not populated.
VCC GND
VREG1
VREG2
VCC (VDC) C10 (pF) C11 (pF) 3.3 2.2 DNP 5.0 DNP 2.2
Rev A23 DS070515
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5125
Evaluation Board Layout Board Size 2.0" x 2.0"
Board Thickness 0.031", Board Material FR-4, Multi-Layer
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Rev A23 DS070515
RF5125
RF Power Spectrum @ +21 dBm 11 Mbps CCK Modulation
(V CC = +3.3 V DC ; V REG = +2.8 V DC; Frequency = 2.45 GHz)
* RBW * VBW * SWT 100 kHz 100 kHz 300 ms CH PWR ACP Low ACP Up ALT1 Low ALT1 Up 21.06 -39.70 -38.81 -55.52 -57.00 dBm dB dB dB dB
ACP versus POUT
-20.0 -25.0
A
Ref 20 10
1 RM * CLRWB
20.3 dBm Offset 5.3 dB
* Att
10 dB
-30.0
LVL
ACP1 2400MHz ACP1 2450MHz ACP1 2500MHz 2400MHz ACP2 2450MHz ACP2 2500MHz ACP2
0
-35.0
-10
-20
ACP (dBm)
2.45 GHz 6.653384837 MHz/ Span 66.53384837 MHz
-40.0 -45.0 -50.0 -55.0
-30
-40
-50
-60.0
-60
-70
-65.0 -70.0
Center
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
Output Power (dBm)
Date: 31.JAN.2005 21:01:52
EVM versus POUT
9.0 8.0 7.0 6.0
Operating Current versus POUT
0.25
0.20
EVM (%)
0.15
4.0 3.0 2.0 2400MHz 1.0 0.0 0.0 5.0 10.0 15.0 20.0 25.0 2450MHz 2500MHz
ICC (A)
0.10 0.05 2400MHz 2450MHz 2500MHz 0.00 0.00 5.00 10.00 15.00 20.00 25.00
5.0
Output Power (dBm)
Output Power (dBm)
PDETECT versus POUT
1.6
1.4
1.2
1.0
PDETECT (V)
0.8
0.6
0.4 2400MHz 2450MHz 2500MHz 0.0 5.0 10.0 15.0 20.0 25.0
0.2
0.0
Output Power (dBm)
Rev A23 DS070515
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5125
PCB Design Requirements
PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ. B = 0.28 x 0.64 (mm) Typ. C = 1.50 (mm) Sq.
Dimensions in mm.
1.50 Typ. 0.50 Typ.
Pin 16
B
Pin 1
B
B
B
Pin 12
A 0.50 Typ. A C A A 0.55 Typ. B B B B
A A A A 0.75 Typ. 1.50 Typ.
Pin 8
0.55 Typ. 0.75 Typ.
Figure 1. PCB Metal Land Pattern (Top View)
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Rev A23 DS070515
RF5125
PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 0.74 x 0.38 (mm) Typ. B = 0.38 x 0.74 (mm) Typ. C = 1.60 (mm) Sq.
Dimensions in mm.
0.50 Typ.
Pin 16
1.50 Typ.
B
Pin 1
B
B
B
Pin 12
0.50 Typ.
A A C A
A A A A B B B B
Pin 8
0.75 Typ.
1.50 Typ.
0.55 Typ. 0.55 Typ.
A
0.75 Typ.
Figure 2. PCB Solder Mask Pattern (Top View) Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
Rev A23 DS070515
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5125
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Rev A23 DS070515

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