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MicroStar BGAt Packaging Reference Guide
Literature Number: SSYZ015A Second Edition - September 1999
MicroStar BGA is a trademark of Texas Instruments Incorporated.
Printed on Recycled Paper
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright (c) 1999, Texas Instruments Incorporated
Introduction
The parallel pursuit of cost reduction and miniaturization in recent years has given rise to an increasing emphasis on very small integrated circuit (IC) package solutions. This is particularly evident in consumer-based end Figure 1. Packaging Trends
Package trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid array) 1.27 mm ball pitch
equipment using digital signal processor (DSP) solutions such as wireless telephones, laptop computers, and hard-disk drives. Despite the formal definition, packages with an area similar in size to the IC they encapsulate are loosely referred to as chip scale packages (CSPs). Figure 1 illustrates this trend.
Fine pitch requirement
QFP 0.4 mm pitch
* Infra. issue (KGD) * Soldering difficulties
CSP (chip scale pkg.) solution Fine pitch BGA (0.5, 0.8, 1.0 mm ball pitch)
Bare chip (flip chip) QFP-0.5 QFP-0.4 Package size
* PWB/ASSY cost up
BGA
CSP
Bare chip (bump) Pin count
Chip scale packages are in many ways an ideal solution to the cost reduction and miniaturization requirements. They offer enormous area reductions in comparison to quad flat packages (QFPs) and have increasing potential to do so without adding to system-level cost. In the best case, CSPs compete today on a cost-per-terminal basis with QFPs. For example, various CSPs from Texas Instruments (TIt) are now available at cost parity with thin QFPs. Texas Instruments produces a polyimide film-based family of CSPs called MicroStar BGAt. Like most other CSPs, MicroStar BGAs use solder alloy balls as the interconnect between the package substrate and the board on which the package is soldered. The MicroStar BGA family comes in a range of solder ball pitch (0.5 mm, 0.8 mm, and 1.0 mm). Currently, TI's most popular packages are 64- and 144-ball packages. Figure 2 shows the structure of TI's MicroStar BGA package.
Figure 2. Structure of TI's MicroStar BGA
Conforms to JEDEC Outlines: MO-192 and MO-205-A Encapsulant 0.8 mm pitch Chip (11 mils) Wire bond Die paste
PWB Cu pattern (30 m line/ 40 m space) Flex substrate (polyimide) (Single electrical layer)
Via (0.375 mm DIA.)
0.5 mm DIA./0.8 mm ball pitch Sn/Pb: near eutectic
TI and MicroStar BGA are trademarks of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
iii
Texas Instruments addressed several key issues in package assembly in order to produce a CSP that is not only physically and mechanically stable but cost-effective for a wide variety of applications. Figure 3 demonstrates how MicroStar BGAs resolve reliability and cost issues. An overall view of the flow used to produce TI MicroStar BGA packages is shown in Figure 4. The process for solder ball attachment is shown in Figure 5. Figure 3. MicroStar BGA Package Assembly Issues
Substrate selection - Ceramic - Glass-epoxy - Polyimide
Figure 4. MicroStar BGA Package Assembly Flow
Same as QFP assembly
Die attach
Wire bond
Encap
Non-Ag paste
Short loop
X'fer mode
BGA unique process
Ball attach
Transducer Solder wire Capillary Orifice
IR reflow
Flux wash
Interconnection
- Bump (flip chip) - Wire bond
Molten solder
0.30 mm DIA.
Ultrasonic clean
Solder ball form
- Solder jet - Stud bump - Paste print - Pick and place Vacuum Laser symbol and singulation Test
Printing mask Solder paste
Encapsulation
- Potting - Transfer mold
Tray These are the processes used by TI.
Figure 5. Solder Ball Attachment
Solder ball attach Squeegee Printing mask Solder paste Pick and place Vacuum
Substrate Ball pads (via) Solder paste print
Solder ball Solder ball attach (12 mil DIA.)
Solder ball shear tests SS 125 125 Fail 0 0 Ave. Reading 668 g 734 g
144GGU, 0.8-mm pitch, 0.5 mm DIA. ball TI spec. is 400 g min
Texas Instruments has qualified many product lines using the MicroStar BGA packages, and has now shipped more than 70 million production units. This guide is designed to give you technical background on MicroStar BGA packages as well as how they can be used to build advanced board layouts.
iv
If you would like more information on using reliable and cost-effective MicroStar BGA packaging in your design, please contact your local TI field sales office.
MicroStar BGA Packaging Reference Guide
Contents
1 PCB Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Land Areas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conductor Width/Spacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High-Density Routing Techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Via Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conventional PCB Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Advanced Design Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Daisy-Chained Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reliability Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reliability Calculations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Surface-Mounting MicroStar BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . Design for Manufacturability (DFM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Ball Collapse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Packing and Shipping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tape-and-Reel Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tape Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Device Insertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Sockets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The Design Challenge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contacting the Ball . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Establishing Contact Force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conclusions and Future Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1-2 1-2 1-3 1-3 1-4 1-4 2-1 2-2 2-2 2-4 2-6 2-6 2-6 3-1 3-2 3-2 3-3 3-3 3-4 4-1 4-2 4-4 4-4 4-5 4-5 5-1 5-2 5-2 5-3 5-3
6 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 Appendix A Frequently Asked Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1 Package Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1 Assembly Questions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2 Appendix B Package Data Sheets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1 80GJK (Pitch = 0.5 mm; Size = 6 x 6 mm) . . . . . . . . . . . . . . . . . . . . . B-2 167GJJ (Pitch = 0.5 mm; Size = 8 x 8 mm) . . . . . . . . . . . . . . . . . . . . . B-3 151GHZ (Pitch = 0.5 mm; Size = 10 x 10 mm) . . . . . . . . . . . . . . . . . . . B-4 100GGM (Pitch = 0.8 mm; Size = 10 x 10 mm) . . . . . . . . . . . . . . . . . . . B-5 64GGV (Pitch = 0.8 mm; Size = 8 x 8 mm) . . . . . . . . . . . . . . . . . . . . . B-6 80GGM (Pitch = 0.8 mm; Size = 10 x 10 mm) . . . . . . . . . . . . . . . . . . . B-7 100GGF (Pitch = 0.5 mm; Size = 10 x 10 mm) . . . . . . . . . . . . . . . . . . . B-8 100GGT (Pitch = 0.8 mm; Size = 11 x 11 mm) . . . . . . . . . . . . . . . . . . . B-9 144GGU (Pitch = 0.8 mm; Size = 12 x 12 mm) . . . . . . . . . . . . . . . . . B-10 179GHH (Pitch = 0.8 mm; Size = 12 x 12 mm) . . . . . . . . . . . . . . . . . . B-11 176GGW (Pitch = 0.8 mm; Size = 15 x 15 mm) . . . . . . . . . . . . . . . . . B-12 208GGW (Pitch = 0.8 mm; Size = 15 x 15 mm) . . . . . . . . . . . . . . . . . B-13 240GGW (Pitch = 0.8 mm; Size = 15 x 15 mm) . . . . . . . . . . . . . . . . . B-14 196GHC (Pitch = 1.0 mm; Size = 15 x 15 mm) . . . . . . . . . . . . . . . . . B-15 257GHK (Pitch = 0.8 mm; Size = 16 x 16 mm) . . . . . . . . . . . . . . . . . B-16 257GJG (Pitch = 0.8 mm; Size = 16 x 16 mm) . . . . . . . . . . . . . . . . . B-17
MicroStar BGA Packaging Reference Guide
v
List of Figures
Figure 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Page Packaging Trends . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Structure of TI's MicroStar BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii MicroStar BGA Package Assembly Issues . . . . . . . . . . . . . . . . . . . . . . . . . . . iv MicroStar BGA Package Assembly Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iv Solder Ball Attachment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iv Package Via to Board Land Area Configuration . . . . . . . . . . . . . . . . . . . . . 1-2 Effects of Via-to-Land Ratios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Optimum Land Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 PCB Design Considerations (Conventional) . . . . . . . . . . . . . . . . . . . . . . . . 1-3 Microvia Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 "Dog Bone Via" Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 Buried Vias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 Daisy-Chained Pinout List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 General Net List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 PCB Layout for Daisy-Chained Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Daisy-Chain Test Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Board-Level Reliability Test Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Board-Level Reliability Test Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Thermal Modeling Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 Electrical Modeling Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 Solder Ball Collapse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Ideal Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Shipping Tray Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Packing Method for Trays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Single Sprocket Tape Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 Tape-and-Reel Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 Approaches for Contacting the Solder Ball . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Pinch Contact for Solder Balls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Contact Area on Solder Ball . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 Witness Marks on Solder Ball . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 Effect of Burn-in on Probe Marks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 TI's Strategic Package Line-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
List of Tables
Table 1 2 3 4 5 6 7 8
vi
Page Package-Level Reliability Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Package-Level Reliability Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Board-Level Reliability Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Summary of Significant BLR Improvements . . . . . . . . . . . . . . . . . . . . . . . . 2-5 Effects of Pad Size and Board Thickness on Fatigue Life . . . . . . . . . . . . 2-5 Number of Units per Shipping Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Tape Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
MicroStar BGA Packaging Reference Guide
1
PCB Design Considerations
MicroStar BGA Packaging Reference Guide
1-1
PCB Design Considerations
Solder Land Areas
PCB Design Considerations
Design of both the MicroStar BGA itself and the printed circuit board (PCB) are important in achieving good manufacturability and optimum reliability. In particular, the diameters of the package vias and the board lands are critical. While the actual sizes of these dimensions are important, their ratio is more critical. Figure 6 illustrates the package via-to-PCB configuration and Figure 7 illustrates why this ratio is critical. Figure 6. Package Via to Board Land Area Configuration
MicroStar BGA package
Solder lands on the PCB are generally simple round pads. Solder lands are either solder-mask-defined or non-solder-mask-defined. Figure 8. Optimum Land Configurations
Solder-mask-defined Land
X Y
Ball Pitch 0.5 mm 0.8 mm 1.00 mm
X DIA. Y DIA. (In development) 0.38 mm 0.48 mm 0.45 mm 0.55 mm
Non-solder-mask-defined Land
X Y
Ball Pitch 0.5 mm 0.8 mm 1.0 mm
X DIA. Y DIA. (In development) 0.35 mm 0.50 mm 0.4 mm 0.55 mm
Land on PCB
Package ball via PCB
A B
(Not to scale) A = Via diameter on package B = Land diameter on PCB Ratio A/B should equal 1.0 for optimum reliability.
Figure 7. Effects of Via-to-Land Ratios
Solder-mask-defined (SMD) land. With this method, the copper pad is made larger than the desired land area, and the opening size is defined by the opening in the solder mask material. The advantages normally associated with this technique include more closely controlled size and better copper adhesion to the laminate. Better size control is the result of photoimaging the stencils for masks. The chief disadvantage of this method is that the larger copper spot can make routing more difficult. Non-solder-mask-defined (NSMD) land. Here, the land area is etched inside the solder mask area. While the size control is dependent on copper etching and is not as accurate as the solder mask method, the overall pattern registration is dependent on the copper artwork, which is quite accurate. The tradeoff is between accurate dot placement and accurate dot size. See Figure 8 for an example of optimum land diameters and configurations for a common MicroStar BGA pitch.
Package
PCB Package
PCB Package
Conductor Width/Spacing
Many of today's circuit board layouts are based on at most a 100-m conductor line width and 200-m spacing. To route between 0.8-mm-pitch balls, given a clearance of roughly 380 m between ball lands, only one signal can be routed between ball pads. The 380-m ball spacing is worst case and is calculated by assuming the diameter of the solder ball land is 410 m. Figure 9 presents some design considerations based on commonly used PCB design rules. Conventionally, the pads are connected by wide copper traces to other devices or to plated through holes (PTH). As a rule, the mounting pads must be isolated from the PTH. Placing the PTH interstitially to the land pads often achieves this.
MicroStar BGA Packaging Reference Guide
PCB
In the top view of Figure 7, the package via is larger than the PCB via, and the solder ball is prone to crack prematurely at the PCB interface. In the middle view, the PCB via is larger than the package via, which leads to cracks at the package surface. In the bottom view, where the ratio is almost 1:1, the stresses are equalized and neither site is more susceptible to cracking than the other.
1-2
PCB Design Considerations
Figure 9. PCB Design Considerations (Conventional)
(Not to scale) 0.8 mm pitch 1.0 mm pitch
PCB Design Considerations
0.125 mm line
0.50 mm DIA. solder mask opening
0.125 mm line
0.55 mm DIA. solder mask opening
0.350 mm DIA. pad NSMD pads
0.254 mm DIA. hole
0.400 mm DIA. pad NSMD pads
0.254 mm DIA. hole
0.100 mm line
0.125 mm line
0.375 mm DIA. solder mask opening
0.450 mm DIA. solder mask opening
0.480 mm DIA. pad SMD pads
0.550 mm DIA. pad SMD pads
High-Density Routing Techniques
A challenge when designing with CSP packages is that as available space contracts, the space available for signal fanout also decreases. By using a few high-density routing techniques, the PCB designer can minimize many of these design and manufacturing challenges. This section focuses on TI designators GGU (144-pin) and GGW (176-pin) packages. Both packages have 0.8-mm pitch, but each is distinctly different in array style. The GGW ball array has wide channels in the four corners, providing the inner balls with space for routing and VCC connectivity. Mechanical drawings of these MicroStar BGA packages can be found in Appendix B. The GGU package has a solid four-row array configuration which can cause difficulties when routing inner rows on two-layer boards.
Figure 10.
Microvia Structure
Via Density
Via density, as mentioned earlier, can be a limiting factor when designing high-density boards. Via density is defined as the number of vias in a particular board area. Using smaller vias increases the routability of the board by requiring less board space and increasing via density. The invention of the microvia, shown in Figure 10, has solved many of the problems associated with via density.
MicroStar BGA Packaging Reference Guide
Microvias are often created using a laser to penetrate the first few layers of dielectric. The laser can penetrate a 4-mil-thick dielectric layer, creating the 4-m microvia shown in Figure 10. The layout designer can now route to the first internal board layer. Two layers (each 4 mils thick) can be laser-drilled, creating a 200-m microvia diameter. In this case, routing to the first two internal layers is possible. The number of board layers increases as board chip density and functional pin count increase. As an example, the TMS320VC549GGU digital signal processor (DSP) is in a 144-GGU package and uses 32 balls for power and ground. Routing of roughly
1-3
PCB Design Considerations
PCB Design Considerations
112 signals can be accomplished on three layers. The power and ground planes increase the board to five layers. The sixth layer can be used on the bottom side to place discrete components. Furthermore, by increasing the board layer stack-up to eight layers, high-density applications are possible with only 10 to 15 mils between the chips.
Advanced Design Methods
Another option is to use a combination of blind and buried vias. Blind vias connect either the top or bottom side of the board to inner layers. Buried vias usually connect only the inner layers. Figure 12 illustrates this method using 4-mil laser-drilled microvias in the center of the pads and burying the dog bone on layer 2. Since the buried via does not extend through the underside of the board, the designer can use another set of laser-drilled blind microvias, if needed, to connect the bypass capacitors and other discrete components to the bottom side. More information on these advanced techniques is available by contacting your local TI field sales office. Figure 12. Buried Vias
Conventional PCB Design
The relatively large via density on the package periphery, mentioned earlier, is caused by limited options when routing the signal from the ball. To reduce or eliminate the via density problem on the periphery of the package, designers can build the PCB vertically from the BGA pad through the internal layers of the board, as shown in Figure 11. By working vertically and mechanical drilling 250-m vias between the pads on the board and the internal layers, designers can create a "pick-and-choose" method. They can pick the layer and choose the route. A "dog bone" method is used to connect the through-hole via and the pad. This method requires a very small mechanical drill to create the necessary number of 144 or 176 vias for one package. Although this method is the least expensive, a disadvantage is that the vias go through the board, creating a matrix of vias on the bottom side of the board. Figure 11. "Dog Bone Via" Structure
Top side view Cross-sectional view
Solder wicks into blind via filling void
Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Layer 6
Micro blind vias
Layer 1 Layer 2 Layer 3 Layer 4 Layer 5 Layer 6
10-mil through-hole buried via
4-mil laser-drilled microvia may be required to connect discretes on bottom side of board
1-4
MicroStar BGA Packaging Reference Guide
2
Reliability
MicroStar BGA Packaging Reference Guide
2-1
Reliability
Reliability
Daisy-Chained Units
Daisy-chained units are used to gain experience in the handling and mounting of CSPs, for board-reliability testing, to check PCB electrical layouts, and to confirm the accuracy of the mounting equipment. To facilitate this, Texas Instruments offers daisy-chained units in all production MicroStar BGA packages. Each daisy-chained pinout differs slightly depending on package layout. An example is shown in Figure 13. Daisy-chained packages are wired to provide a continuous path through the package for easy testing. TI issues a net list for each package, which correlates each ball position with a corresponding wire pad number. The daisy-chained net list is a special case of the general net list shown in Figure 14. Package net lists and daisy-chained net lists for all production packages are included in Appendix B. A PCB layout for a 144-GGU daisy-chained package is shown in Figure 15. When a daisy-chained package is assembled on the PCB, a complete circuit is formed, which allows continuity testing. The circuit includes the solder balls, the metal pattern on the die, the bond wires, and the PCB traces. The entire package or only a quadrant can be interconnected and tested. A diagram of the test configuration is shown in Figure 16.
Reliability Data
Reliability is one of the first questions designers ask about any new packaging technology. They want to know how well the package will survive handling and assembly operation, and how long it will last on the board. The elements of package reliability and system reliability, while related, focus on different material properties and characteristics and are tested by different methods. Figure 14. General Net List
100GGT Top View
Reliability
11 10 9 8 7 6 5 4 3 2 1
ABC DE FGH J K L Index mark
PIN#
BALL# - - - - - - - - - - - - - - - - - - - - - - - - - A1 B2 B1 C2 C1 D2 E3 D1 E2 F3 F2 E1 F1 G1 G2 G3 H1 H2 H3 H4 J1 J2 J3 K1 J4
PIN# 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 - - - - - - - - - - - - - - - - - - - - - - - - -
BALL# L1 K2 L2 K3 L3 K4 J5 L4 K5 J6 K6 L5 L6 L7 L8 K7 J7 K8 J8 L9 H8 K9 J9 L10 H9
PIN# 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 - - - - - - - - - - - - - - - - - - - - - - - - -
BALL# L11 K10 K11 J10 J11 H10 H11 G9 G10 F9 F10 G11 F11 E11 D11 E10 E9 D10 C11 D9 D8 C10 B11 C9 C8
PIN# 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 - - - - - - - - - - - - - - - - - - - - - - - - -
BALL# A11 B10 A10 B9 A9 B8 A8 B7 A7 C7 C6 B6 A6 B5 A5 C5 D4 A4 B4 C4 A3 B3 C3 A2 D3
Figure 13.
Daisy-Chained Pinout List
100GGT Top View
11 10 9 8 7 6 5 4 3 2 1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
A B C D E F GH J K L Index mark
Figure 15.
A1 B1 C1 D1 F3 E1 G1 G3 H2 H4 J2 K1 - - - - - - - - - - - - B2 C2 D2 E2 F2 F1 G2 H1 H3 J1 J3 J4 L1 L2 L3 L4 J6 L5 L7 K7 K8 L9 K9 L10 - - - - - - - - - - - - K2 K3 K4 K5 K6 L6 L8 J7 J8 H8 J9 H9 L11 K11 J11 G9 F9 G11 E11 E10 D10 D9 C10 C9 - - - - - - - - - - - - K10 J10 H10 G10 F10 F11 D11 E9 C11 D8 B11 C8 A11 A10 A9 B7 C7 B6 B5 C5 A4 C4 B3 A2 - - - - - - - - - - - - B10 B9 B8 A7 C6 A6 A5 D4 B4 A3 C3 D3
PCB Layout for Daisy-Chained Unit
NC - E3, J5, H11, A8
2-2
MicroStar BGA Packaging Reference Guide
Reliability
Figure 16.
Wire bonds Solder balls PCB
Daisy-Chain Test Configuration
MicroStar BGA Tester
reliability, and thermal cycling tests are generally used to predict behavior and reliability. Many of these are used in conjunction with solder fatigue life models using a modified Coffin-Manson strain range-fatigue life plots. Table 1. Package-Level Reliability Tests
Test Environments HAST Conditions 85RH/85C Read Points 600 hrs. 1000 hrs. 96 hrs. 240 hrs. Reliability 500 cycles 750 cycles 1000 cycles 200 cycles 500 cycles 750 cycles 1000 cycles 500 hrs. 600 hrs. 1000 hrs. 500 hrs. 240 hrs. 600 hrs. 1000 hrs. 420 hrs. 96 hrs.
Copper traces
Test pads
Package reliability focuses on materials of construction, thermal flows, material adherence/delamination issues, resistance to high temperatures, moisture resistance and ball/stitch bond reliability. Thorough engineering of the package is performed to prevent delamination caused by the interaction of the substrate material and the mold compound. TI subjects each MicroStar BGA to rigorous qualification testing before the package is released to production. These tests are summarized in Table 1. All samples used in these tests are preconditioned according to Joint Electronic Device Committee (JEDEC) A113 at various levels. Typical data is presented in Table 2. MicroStar BGA packages have proven robust and reliable. Board-level reliability (BLR) issues generally focus on the complex interaction of various materials under the influence of heat generated by the operation of electronic devices. Not only is there a complex thermal situation caused by multiple heat sources, but there are cyclical strains due to expansion mismatches, warping and transient conditions, non-linear material properties, and solder fatigue behavior influenced by geometry, metallurgy, stress relaxation phenomenon, and cycle conditions. In addition to material issues, board and package design can influence reliability. Thermal management from a system level is critical for optimum Table 2. Package-Level Reliability Test Results
Autoclave
121C, 15 psig
Temp. Cycle
-55/125C -65/150C
Thermal Shock
-65/150C -55/125C
HTOL
125C, Op. voltage
HTOL HTOL Bake
140C, Op. voltage 155C, Op. voltage 150C 170C
HAST
130C
All samples used in these tests are preconditioned according to Joint Electronic Device Committee (JEDEC) A113 at various levels. Optional tests. One or more of them may be added to meet customer requirements.
Package Types Leads Body (mm) Device Die (mm) Level Test Environment Autoclave T/C, -55/125C T/S, -65/150C (240 hrs.) (1000 cycles) (500 cycles) (750 cycles) (1000 cycles) (1000 hrs.) (1250 hrs.) (600 hrs.) (1000 hrs.) (1000 hrs.) 0/70 0/116 0/78 0/78 0/78 0/77 0/116 0/77 0/77 0/78 0/115 0/43 0/78 0/116 2-3 0/77 0/77 0/77 0/77 64 8x8 MSP 5.3 x 5.8 4 80 10 x 10 ASP 7.5 x 7.5 2 2a 144 12 x 12 DSP 9.3 x 9.5 4 3 196 15 x 15 DSP
Failures/Sample Size 0/77 0/77 0/77 0/77 0/77 0/76
HAST, 85C/85%RH 150C Storage
HTOL
MicroStar BGA Packaging Reference Guide
Reliability
In addition to device/package testing, board-level reliability testing has been extensively performed on the MicroStar BGA packages. Various types of daisy-chained packages were assembled to special boards shown in Figure 17. Electrical measurements
were made in the initial state and then at intervals after temperature cycles were run. The overall test conditions are shown in Figure 18. A summary of a wide range of board-level reliability is shown in Table 3. This data includes testing by TI and by end manufacturers. Table 4 summarizes conclusions from the testing. Two important conclusions are that the PCB pad size needs to match the via size, and that solder paste is needed for attachment to give optimal reliability.
Figure 17.
Board-Level Reliability Test Boards
Board Material FR-4 Structure: Two external metal layers Traces: 1oz cu design rule 100 m (4 mils) width, 100 m (4 mils) space Paste: Eutectic (SENJU 63-330F-21-10.5) Paste thickness: 0.15 m Board thickness: 31 mils Reflow profile: 225C max, time above 200C is 50 sec, time above 150C is 240 sec Screen opening: match land pad diameter Precondition: Level 3
Reliability Calculations
Another important aspect of predicting how a package will perform in any given application is reliability modeling. Thermal, electrical, and thermomechanical modeling, verified by experimental results, provide insight into system behavior, shorten package Figure 18. Board-Level Reliability Test Data
Reliability
TI-Houston test board
Test condition: Open short @25C, 10% resistance change or 200 Sample size: Greater or equal to 32 Temperature cycle range: -40C to 125C Sampling rate: Every 100 cycles, up to first failure; every 50 cycles thereafter up to 1000 cycles; every 100 cycles between 1000 to 1500 cycles; every 250 cycles between 1500 to 2500 cycles; Test stopping point min (2500 cycles, 50% failures)
5 min Ramp time: 2 min-5 min Dwell time: 11 min-13 min
TI-HIJI test board
Table 3. Board-Level Reliability Summary
Failures/Sample Size Conditions (With Solder Paste) TI Mfg Site Test Site TI HIJI TI HIJI TI Philippines TI HIJI TI HIJI TI HIJI TI TIPI TI Hou TI Philippines Customer A TI HIJI Customer B TI HIJI Customer C Body (mm) 12 x 12 Pitch (mm) 0.8 Die (mm) 8.8 x 8.8 Temp. Cycle (C) -40/125 500 0/85 Requirements 800 1000 (Cycles) 0/85 0/85 1100 4/85 Extended Range 1200 1300 (Cycles) 5/77 5/72 1500 15/39
Package GGU 144 balls GGU 144 balls GGF 100 balls GHC 196 balls GGU 144 balls GGW 176 balls GGM 80 balls 2-4
12 x 12
0.8
8.8 x 8.8
-40/125
0/36
0/36
0/36
0/36
0/36
0/36
1/35
10 x 10
0.5
6.6 x 6.6
-25/125
0/32
0/32
0/32
0/32
0/32
0/16
6/16
15 x 15
1.0
8.8 x 8.8
-40/125
0/62
0/62
0/62
0/62
0/62
0/62
4/62
12 x 12
0.8
8.8 x 8.8
-40/100
0/180
0/180
0/180
0/180
-
-
-
15 x 15
0.8
6.6 x 6.6
-25/125
0/35
0/35
0/35
0/35
0/35
0/35
1/35
10 x 10
0.8
5.0 x 5.0
-40/125
0/12
0/12
0/12
-
-
-
0/10
MicroStar BGA Packaging Reference Guide
Reliability
Table 4. Summary of Significant BLR Improvements
Condition Die size Die edge Ball count Ball size PCB pad size Solder paste Larger Over balls Smaller Smaller Over/undersized None or insufficient Improved BLR Smaller Within ball matrix Larger Larger Matches package via (for NSMD ~90% of via) Thickness 0.15 nom. (type matches reflow)
The combination of Finite Element Analysis (FEA), accurate thermal property information, and advanced statistical methods allows prediction of the number of cycles to failure for various probability levels. Using the assumption that cyclic fatigue lifetime follows a Weibull distribution, various probability levels can be calculated. For these calculations, the Weibull shape parameter used is = 4, which is based on experimental data calibration. It is also consistent with available experimental data found in the literature for leadless packages. This then results in the following equation: Nf(x%) = Nf(50%)[ln(1-0.01x)/ln(0.5)]1/ Using this equation, and using the plastic strain p in combination with the S-N curves, the data below is an example of the accuracy possible with this method: Sample Finite Element Simulation and Life Prediction: 144 GGU @ T/C: -40/125C {Model} p = 0.353% on the outmost joint Nf(50%)= 4434 cycles Nf(1%) = 1539 cycles {BLR Testing} -40/125C (10 min/10 min) Nf(1%) = 1657 cycles Modeling is most useful in exploring changes in materials, designs and process parameters without the need to build experimental units. For example, modeling was used to study the effects of changes in board thickness and pad size. Table 5 shows the simulated effects of pad size and board thickness on the fatigue life of a 144-GGU package.
Reliability
development time, predict system lifetimes, and provide an important analytical tool. In applications such as BGAs, where the interconnections are made through solder balls, the useful life of the package is, in most cases, dependent on the useful life of the solder itself. This is an area that has been studied extensively, and very accurate models for predicting both solder behavior and interpreting accelerated life testing exist. The current methodology employed at Texas Instruments includes both extensive model refinement and constant experimental verification. For a given package, a detailed 2D Finite Element Model (FEM) is constructed. This model will be used to carry out 2D plain strain elastoplastic analysis to predict areas of high stress. These models also account for the thermal variation of material properties, such as Modulus of Elasticity, Coefficient of Thermal Expansion, and Poisson's Ratio as a function of temperature. These allow the FEM to calculate the thermomechanical plastic strains in the solder joints for a given thermal loading.
Table 5. Effects of Pad Size and Board Thickness on Fatigue Life
Example1: Effects of pad size on fatigue life
* * *
Package: 144 GGU Die: 8.8 x 8.8 x 0.279 mm Board: FR-4 board 52 mils thick
Pad Dia. (mils) 12 13 14 15
Pad Standoff (mm) 0.3847 0.3689 0.3523 0.3350
Solder Center Dia. (mm) 0.4908 0.4951 0.5005 0.5060 Nf (1%) (cycles to failure) 1152 1249
Plastic Strain (%) 0.4400 0.4127 0.3908 0.3741
Nf (1%) (cycles to failure) 998 1134 1263 1377
Difference 0.88x 1 1.11x 1.21x
Example 2: Effects of board thickness on fatigue life
* * * *
Package: 144 GGU g Die: 8.8 x 8.8 x 0.279 mm Board: FR-4 Pad Size: 13 mils
Board Thickness (mils) 50 31
Plastic Strain (%) 0.4095 0.393
Difference 1 1.08x
MicroStar BGA Packaging Reference Guide
2-5
Reliability
Package Characteristics
Texas Instruments has extensive package characterization capabilities, including an electrical measurements lab with TDR/LRC (Time Domain Reflectometer/inductance resistance capacitance) and network analysis capabilities, a thermal measurements lab with JEDEC standard test conditions up to 1000 watts, and extensive electrical, thermal, and mechanical modeling capability. Modeling was implemented at TI starting in 1984. Stress analysis is done with the Ansys Analysis tool, which provides full linear, nonlinear, 2D and 3D capabilities for solder reliability, package warpage, and stress analysis studies. An internally developed tool (PACEDt) is used for electrical modeling that gives 2.5D and full 3D capability for LRC models, transmission lines, lossy dielectrics, and SPICE deck outputs. The thermal modeling tool was also internally developed (ThermCALt) and it provides full 3D automatic mesh generation for most packages. Figure 19. Thermal Modeling Process
Heat-Transfer Paths
Complex geometries, transient analysis, and anisotropic materials can be modeled with it. With these capabilities, a full range of modeling from device level through system level can be provided. Package modeling is used to predict package performance at the design stage, to provide a package development tool, to aid qualification by similarity, and is used as a failure analysis tool.
Thermal Modeling
Figure 19 outlines the thermal modeling process. Data for each package is included in Appendix B.
Reliability
Electrical Modeling
Figure 20 outlines the electrical modeling process. Data for each package is included in Appendix B. Figure 20. Electrical Modeling Process
Chip Pad Package PWB S Conduction Convection Radiation S S Calculates inductances, capacitances, resistances, transmission line characteristics of package geometries Uses as loads for circuit simulation Process - Select solution algroithms for problem domain - Identify package structures to be modeled - Generate spice deck of package parameters - Simulate impact on driver output waveforms - Calculate ground/power bounce
Pin 1 Pin 2 Die
(TQFP shown for illustration purposes) S Model's three heat-transfer mechanisms: - Conduction - Convection - Radiation Method: - Define solid - Mesh solid - Solve large number of simultaneous equations relating each defined mesh point to each other Sources of error: - Convection coefficients - Material properties - Solid definition inaccuracies
5 Voltage (V) 4 3 2 1 0 0 Input pin 1 Output pin1 Crosstalk pin 1 2.00E-09 4.00E-09
S
Time (sec)
S
PACED and ThermCAL are trademarks of Texas Instruments Incorporated. 2-6
MicroStar BGA Packaging Reference Guide
Surface-Mounting MicroStar BGA Packages
MicroStar BGA Packaging Reference Guide
3-1
Surface-Mounting MicroStar BGA Packages
3
Surface-Mounting MicroStar BGA Packages
Surface-mount technology (SMT) has evolved over the past decade from an art into a science with the development of design guidelines and rules. While these guidelines are specific enough to incorporate many shared conclusions, they are general enough to allow flexibility in board layouts, solder pastes, stencils, fixturing, and reflow profiles. From experience, most assembly operations have found MicroStar BGA packages to be robust, manufacturing-friendly packages that fit easily within existing processes and profiles. In addition, they do not require special handling. However, as ball pitch becomes smaller, layout methodology and placement accuracy become more critical. Below is a review of the more important aspects of surface-mounted CSPs. The suggestions provided may aid in efficient, cost-effective production.
If the edges of the boards are to be used for conveyer transfer, a cleared zone of at least 3.17 mm should be allowed. Normally, the longest edges of the board are used for this purpose, and the actual width is dependent on equipment capability. While no component lands or fiducials can be in this area, breakaway tabs may be. Interpackage spacing is a key aspect of DFM, and the question of how close you can safely put components to each other is a critical one. The following component layout considerations are recommendations based on TI experience:
* *
There should be a minimum of 0.508 mm between land areas of adjacent components to reduce the risk of shorting. The recommended minimum spacing between SMD discrete component bodies is equal to the height of the tallest component. This allows for a 45 soldering angle in case manual work is needed. Polarization symbols need to be provided for discrete SMDs (diodes, capacitors, etc.) next to the positive pin. Pin-1 indicators or features are needed to determine the keying of SMD components. Space between lands (under components) on the backside discrete components should be a minimum of 0.33 mm. No open vias may be in this space. The direction of backside discretes for wave solder should be perpendicular to the direction through the wave. Do not put SMT components on the bottom side that exceed 200 grams per square inch of contact area with the board. If space permits, symbolize all reference designators within the land pattern of the respective components. It is preferable to have all components oriented in well-ordered columns and rows. Group similar components together whenever possible. Room for testing needs to be allowed.
Design for Manufacturability (DFM)
Surface-Mounting MicroStar BGA Packages
A well-designed board that follows the basic surface-mount technology considerations greatly improves the cost, cycle time, and quality of the end product. Board design should comprehend the SMT-automated equipment used for assembly, including minimum and maximum dimensional limits and placement accuracy. Many board shapes can be accommodated, but the front of the board should have a straight and square edge to help machine sensors detect it. While odd-shaped or small boards can be assembled, they require panelization or special tooling to process in-line. The more irregular the board--non-rectangular with no cutouts--the more expensive the assembly cost. Fiducials (the optical alignment targets that align the module to the automated equipment) should allow vision-assisted equipment to accommodate the shrink and stretch of the raw board during processing. They also define the coordinate system for all automated equipment, such as printing and pick-and-place. The following guidelines may be helpful:
* * * * * * * * *
* *
Automated equipment requires a minimum of two and preferably three fiducials. A wide range of fiducial shapes and sizes can be used. Among the most useful is a circle 1.6 mm in diameter with an annulus of 3.175/3.71 mm. The outer ring is optional, but no other feature may be within 0.76 mm of the fiducial. The most useful placement for the fiducials is an L configuration, which is orthogonal to optimize the stretch/shrink algorithms. When possible, the lower left fiducial should be the design origin (coordinate 0,0). All components should be within 101.6 mm of a fiducial to guarantee placement accuracy. For large boards or panels, a fourth fiducial should be added.
3-2
*
Solder Paste
TI recommends the use of paste when mounting MicroStar BGAs. The use of paste offers the following advantages:
* *
*
It acts as a flux to aid wetting of the solder ball to the PCB land. The adhesive properties of the paste will hold the component in place during reflow.
MicroStar BGA Packaging Reference Guide
Surface-Mounting MicroStar BGA Packages
* *
It helps compensate for minor variations in the planarity of the solder balls. Paste contributes to the final volume of solder in the joint, and thus allows this volume to be varied to give an optimum joint.
Figure 21.
Solder Ball Collapse
0.40 0.05 mm Land on PCB
Paste selection is normally driven by overall system assembly requirements. In general, the "no clean" compositions are preferred due to the difficulty in cleaning under the mounted component. Most assembly operations have found that no changes in existing pastes are required by the addition of MicroStar BGA, but due to the large variety of board designs and tolerances, it is not possible to say this will be true for any specific application. Nearly as critical as paste selection is stencil design. A proactive approach to stencil design can pay large dividends in assembly yields and lower costs. In general, MicroStar BGA packages are special cases of BGA packages, and the general design guidelines for BGA package assembly applies to them as well. There are some excellent papers on BGA assembly, so only a brief overview of issues especially important to MicroStar BGA packages will be presented here. The typical stencil hole diameter should be the same size as the land area, and 125- to 150-m-thick stencils have been found to give the best results. Good release and a consistent amount of solder paste and shapes are critical, especially as ball pitches decrease. The use of metal squeegee blades, or at the very least, high durometer polyblades, is important in achieving this. Paste viscosity and consistency during screening are some variables that require close control.
PCB
0.35 mm typical
PCB (Not to scale)
Controlling the collapse, and thus defining the package standoff, is critical to obtaining the optimum joint reliability. Generally, a larger standoff gives better solder joint fatigue strength, but this should not be achieved by reducing the board land diameter. Reducing the land diameter will increase the standoff, but will also reduce the minimum cross-section area of the joint. This, in turn, will increase the maximum shear force at the PCB side of the solder joint. Thus, a reduction of land diameter will normally result in a worse fatigue life, and should be avoided unless all the consequences are well understood.
Reflow
Solder reflow conditions are the next critical step in the mounting process. During reflow, the solvent in the solder paste evaporates, the flux cleans the metal surfaces, the solder particles melt, wetting of the surfaces takes place by wicking of molten solder, the solder balls collapse, and finally solidification of the solder into a strong metallurgical bond completes the process. The desired end result is a uniform solder structure strongly bonded to both the PCB and the package with small or no voids and a smooth, even fillet at both ends. Conversely, when all the steps do not carefully fit together, voids, gaps, uneven joint thickness, discontinuities, and insufficient fillet can occur. While the exact cycle used depends on the reflow system and paste composition, there are several key points all successful cycles have in common. The first of these is a warm-up period sufficient to safely evaporate the solvent. This can be done with a pre-heat or a bake, or, more commonly, a hold in the cycle at evaporation temperatures. If there is less solvent in the paste (such as in a high-viscosity, high-metal-content paste), then the hold can be shorter. However, when the hold is not long enough to get all of the solvent out or too fast to allow it to evaporate, many negative things happen. These range from solder-particle splatter to
3-3
Solder Ball Collapse
In order to produce the optimum solder joint, it is important to understand the amount of collapse of the solder balls, and the overall shape of the joint. These are a function of:
* * * * *
The diameter of the package solder ball via. The volume and type of paste screened onto the PCB. The diameter of the PCB land. The board assembly reflow conditions. The weight of the package.
The original ball height on the package for a typical 0.8-mm-pitch package is 0.40 mm. After the package is mounted, this typically drops to 0.35 mm, as illustrated in Figure 21.
MicroStar BGA Packaging Reference Guide
Surface-Mounting MicroStar BGA Packages
Surface-Mounting MicroStar BGA Packages
trapped gases, which can cause voids and embrittlement. A significant number of reliability problems with solder joints can be solved with the warm-up step, so it needs careful attention. The second key point that successful reflow cycles have in common is uniform heating across the package and the board. Uneven solder thickness and non-uniform solder joints may be an indicator that the profile needs adjustment. There can also be a problem when different sized components are reflowed at the same time. Care needs to be taken when profiling an oven to be sure that the indicated temperatures are representative of what the most difficult to reflow parts are seeing. These problems are more pronounced with some reflow methods, such as infrared (IR) reflow, than with others, such as forced hot-air convection. Finally, successful reflow cycles strike a balance among temperature, timing, and length of cycle. Mistiming may lead to excessive fluxing activation, oxidation, excessive voiding, or even damage to the package. Heating the paste too hot too fast before it melts can also dry the paste, which leads to poor wetting. Process development is needed to optimize reflow profiles for each solder paste/flux combination. The profile shown in Figure 22 is an ideal one for use in a forced-air-convection furnace, which is the most highly recommended type. The best results have been found in a nitrogen atmosphere. The guidelines upon which this profile is based, also shown in Figure 22, are general. Modification to the ideal reflow profile will be driven by the interplay of solder-paste particle size and flux percentage with process variables such as heating rates, peak temperatures, board construction factors and atmosphere. These modifications are dependent upon specific applications. It should be noted that while they are more rugged than most CSP-type packages, many MicroStar BGA packages are still slightly moisture-sensitive at the time of printing of this Reference Guide. The time out of a dry environment should be controlled according to the label on the packing material. This will prevent moisture absorption problems with the package such as "popcorning," or delamination.
Surface-Mounting MicroStar BGA Packages
Figure 22.
Ideal Reflow Profile
60-90 sec 60-120 sec 60-150 sec 220C 5C 10-20 sec 6C/sec maximum
RT to 140C: 140C to 180C: Time above 183C: Peak temperature: Time within 5C peak temperature: Ramp-down rate:
Ideal Reflow Profile Temperature (C) 300 200 100 0 0 100 Time (sec) Note: This is an ideal profile, and actual conditions obtained in any specific reflow oven will vary. This profile is based on convection or RF plus forced convection heating. 200 300
Other concerns with BGA packages are those caused by a PCB bowing or twisting during reflow. As PCBs get thinner, these problems will become more significant. Potential problems from these effects will show up as open pins, hourglass solder joints, or solder discontinuities. Proper support of the PCB through the furnace, balancing the tab attachments to a panel, and, in worst cases, using a weight to stiffen the PCB can help prevent this. In general, the small size of CSPs create fewer problems than standard BGAs. It is also true that BGAs generally have fewer problems than leaded components.
Inspection
MicroStar BGA packages have been designed to be consistent with very high-yield assembly processes. Because of their relatively light weight, MicroStar BGA packages tend to self-align during reflow. Since the pitch of the ball pattern is large compared to that of fine-pitch leaded packages, solder bridging is rarely encountered. It is recommended that a high-quality solder joint assembly process be developed using the various inspection and analytical techniques, such as cross-sectioning. Once a quality process has been developed, detailed inspection should not be necessary. Visual methods, while obviously limited, can offer valuable clues to the general stability of the process. Electrical checks can confirm interconnection. Both transmission X-rays and laminographic X-rays have proven to be useful nondestructive tools, if desired.
3-4
MicroStar BGA Packaging Reference Guide
4
Packing and Shipping
Packing and Shipping
MicroStar BGA Packaging Reference Guide
4-1
Packing and Shipping
MicroStar BGAs are shipped in either of two packing methods: * Trays * Tape and reel
with the same package outline has its own individually designed tray. The trays are designed to be used with pick-and-place machines. Figure 23 gives typical tray details, and Table 6 shows the number of units per tray. Figure 24 shows the packing method used to ship trays. Before the trays are sealed in the aluminum-lined plastic bag, they are baked in accordance with the requirements for dry-packing at the appropriate level.
Trays
Thermally resistant plastic trays are currently used to ship the majority of the packages. Each family of parts
Figure 23.
Shipping Tray Detail
Packing and Shipping
Table 6. Number of Units per Shipping Tray
Body Size (mm) 16 x 16 15 x 15 13 x 13 12 x 12 11 x 11 10 x 10 8x8 9 x 13 Units/ Tray 90 90 160 160 160 200 225 180 Units/ Box 450 450 800 800 800 1000 1125 900
Package Code GZY, GHK GGW,GHC GHG, GHJ, GHV GZG, GGB GGT GGF, GHZ, GGM GGV, GJJ GFZ, GHB, GHN
Matrix 6 x 15 6 x 15 8 x 20 8 x 20 8 x 20 8 x 25 9 x 25 10 x 18
4-2
MicroStar BGA Packaging Reference Guide
Packing and Shipping
Figure 24.
Packing Method for Trays
4. Wrap and tape bubble pack around the bag for a snug fit in the inner carton. Place the necessary labels on the inner carton.
1. Arrange the stack of trays to be packed with a tray pad on top and bottom.
Tray pad
Tray stack
ESD label
Tray pad
Bar-code label 5. Add bubble pack around the inner carton for a snug fit in the skidboard liner. 2. Strap the tray stack and pads together with four straps--three crosswise and one lengthwise. Then place the desiccants and the humidity indicator on top.
Humidity indicator Packing and Shipping 6. Place four foam corner spacers on the folded skidboard liner before placing it in the outer carton. An enhanced skidboard liner, which eliminates the need for foam corner spacers, may be used. Seal outer carton and apply necessary labels. Aluminum-lined bag ESD label Moisture-sensitivity label Bar-code label 4-3
Desiccant packs
3. Place the lot inside the aluminum-lined bag and vacuum-seal it. Place the necessary labels on the sealed bag.
MicroStar BGA Packaging Reference Guide
Packing and Shipping
Tape-and-Reel Packing Method
The embossed tape-and-reel method is generally preferred by automatic pick-and-place machines. This will be the standard way MicroStar BGA packages will be shipped. Trays will remain an option for those customers who prefer them. The tape is made from an antistatic/conductive material. The cover tape, which peels back during use, is heat-sealed to the carrier tape to keep the devices in their cavities during shipping and handling. The tape-and-reel packaging used by Texas Instruments is in full compliance with EIA Standard 481-A, "Taping of Surface-Mount Components for Automatic Placement." The static-inhibiting materials used in the carrier-tape manufacturing provides device
protection from static damage, while the rigid, dust-free polystyrene reels provide mechanical protection and clean-room compatibility with dereeling equipment currently available on most high-speed automated placement systems.
Tape Format
Typical tape format is shown in Figure 25. The variables used in Figure 25 and Table 7 are defined as follows: W is the tape width; P is the pocket pitch; A0 is the pocket width; B0 is the pocket length; K0 is the pocket depth; K is the maximum tape depth; and F is the distance between the drive hole and the centerline of the pocket.
Figure 25.
Single Sprocket Tape Dimensions
4.0 0.10 P 2.00 0.05 + 0.1 1.5 - 0.0 K 0.8 MIN 0.40
1.75 0.1
F B0
Packing and Shipping
W
Carrier tape embossment 1.5 MIN Diameter
A0 0 MIN Direction of feed Notes:
Cover tape K0
A. Tape widths are 16 and 24 mm. B. Camber per EIA Standard 481-A C. Minimum bending radius per EIA Standard 481-A D. All linear dimensions are in millimeters.
Table 7. Tape Dimensions
Tape Width (W) 16 24 24 24 24 Pocket Pitch (P) 12 16 16 16 20 Pocket Width (A0) 8.2 10.2 11.35 12.4 15.25 Pocket Length (B0) 8.2 10.2 11.35 12.4 15.25 Pocket Depth (K0) 1.7 1.7 1.9 1.9 2.2 Max. Tape Depth (K) 2.0 2.0 2.2 2.2 2.5 Centerline to Drive Hole (F) 7.5 11.5 11.5 11.5 11.5 Package Size 8x8 10 x 10 11 x 11 12 x 12 15 x 15
All dimensions are in millimeters.
4-4
MicroStar BGA Packaging Reference Guide
Packing and Shipping
Figure 26.
Reel Dimensions
N is the diameter of the reel hub. T MAX
13.0 0.2
+ 0.0 330 - 4.0 20.2 MIN
N
2.5 MIN G TI bar code label
1.5 MIN width Note A: All linear dimensions are in millimeters.
Table 8. Reel Dimensions
Tape Width (G) 16 24 Reel Hub Diameter (N) 100 100 Reel Total Thickness (T MAX) 28 28 Parts per Reel 1000 1000
Device Insertion
Devices are inserted toward the outer periphery of the tape by placing the side with the device name face up and the side with the balls attached face down. The pin-1 indicator is placed in the top right-hand corner of the pocket, next to the sprocket holes.
All dimensions are in millimeters.
The reels are shown in Figure 26. In this figure, G is the width of the tape, N is the diameter of the hub, and T is the total reel thickness. After the parts are loaded into the reel, each individual reel is packed in its own "pizza" box for shipping, as shown in Figure 27. Figure 27. Tape-and-Reel Packing
Packaging Method
For reels, once the taping has been completed, the end of the leader is fixed onto the reel with tape. The product name, lot number, quantity, and date code are recorded on the reel and the cardboard box used for tape delivery. Each reel is separately packed in a cardboard box for delivery. Trays are packed with five loaded trays and one empty tray on top for support and to keep packages secure. The stack is secured with stable plastic straps and sealed in a moisture-proof bag. Customer-specific bar code labels can be added under request or general purchasing specification. Moisture-sensitive packages are baked before packing and are packed within 8 hours of coming out of the oven. Both the tape-and-reel and the tray moisture-proof bags are sealed and marked with appropriate labeling warning that the packages inside the bags are dry-packed and giving the level of moisture sensitivity.
Desiccant Humidity indicator Reeled units Aluminum bag
Pizza box
Bar code ESD label
MicroStar BGA Packaging Reference Guide
4-5
Packing and Shipping
Packing and Shipping
Packing and Shipping 4-6
MicroStar BGA Packaging Reference Guide
5
Sockets
MicroStar BGA Packaging Reference Guide
5-1
Sockets
Sockets
The Design Challenge
The fine pitch of MicroStar BGA packages makes socketing a special challenge. Mechanical, thermal, and electrical issues must be accommodated by the socket designer. CSP packaging is at the cutting edge of package design and it appears that it is being adopted faster than any other previous package technology. Standards are only now beginning to be established. TI fully supports these efforts, and all MicroStar BGA outlines are being engineered to fit within JEDEC standards where they exist. For instance, all 0.8-mm-pitch packages fit within JEDEC MO205. While these standards detail the pitch and I/O placement, they do allow wide latitude for overall body size variation. The size of a specific package within the TI MicroStar BGA family is based on the package construction, and is independent of die size. Thus, a range of die sizes and I/Os within a family will have the same package dimensions. Each different family has a specific I/O pitch and array. For maximum socket versatility, an adapter or "personalizer" can be customized for each application, allowing a single-socket body to be used with many packages. This feature is especially useful in the early days as the technology is being developed and adopted and the total volume required is small.
Figure 28.
Approaches for Contacting the Solder Ball
b) Metal "Y"
a) Metal pinch
c) Rough bump on flex
d) Conductive
e) Etched pocket in silicon
f) Metal
Contacting the Ball
A number of different approaches for contacting the solder ball are shown schematically in Figure 28. The pinch style contact has been used extensively for contacting solder balls in conventional BGAs. A benefit of the pinch style is that the socket does not have to push down on the package to provide the necessary contact force to penetrate the oxide film on the solder balls. The issues in utilizing this approach for pitches below 1.27 mm involve: 1. Miniaturizing the contact 2. Developing injection-molding tooling for the pitch 3. Developing cost-effective manufacturing procedures for handling and assembling the fragile contact For pitches of 0.75 mm and above, Texas Instruments has designed a pinch contact that satisfies all of these requirements. Further information on the availability of these sockets can be obtained from your local TI Field Sales representative. The contact is designed to grip the solder ball with a pinching action. This not only provides electrical contact to the solder ball but also helps retain the package in the socket. The contact is shown in Figure 29. The contact is stamped and formed from a 0.12-mm-thick strip of CDA 172, the high-yield-strength beryllium copper alloy. This alloy is used for spring applications that are exposed to high stresses and temperatures because of its excellent stress relaxation performance and formability.
5-2 Sockets
Figure 29.
Pinch Contact for Solder Balls
Each contact incorporates two beams that provide an oxide-piercing interface with the sides of the balls above the central area--the equator. Since the contact is above the equator, the resultant force is downward and ensures package retention in the socket. No contact is made on
MicroStar BGA Packaging Reference Guide
Sockets
the bottom of the solder ball and the original package planarity specifications are unchanged. A photomicrograph of the contact touching the solder balls is shown in Figure 30. Figure 30. Contact Area on Solder Ball
Figure 32.
Effect of Burn-in on Probe Marks
Establishing Contact Force
Contact force is typically generated as a result of the deflection of the contact arm. The actual force generated is a function of the modulus of the material and the specific geometric details of the design. The solder ball diameters for CSPs tend to be small--in the range of 0.25 mm to 0.4 mm, which limits the deflection of the contact arm to a very small distance. Typically, this distance is half the ball diameter. This presents a challenge to the designer who must generate the required 15 grams of force at the contact tip, yet keep the bending stresses within the contact arms at a low enough value to achieve a 20K-cycle life. The contact force requirements are met by incorporating a pre-load, so that even for small displacements, the desired force is achieved and the socket can operate within acceptable stress levels. The 15-gram target force is smaller than that associated with TSOP-type contact force levels, which require a 30-gram minimum. However, based on the contact tip geometry, this lower force translates to contact pressures that are high enough to achieve oxide penetration and good electrical continuity.
The witness marks left on the solder ball from the contact are shown in Figure 31. This ball was contacted at room temperature and it is clear that there was no damage to the bottom of the ball or any witness marks from the contact above the equator. The effect of burn-in on the probe marks was examined by simulating a cycle and placing a loaded socket into an oven at 125C for 9 hours. The result is shown in Figure 32. The penetration of the contact into the solder ball due to the higher temperature is greater but is well within the acceptable range. There was no visible pickup of solder on the contact tips. This experiment is being continued to evaluate the impact of longer times on the witness marks and the solder pickup. The location of the contact pinch is clearly seen in this photograph. Figure 31. Witness Marks on Solder Ball
Conclusions and Future Work
The importance of continuing the development to 0.5-mm pitch is clear. End users want more and more electronic functionality in smaller and smaller packages. Sockets for testing these fine pitches are available today but are specialty and are considered too expensive for broad commercial application. Continued development includes innovative approaches as well as refining present methods, but at the time of the preparation of this Reference Guide, a clear-cut favorite technology had not emerged. For current progress in this and other areas of 0.5-mm-pitch technology, your local TI Field Sales representative can give you up-to-date information.
Sockets
MicroStar BGA Packaging Reference Guide
5-3
Sockets
Growth rates as high as 400% for CSPs in 1998 over those in 1997 have been forecasted. The opportunity to participate in a market with this growth has provided the incentive for the socket companies to develop solutions for the infrastructure needed for burn-in test sockets. The issues of contacting the small, soft solder balls on CSPs have been solved. The price disparity between CSP sockets and TSOP sockets is to be expected during the
early days of the introduction of a new technology and is due entirely to the embryonic state of the industry and the low volume. It is believed that once this packaging technology matures and volumes increase to those of conventional burn-in sockets, then the prices for sockets for CSPs will decrease and be more in line with other commercial sockets.
Sockets 5-4
MicroStar BGA Packaging Reference Guide
6
References
MicroStar BGA Packaging Reference Guide
6-1
References
References
K. Ano et al., "MicroStar BGAs," Application Note, TI SCJ 2328, July 1998. Gerald Capwell, "High Density Design with MicroStar BGAs," Texas Instruments Application Note, July 1998. James Forster, "Performance Drivers for Fine Pitch BGA Sockets," Chip Scale Processing, June 1998. Kevin Lyne, "Chip Scale Packaging From Texas Instruments: MicroStar BGA," Texas Instruments Application Note, June 1997.
Gary Morrison, Les Stark, Ron Azcarte, S. Capistrano, K. Ano, K. Murata, M. Watanabe, T. Ohuchida, Y. Takahashi, Greg Ryan, "MicroStar BGA Packaging: Critical Interconnections," SEMICON '98. Les Stark and M'hamed Idnabdeljalil, "MicroStar BGA vs. FC-CSP: Finite Element Simulation of BLR Performance: 144GGF Footprint," Texas Instruments Application Note, August 1998.
References 6-2
MicroStar BGA Packaging Reference Guide
Appendix
A
Frequently Asked Questions
Package Questions
Q. Do the solder balls come off during shipping? A. No, this has never been observed. The balls are 100% inspected for coplanarity, diameter, and other physical properties prior to packing for shipment. Because solder is used during the ball-attachment process, uniformly high ball-attachment strengths are developed. Also, the ball-attachment strength is monitored frequently in the assembly process to prevent ball loss from vibration and other shipping forces. Q. Is package repair possible? Are tools available? A. Yes, some limited package repair is possible, and there are some semiautomatic M/C tools available. However, TI does not guarantee the reliability of repaired packages. Q. What are the leads that appear on the package edge for? Are they connected to the inner pattern? A. Those leads are used for plating connections during the plating of Ni/Au on the copper trace during the fabrication of the substrate. Since they do have electrical connection with the inner pattern, they can be used for test probing and signal analysis. There is no reliability risk with them. Q. What is the composition and melting point of the solder balls? A. The balls are a near-Sn/Pb eutectic solder that includes some additives to improve thermal fatigue life. The liquidus temperature is 178C to 210C. Q. Is burn-in testing possible? How about ball damage? A. There are commercial sockets available for 1.00-mm and 0.8-mm pitch package burn-in. Sockets for 0.5-mm pitch packages are now becoming available. Vendors include Texas Instruments, Yamaichi, Wells and Enplas. The ball damage observed falls within specified tolerances, so the testing does not affect board mount. Q. Is tape-and-reel shipping available? A. Tape-and-reel is the preferred method for shipping MicroStar BGA packages. Tray shipping methods are available upon customer request. Q. What about actual market experience? A. Since TI started production in May of 1996, well over 70 million units have been shipped. End products are primarily DSP Solutions such as wireless phones and digital camcorders where MicroStar BGA can create significant space savings. Technologies available in MicroStar BGAs include DSP, ASIC, Mixed Signal, and Linear devices. Q. How does the packaging cost compare to QFPs? A. CSPs are in many ways an ideal solution to cost reduction and miniaturization requirements. They offer enormous area reductions in comparison to QFPs and have increasing potential to do so without adding to system-level costs. In the best case, CSPs compete today on a cost-per-terminal basis with QFPs. For example, various CSPs from Texas Instruments are now available at cost parity with thin QFPs.
Appendix A Questions
MicroStar BGA Packaging Reference Guide
A-1
Frequently Asked Questions
Assembly Questions
Q. What alignment accuracy is possible? A. Alignment accuracy for the 0.8-mm-pitch package is dependent upon board-level pad tolerance, placement accuracy, and solder ball position tolerance. Nominal ball position tolerances are specified at 80 m. These packages are self-aligning during solder reflow, so final alignment accuracy may be better than placement accuracy. Q. Can the solder joints be inspected after reflow? A. Process yields of 5-ppm (parts per million) rejects are typically seen, so no final in-line inspection is required. Some customers are achieving satisfactory results during process set-up with lamographic X-ray techniques. Q. How do the board assembly yields of MicroStar BGAs compare to QFPs? A. Many customers are initially concerned about assembly yields. However, once they had MicroStar BGAs in production, most of them report improved process yields compared to QFPs. This is due to the elimination of bent and misoriented leads, the wider terminal pitch than with 0.5-mm-pitch QFPs, and the ability of these packages to self-align during reflow. The collapsing solder balls also mean that the coplanarity is improved over leaded components. Q. Are there specific recommendations for SMT processing? A. Texas Instruments recommends alignment with the solder balls for the CSP package, although it is possible to use the package outline for alignment. Most customers have found they do not need to change their reflow profile. Q. Can the boards be repaired? A. Yes, there are rework and repair tools and profiles available. We strongly recommend that removed packages be discarded. Q. Is TI developing a lead-free version of MicroStar BGAs? A. Yes, Texas Instruments is working toward eliminating lead in the solder balls to comply with lead-free environmental policies. The lead-free solder is in final evaluation. Only the solder will change, not the package structure or the mechanical dimensions. The solder system under development is based on Sn-Ag metallurgy. Check with your local TI Field Sales representative for sample availability. Q. What size land diameter for these packages should I design on my board? A. Land size is the key to board-level reliability, and Texas Instruments strongly recommends following the design rules included in this bulletin.
Appendix A Questions A-2
MicroStar BGA Packaging Reference Guide
Appendix
B
Package Data Sheets
Figure 33 shows TI's strategic package lineup, followed by the package data sheets for the package families offered as standard products by Texas Instruments. As new packages are added, they will be placed on the Figure 33. TI's Strategic Package Line-Up
MicroStar BGAt Package Product Guide Strategic Package Lineup: HIJI and Philippines PITCH (mm) 6x6 GJK 80 0.5 PACKAGE SIZE (mm) 8x8 GJJ 167 GHZ 151 10 x 10 GGF 100
strategic package lineup. Contact your TI field sales office for information on the most current offerings. Samples are available for all packages shown in Figure 33.
Qual: 4Q 99 8x8 GGV 64 10 x 10 GGM 80
Qual: 4Q 99 12 x 12 GGU 144
Qual: Complete 15 x 15 GGW 176
Qual: Complete 16 x 16 GHK 257
1.0 mm PITCH GHC 196
0.8
Qual: Complete 11 x 11 GGT 100
Qual: Complete
Qual: Complete Qual: Complete GHH 179 GGW 208 Qual: Complete GGW 240
Qual: Complete
GGM 100
GJG 257
Qual: Complete
Qual: Complete
Qual: Complete
Qual: Complete
Qual: Complete
Qual: Complete
MicroStar BGA Packaging Reference Guide
B-1
Appendix B Package Data Sheets
Package Data Sheets
80GJK PACKAGE OUTLINE (6 x 6 mm, 0.5 mm pitch)
GJK (S-PBGA-N80) PLASTIC BALL GRID ARRAY GJK 80 TOP VIEW DAISY CHAIN NET LIST
9 8 7 6 5 4 3 2 1
INDEX MARK NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics B1-C1 D1-E1 F1-G1 H1-J1 J2-J3 J4-J5 J6-J7 J8-J9 H9-G9 F9-E9
A
B
C
DE
F
GH
J G4-G5 G6-G7 F7-E7 D7-C7 C6-C5 C4-D4 E4-F4 F5-F6 E6-D6 D5-E5
Thermal Characteristics
D9-C9 B9-A9 A8-A7 A6-A5 A4-A3 A2-B2 C2-D2 E2-F2 G2-H2 H3-H4
H5-H6 H7-H8 G8-F8 E8-D8 C8-B8 B7-B6 B5-B4 B3-C3 D3-E3 F3-G3
GJK 80
PIN# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 BALL# C2 B1 D3 E4 C1 D2 E3 D1 E2 F4 E1 F3 F1 F2 G3 G1 G2 H2 H1 J1 PIN# 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 BALL# H3 J2 G4 F5 J3 H4 G5 J4 H5 F6 J5 G6 J6 H6 G7 J7 H7 H8 J8 J9
PIN ASSIGNMENT NET LIST
PIN# 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 BALL# G8 H9 F7 E6 G9 F8 E7 F9 E8 D6 E9 D7 D9 D8 C7 C9 C8 B8 B9 A9 PIN# 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 BALL# B7 A8 C6 D5 A7 B6 C5 A6 B5 D4 A5 C4 A4 B4 C3 A3 B3 B2 A2 E5
Productization
Appendix B Package Data Sheets MicroStar BGA is a trademark of Texas Instruments Incorporated. B-2
MicroStar BGA Packaging Reference Guide
Package Data Sheets
167GJJ PACKAGE OUTLINE (8 x 8 mm, 0.5 mm pitch)
GJJ (S-PBGA-N167) PLASTIC BALL GRID ARRAY GJJ 167 TOP VIEW DAISY CHAIN NET LIST
13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK B1-C1 F3-G3 D1-E1 H3-J3 F1-G1 K3-L3 H1-J1 M3-M4 K1-L1 B4-B5 M1-N1 C4-D4 A2-B2 E4-F4 C2-D2 G4-H4 E2-F2 J4-K4 G2-H2 L4-L5 J2-K2 N4-N5 L2-M2 A5-A6 N2-N3 C5-C6 A3-A4 D5-E5 B3-C3 F5-G5 D3-E3 H5-J5 NC - F7
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics
A B C D E F GH J K L MN K5-K6 M5-M6 B6-B7 D6-D7 E6-F6 G6-H6 J6-J7 L6-L7 N6-N7 A7-A8 C7-C8 E7-E8 H7-H8 K7-K8 M7-M8 B8-B9 D8-D9 F8-G8 J8-J9 L8-L9 N8-N9 A9-A10 C9-C10 E9-F9 G9-H9 K9-K10 M9-M10 B10-B11 D10-E10 F10-G10 H10-J10 L10-L11 N10-N11 G13-H13 A11-A12 J13-K13 C11-D11 L13-M13 E11-F11 G11-H11 J11-K11 M11-M12 B12-C12 D12-E12 F12-G12 H12-J12 K12-L12 N12-N13 A13-B13 C13-D13 E13-F13
Thermal Characteristics
GJJ 167
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 C3 D4 B1 C2 D3 E4 C1 D2 E3 D1 F5 E2 F4 E1 F3 F2 F1 F6 F7 G1 G2 G3 G4 H1 H2 G5 J1 H3 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 J2 H4 K1 J3 K2 H5 L1 J4 L2 M1 K3 J5 M2 N1 L3 K4 N2 M3 L4 K5 N3 M4 L5 N4 J6 M5 K6 N5 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 L6 M6 N6 H6 G6 N7 M7 L7 K7 N8 M8 J7 N9 L8 M9 K8 N10 L9 M10 J8 N11 K9 M11 N12 L10 J9 M12 N13 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112
PIN ASSIGNMENT NET LIST
PIN# BALL# 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 C8 B8 A8 F8 G8 A7 B7 C7 D7 A6 B6 E7 A5 C6 B5 D6 A4 C5 B4 E6 A3 D5 B3 A2 C4 E5 B2 L11 K10 M13 L12 K11 J10 L13 K12 J11 K13 H9 J12 H10 J13 H11 H12 H13 H8 H7 G13 G12 G11 G10 F13 F12 G9 E13 F11 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 E12 F10 D13 E11 D12 F9 C13 E10 C12 B13 D11 E9 B12 A13 C11 D10 A12 B11 C10 D9 A11 B10 C9 A10 E8 B9 D8 A9
PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL#
Productization
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-3
Appendix B Package Data Sheets
Package Data Sheets
151GHZ PACKAGE OUTLINE (10 x 10 mm, 0.5 mm pitch)
GHZ (S-PBGA-N151) PLASTIC BALL GRID ARRAY GHZ 151 TOP VIEW DAISY CHAIN NET LIST
18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics A B C D E F G H J K L MN P R T U V R13-T13 P13-T14 R14-V14 R15-T15 T16-V16 V17-V18 U17-U18 P14-T18 R16-R18 P15-P16 N15-N18 M15-N16 L15-M16 L16-L18 K15-K16 J15-J16 H15-J18 G15-H16 G16-G18 F15-F16 E16-F14 E15-E18 D15-D16 C16-C18 A18-B18 A17-B17 A16-E14 A15-C15 C14-D14 A13-D13 C13-D12 C12-D11 A11-C11 C10-D10 C9-D9 A9-D8 C8-D7 A7-C7 C6-D6 A5-C5 C4-D5 C3-D4 A2-A3
Thermal Characteristics
B1-B2 C1-E5 D1-D3 E3-E4 F1-F4 F3-G4 G3-H4 H1-H3 J3-J4 K3-K4 K1-L4 L3-M4 M1-M3 N3-N4 N5-P3 P1-P4 NC - E6
R3-R4 T1-T3 U1-V1 U2-V2 P5-V3 T4-V4 R5-T5 R6-V6 R7-T6 R8-T7 T8-V8 R9-T9 R10-T10 R11-V10 R12-T11 T12-V12
GHZ 151
PIN# BALL# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 B2 B1 C1 E5 D1 D3 E4 E3 F4 F1 F3 G4 G3 H4 H1 H3 J4 J3 K4 K3 K1 L4 L3 M4 M3 M1 N4 N3 N5 P3 PIN# 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 BALL# P1 P4 R3 R4 T3 T1 U1 V1 U2 V2 V3 P5 V4 T4 R5 T5 R6 V6 T6 R7 T7 R8 V8 T8 R9 T9 R10 T10 V10 R11 PIN# 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 T11 R12 T12 V12 R13 T13 P13 T14 V14 R14 T15 R15 T16 V16 V17 V18 U17 U18 T18 P14 R18 R16 P15 P16 N15 N18 N16 M15 M16 L15
PIN ASSIGNMENT NET LIST
BALL# PIN# 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 BALL# L18 L16 K15 K16 J15 J16 J18 H15 H16 G15 G16 G18 F15 F16 F14 E16 E18 E15 D16 D15 C16 C18 B18 A18 B17 A17 A16 E14 A15 C15 PIN# 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 BALL# D14 C14 D13 A13 C13 D12 C12 D11 A11 C11 D10 C10 D9 C9 A9 D8 C8 D7 C7 A7 D6 C6 E6 C5 A5 D5 C4 D4 C3 A3 A2
Productization
Appendix B Package Data Sheets MicroStar BGA is a trademark of Texas Instruments Incorporated. B-4
MicroStar BGA Packaging Reference Guide
Package Data Sheets
100GGM PACKAGE OUTLINE (10 x 10 mm, 0.8 mm pitch)
GGM (S-PBGA-N100) PLASTIC BALL GRID ARRAY GGM 100 TOP VIEW DAISY CHAIN NET LIST
10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F GHJ B2-B1 C2-C3 C1-D2 D1-D3 E1-E2 E3-E4 F1-F2 F3-F4 G4-G1 G2-G3 H1-H2 J1-K1 J2-K2 J3-H3 K3-J4 K4-H4 K5-J5 H5-G5 K6-J6 H6-G6 G7-K7 J7-H7 K8-J8 K9-K10 J9-J10 H9-H8 H10-G9 G10-G8 F10-F9 F8-F7 E10-E9 E8-E7 D7-D10 D9-D8 C10-C9 B10-A10 K
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.071 0.076 0.081 L (nH) 1.999 2.425 2.957 C (pF) 0.296 0.440 0.589
Thermal Characteristics
B9-A9 B8-C8 A8-B7 A7-C7 A6-B6 C6-D6 A5-B5 C5-D5 D4-A4 B4-C4 A3-B3 A2-A1
NC - E5,E6,F5,F6
GGM 100
PIN# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 BALL# B2 B1 C2 C3 C1 D2 D1 D3 E1 E2 E3 E4 E5 F1 F2 F3 F4 G4 G1 G2 G3 H1 H2 J1 K1 PIN# 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 BALL# J2 K2 J3 H3 K3 J4 K4 H4 K5 J5 H5 G5 F5 K6 J6 H6 G6 G7 K7 J7 H7 K8 J8 K9 K10
PIN ASSIGNMENT NET LIST
PIN# 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 BALL# J9 J10 H9 H8 H10 G9 G10 G8 F10 F9 F8 F7 F6 E10 E9 E8 E7 D7 D10 D9 D8 C10 C9 B10 A10 PIN# 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 BALL# B9 A9 B8 C8 A8 B7 A7 C7 A6 B6 C6 D6 E6 A5 B5 C5 D5 D4 A4 B4 C4 A3 B3 A2 A1
Productization
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-5
Appendix B Package Data Sheets
Package Data Sheets
64GGV PACKAGE OUTLINE (8 x 8 mm, 0.8 mm pitch)
GGV (S-PBGA-N64) PLASTIC BALL GRID ARRAY GGV 64 TOP VIEW DAISY CHAIN NET LIST
8 7 6 5 4 3 2 1 INDEX MARK ABCDEFGH A1-B1 C2-C1 D4-D3 D1-D2 E2-E1 E3-F1 F2-F3 G1-G2 H1-H2 G3-H3 E4-F4 H4-G4 G5-H5 F5-H6 G6-F6 H7-G7 H8-G8 F7-F8 E5-E6 E8-E7 D7-D8 D6-C8 C7-C6 B8-B7 A8-A7 B6-A6 D5-C5 A5-B5 B4-A4 C4-A3 B3-C3 A2-B2
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.071 0.076 0.082 L (nH) 2.002 2.544 3.443 C (pF) 0.273 0.380 0.580
Thermal Characteristics
GGV 64
PIN ASSIGNMENT NET LIST
PIN# BALL# 1 - A1 2 - B1 3 - C2 4 - C1 5 - D4 6 - D3 7 - D1 8 - D2 9 - E2 10 - E1 11 - E3 12 - F1 13 - F2 14 - F3 15 - G1 16 - G2
PIN# BALL# PIN# BALL# PIN# BALL# 17 - H1 18 - H2 19 - G3 20 - H3 21 - E4 22 - F4 23 - H4 24 - G4 25 - G5 26 - H5 27 - F5 28 - H6 29 - G6 30 - F6 31 - H7 32 - G7 33 - H8 34 - G8 35 - F7 36 - F8 37 - E5 38 - E6 39 - E8 40 - E7 41 - D7 42 - D8 43 - D6 44 - C8 45 - C7 46 - C6 47 - B8 48 - B7 49 - A8 50 - A7 51 - B6 52 - A6 53 - D5 54 - C5 55 - A5 56 - B5 57 - B4 58 - A4 59 - C4 60 - A3 61 - B3 62 - C3 63 - A2 64 - B2
Productization
Appendix B Package Data Sheets MicroStar BGA is a trademark of Texas Instruments Incorporated. B-6
MicroStar BGA Packaging Reference Guide
Package Data Sheets
80GGM PACKAGE OUTLINE (10 x 10 mm, 0.8 mm pitch)
GGM (S-PBGA-N80) PLASTIC BALL GRID ARRAY GGM 80 TOP VIEW DAISY CHAIN NET LIST
10 9 8 7 6 5 4 3 2 1 INDEX MARK
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.054 0.062 0.074 L (nH) 1.487 1.920 2.659 C (pF) 0.215 0.315 0.428
A B C D E F GHJ K
Thermal Characteristics
B2-B1 C2-C3 C1-D2 D1-D3 E1-E2 E3-F1 F2-F3 G1-G2 G3-H1 H2-J1
J2-K2 J3-H3 K3-J4 K4-H4 K5-J5 H5-K6 J6-H6 K7-J7 H7-K8 J8-K9
J9-J10 H9-H8 H10-G9 G10-G8 F10-F9 F8-E10 E9-E8 D10-D9 D8-C10 C9-B10
B9-A9 B8-C8 A8-B7 A7-C7 A6-B6 C6-A5 B5-C5 A4-B4 C4-A3 B3-A2
GGM 80 PIN# BALL# 1 B2 2 B1 3 C2 4 C3 5 C1 6 D2 7 D1 8 D3 9 E1 10 E2 11 E3 12 F1 13 F2 14 F3 15 G1 16 G2 17 G3 18 H1 19 H2 20 J1 PIN# 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 BALL# J2 K2 J3 H3 K3 J4 K4 H4 K5 J5 H5 K6 J6 H6 K7 J7 H7 K8 J8 K9
PIN ASSIGNMENT NET LIST PIN# 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 BALL# PIN# J9 61 J10 62 H9 63 H8 64 H10 65 G9 66 G10 67 G8 68 F10 69 F9 70 F8 71 E10 72 E9 73 E8 74 D10 75 D9 76 D8 77 C10 78 C9 79 B10 80 BALL# B9 A9 B8 C8 A8 B7 A7 C7 A6 B6 C6 A5 B5 C5 A4 B4 C4 A3 B3 A2
Productization
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-7
Appendix B Package Data Sheets
Package Data Sheets
100GGF PACKAGE OUTLINE (10 x 10 mm, 0.5 mm pitch)
GGF (S-PBGA-N100) PLASTIC BALL GRID ARRAY GGF 100 TOP VIEW DAISY CHAIN NET LIST
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK
A B C D E F G H J K L MN P R
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.011 0.022 0.035 L (nH) 0.676 1.026 1.606 C (pF) 0.102 0.172 0.339
Thermal Characteristics
B1-C2 R2-P3 C1-D2 R3-P4 D1-E2 R4-P5 E1-F2 R5-P6 F1-G2 R6-P7 G1-H2 R7-P8 J1-J2 R9-P9 K1-K2 R10-P10 L1-L2 R11-P11 M1-M2 R12-P12 N1-N2 R13-P13 P1-R1 R14-R15 NC-- H1, R8, H15, A8 GGF 100
P15-N14 N15-M14 M15-L14 L15-K14 K15-J14 J15-H14 G15-G14 F15-F14 E15-E14 D15-D14 C15-C14 B15-A15
A14-B13 A13-B12 A12-B11 A11-B10 A10-B9 A9-B8 A7-B7 A6-B6 A5-B5 A4-B4 A3-B3 A2-A1
PIN ASSIGNMENT NET LIST BALL# PIN# P15 76 N14 77 N15 78 M14 79 M15 80 L14 81 L15 82 K14 83 K15 84 J14 85 J15 86 H14 87 H15 88 G15 89 G14 90 F15 91 F14 92 E15 93 E14 94 D15 95 D14 96 C15 97 C14 98 B15 99 A15 100 BALL# A14 B13 A13 B12 A12 B11 A11 B10 A10 B9 A9 B8 A8 A7 B7 A6 B6 A5 B5 A4 B4 A3 B3 A2 A1
Productization
Appendix B Package Data Sheets
PIN# BALL# PIN# BALL# PIN# 51 26 1 R2 B1 52 27 2 P3 C2 53 28 3 R3 C1 54 29 4 P4 D2 55 30 5 R4 D1 56 31 6 P5 E2 57 32 7 R5 E1 58 33 8 P6 F2 59 34 9 R6 F1 60 35 10 P7 G2 61 36 11 R7 G1 62 37 12 P8 H2 63 38 13 R8 H1 64 39 14 R9 J1 65 40 15 P9 J2 41 16 R10 66 K1 67 42 17 P10 K2 68 43 18 R11 L1 69 44 19 P11 L2 45 20 R12 70 M1 71 46 21 P12 M2 47 22 R13 72 N1 73 48 23 P13 N2 49 24 R14 74 P1 50 25 R15 75 R1
MicroStar BGA is a trademark of Texas Instruments Incorporated. B-8
MicroStar BGA Packaging Reference Guide
Package Data Sheets
100GGT PACKAGE OUTLINE (11 x 11 mm, 0.8 mm pitch)
GGT (S-PBGA-N100) PLASTIC BALL GRID ARRAY GGT 100 TOP VIEW DAISY CHAIN NET LIST
11 10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F G HJ K L K2 K3 K4 K5 K6 L6 L8 J7 J8 H8 J9 H9 L11 K11 J11 G9 F9 G11 E11 E10 D10 D9 C10 C9 K10 J10 H10 G10 F10 F11 D11 E9 C11 D8 B11 C8
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.072 0.077 0.086 L (nH) 2.200 2.636 3.633 C (pF) 0.254 0.398 0.582
Thermal Characteristics
B2 A1 L1 C2 B1 L2 D2 C1 L3 E2 D1 L4 F2 F3 J6 E1 F1 L5 G2 L7 G1 H1 G3 K7 H3 H2 K8 J1 H4 L9 J2 K9 J3 J4 K1 L10 NC - E3,J5,H11,A8
GGT 100 PIN# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 BALL# PIN# A1 B2 B1 C2 C1 D2 E3 D1 E2 F3 F2 E1 F1 G1 G2 G3 H1 H2 H3 H4 J1 J2 J3 K1 J4 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
PIN ASSIGNMENT NET LIST BALL# PIN# L1 K2 L2 K3 L3 K4 J5 L4 K5 J6 K6 L5 L6 L7 L8 K7 J7 K8 J8 L9 H8 K9 J9 L10 H9 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 BALL# PIN# L11 K10 K11 J10 J11 H10 H11 G9 G10 F9 F10 G11 F11 E11 D11 E10 E9 D10 C11 D9 D8 C10 B11 C9 C8 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 BALL# A11 B10 A10 B9 A9 B8 A8 B7 A7 C7 C6 B6 A6 B5 A5 C5 D4 A4 B4 C4 A3 B3 C3 A2 D3
Productization
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-9
Appendix B Package Data Sheets
Package Data Sheets
144GGU PACKAGE OUTLINE (12 x 12 mm, 0.8 mm pitch)
GGU (S-PBGA-N144) PLASTIC BALL GRID ARRAY GGU 144 TOP VIEW DAISY CHAIN NET LIST
13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F G H J K L MN
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.052 0.055 0.062 L (nH) 1.438 1.958 3.095 C (pF) 0.215 0.305 0.563
Thermal Characteristics
A1-B1 C2-C1 D4-D3 D2-D1 E4-E3 E2-E1 F4-F3 F2-F1 G2-G1 G3-G4 H1-H2 H3-H4 J1-J2 J3-J4 K1-K2 K3-L1 L2-L3 M1-M2 GGU 144 PIN# BALL# 1 A1 2 B1 3 C2 4 C1 5 D4 6 D3 7 D2 8 D1 9 E4 10 E3 11 E2 12 E1 13 F4 14 F3 15 F2 16 F1 17 G2 18 G1 19 G3 20 G4 21 H1 22 H2 23 H3 24 H4 25 J1 26 J2 27 J3 28 J4 29 K1 30 K2 31 K3 32 L1 33 L2 34 L3 35 M1 36 M2
N1-N2 M3-N3 K4-L4 M4-N4 K5-L5 M5-N5 K6-L6 M6-N6 M7-N7 L7-K7 N8-M8 L8-K8 N9-M9 L9-K9 N10-M10 L10-N11 M11-L11 N12-M12
N13-M13 L12-L13 K10-K11 K12-K13 J10-J11 J12-J13 H10-H11 H12-H13 G12-G13 G11-G10 F13-F12 F11-F10 E13-E12 E11-E10 D13-D12 D11-C13 C12-C11 B13-B12
A13-A12 B11-A11 D10-C10 B10-A10 D9-C9 B9-A9 D8-C8 B8-A8 B7-A7 C7-D7 A6-B6 C6-D6 A5-B5 C5-D5 A4-B4 C4-A3 B3-C3 A2-B2
PIN ASSIGNMENT NET LIST PIN# BALL# 37 N1 38 N2 39 M3 40 N3 41 K4 42 L4 43 M4 44 N4 45 K5 46 L5 47 M5 48 N5 49 K6 50 L6 51 M6 52 N6 53 M7 54 N7 55 L7 56 K7 57 N8 58 M8 59 L8 60 K8 61 N9 62 M9 63 L9 64 K9 65 N10 66 M10 67 L10 68 N11 69 M11 70 L11 71 N12 72 M12 PIN# 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 BALL# N13 M13 L12 L13 K10 K11 K12 K13 J10 J11 J12 J13 H10 H11 H12 H13 G12 G13 G11 G10 F13 F12 F11 F10 E13 E12 E11 E10 D13 D12 D11 C13 C12 C11 B13 B12 PIN# BALL# 109 A13 110 A12 111 B11 112 A11 113 D10 114 C10 115 B10 116 A10 117 D9 118 C9 119 B9 120 A9 121 D8 122 C8 123 B8 124 A8 125 B7 126 A7 127 C7 128 D7 129 A6 130 B6 131 C6 132 D6 133 A5 134 B5 135 C5 136 D5 137 A4 138 B4 139 C4 140 A3 141 B3 142 C3 143 A2 144 B2
Productization
Appendix B Package Data Sheets MicroStar BGA is a trademark of Texas Instruments Incorporated. B-10
MicroStar BGA Packaging Reference Guide
Package Data Sheets
179GHH PACKAGE OUTLINE (12 x 12 mm, 0.8 mm pitch)
GHH (S-PBGA-N179) PLASTIC BALL GRID ARRAY GHH 179 TOP VIEW
14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F G HJ K L MN P
DAISY CHAIN NET LIST
B2-B1 C3-C2 C1-D4 D3-D2 D1-E4 E3-E2 E1-F4 F3-F2 F1-F5 G5-G2 G1-G3
H3-H1 H2-H4 H5-J1 J2-J3 J4-K1 K2-K3 J5-L1 L2-L3 K4-M1 M2-K5 N1-P1
N2-P2 M3-N3 P3-L4 M4-N4 P4-L5 M5-N5 P5-L6 M6-N6 P6-K6 K7-N7 P7-M7
M8-P8 N8-L8 K8-P9 N9-M9 L9-P10
N13-N14 G12-G14 B13-A13 C7-A7 M12-M13 G13-G11 C12-B12 B7-D7 M14-L11 G10-F14 A12-D11 E7-A6 L12-L13 L14-K11 F13-F12 F11-E14 C11-B11 A11-D10 B6-C6
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics
D6-A5 N10-M10 K12-K13 E13-E12 C10-B10 B5-C5 K9-P11 K14-J11 F10-D14 A10-D9 E6-A4 N11-M11 J12-J13 D13-D12 C9-B9 B4-C4 L10-P12 J14-J10 E11-C14 A9-E9 D5-A3 N12-K10 H10-H13 C13-E10 E8-B8 P13-P14 H14-H12 B14-A14 A8-C8 B3-E5 F6-A2
NC --- D8,G4,H11,L7,A2
Thermal Characteristics
GHH 179
PIN ASSIGNMENT NET LIST
PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 B2 B1 C3 C2 C1 D4 D3 D2 D1 E4 E3 E2 E1 F4 F3 F2 F1 F5 G5 G2 G1 G3 G4 H3 H1 H2 H4 H5 J1 J2 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 J3 J4 K1 K2 K3 J5 L1 L2 L3 K4 M1 M2 K5 N1 P1 N2 P2 M3 N3 P3 L4 M4 N4 P4 L5 M5 N5 P5 L6 M6 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 N6 P6 K6 K7 N7 P7 M7 L7 M8 P8 N8 L8 K8 P9 N9 M9 L9 P10 N10 M10 K9 P11 N11 M11 L10 P12 N12 K10 P13 P14 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 N13 N14 M12 M13 M14 L11 L12 L13 L14 K11 K12 K13 K14 J11 J12 J13 J14 J10 H10 H13 H14 H12 H11 G12 G14 G13 G11 G10 F14 F13 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 F12 F11 E14 E13 E12 F10 D14 D13 D12 E11 C14 C13 E10 B14 A14 B13 A13 C12 B12 A12 D11 C11 B11 A11 D10 C10 B10 A10 D9 C9 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 (179 180 B9 A9 E9 E8 B8 A8 C8 D8 C7 A7 B7 D7 E7 A6 B6 C6 D6 A5 B5 C5 E6 A4 B4 C4 D5 A3 B3 E5 F6 (ID ball)) A2
Productization
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-11
Appendix B Package Data Sheets
Package Data Sheets
176GGW PACKAGE OUTLINE (15 x 15 mm, 0.8 mm pitch)
GGW (S-PBGA-N176) PLASTIC BALL GRID ARRAY GGW 176 TOP VIEW
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F G H J K L MN P R T U
DAISY CHAIN NET LIST
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.075 0.083 0.099 L (nH) 1.595 2.417 3.284 C (pF) 0.204 0.298 0.425
Thermal Characteristics
B1-C2 C1-D3 D2-D1 E3-E2 E1-F3 F2-F1 G4-G3 G2-G1 H1-H4 H3-H2 J1-J4 J3-J2 K1-K2 K3-K4 L1-L2 L3-L4 M1-M2 M3-N1 N2-N3 P1-P2 P3-R1 R2-T1
U2-T3 U3-R4 T4-U4 R5-T5 U5-R6 T6-U6 P7-R7 T7-U7 U8-P8 R8-T8 U9-P9 R9-T9 U10-T10 R10-P10 U11-T11 R11-P11 U12-T12 R12-U13 T13-R13 U14-T14 R14-U15 T15-U16
T17-R16 R17-P15 P16-P17 N15-N16 N17-M15 M16-M17 L14-L15 L16-L17 K17-K14 K15-K16 J17-J14 J15-J16 H17-H16 H15-H14 G17-G16 G15-G14 F17-F16 F15-E17 E16-E15 D17-D16 D15-C17 C16-B17
A16-B15 A15-C14 B14-A14 C13-B13 A13-C12 B12-A12 D11-C11 B11-A11 A10-D10 C10-B10 A9-D9 C9-B9 A8-B8 C8-D8 A7-B7 C7-D7 A6-B6 C6-A5 B5-C5 A4-B4 C4-A3 B3-A2
GGW 176
PIN# BALL# PIN#BALL# 1 36 N1 B1 2 C2 37 N2 3 C1 38 N3 4 D3 39 P1 5 D2 40 P2 6 D1 41 P3 7 42 R1 E3 8 43 R2 E2 9 44 T1 E1 10 F3 45 U2 11 F2 46 T3 12 F1 47 U3 13 G4 48 R4 14 G3 49 T4 15 G2 50 U4 16 G1 51 R5 17 H1 52 T5 18 H4 53 U5 19 H3 54 R6 20 H2 55 T6 21 J1 56 U6 22 J4 57 P7 23 J3 58 R7 24 J2 59 T7 25 K1 60 U7 26 K2 61 U8 27 K4 62 P8 28 K3 63 R8 29 L1 64 T8 30 L2 65 U9 31 L3 66 P9 32 L4 67 R9 33 M1 68 T9 34 M2 69 U10 35 M3 70 T10 PIN# 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105
PIN ASSIGNMENT NET LIST
BALL# PIN# BALL# PIN# P10 106 K14 141 R10 107 K15 142 U11 108 K16 143 J17 T11 109 144 J14 R11 110 145 J15 P11 111 146 J16 U12 112 147 T12 113 H17 148 R12 114 H16 149 U13 115 H14 150 T13 116 H15 151 R13 117 G17 152 U14 118 G16 153 T14 119 G15 154 R14 120 G14 155 U15 121 F17 156 T15 122 F16 157 U16 123 F15 158 T17 124 E17 159 R16 125 E16 160 R17 126 E15 161 P15 127 D17 162 P16 128 D16 163 P17 129 D15 164 N15 130 C17 165 N16 131 C16 166 N17 132 B17 167 M15 133 A16 168 M16 134 B15 169 M17 135 A15 170 L14 136 C14 171 L15 137 B14 172 L16 138 A14 173 L17 139 C13 174 K17 140 B13 175 176 BALL# A13 C12 B12 A12 D11 C11 B11 A11 A10 D10 C10 B10 A9 D9 C9 B9 A8 B8 D8 C8 A7 B7 C7 D7 A6 B6 C6 A5 B5 C5 A4 B4 C4 A3 B3 A2
Productization
Appendix B Package Data Sheets MicroStar BGA is a trademark of Texas Instruments Incorporated. B-12
MicroStar BGA Packaging Reference Guide
Package Data Sheets
208GGW PACKAGE OUTLINE (15 x 15 mm, 0.8 mm pitch)
GGW (S-PBGA-N208) PLASTIC BALL GRID ARRAY GGW 208 TOP VIEW
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F G H J K L MN P R T U
DAISY CHAIN NET LIST
B2-C2 B1-C1 D3-D2
J1-K4 K3-K2 K1-L4 L3-L2 L1-M4 M3-M2 M1-N4 N3-N2 N1-P4 P1-P3 P2-R1 R2-T1 R3-U1
T2-T3 U2-U3 R4-T4 U4-P5 R5-T5 U5-P6 R6-T6 U6-P7 R7-T7 U7-P8 R8-T8 U8-P9 R9-T9
U9-P10 R10-T10 U10-P11 R11-T11 U11-P12 R12-T12 U12-P13 R13-T13 U13-P14 U14-R14 T14-U15 T15-U16 R15-U17
T16-R16 T17-R17 P15-P16
J17-H14
B16-B15
A9-D8 C8-B8 A8-D7 C7-B7 A7-D6 C6-B6 A6-D5 C5-B5 A5-D4 A4-C4 B4-A3 B3-A2 C3-A1
H15-H16 A16-A15 H17-G14 C14-B14
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.070 0.075 0.079 L (nH) 1.824 2.266 3.416 C (pF) 0.217 0.278 0.433
D1-E4 E3-E2 E1-F4 F3-F2 F1-G4 G3-G2 G1-H4 H3-H2 H1-J4 J3-J2
P17-N14 G15-G16 A14-D13 N15-N16 G17-F14 N17-M14 F15-F16 M15-M16 F17-E14 M17-L14 E15-E16 L15-L16 L17-K14 K15-K16 K17-J14 J15-J16 E17-D14 C13-B13 A13-D12 C12-B12 A12-D11 C11-B11
D17-D15 A11-D10 D16-C17 C10-B10 C16-B17 C15-A17 A10-D9 C9-B9
Thermal Characteristics
GGW 208
PIN ASSIGNMENT NET LIST
PIN# BALL# PIN# BALL#PIN# BALL#PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN#BALL# 1 2 3 4 5 6 7 8 9 10 11 12 B2 C2 B1 C1 D3 D2 D1 E4 E3 E2 E1 F4 F3 F2 F1 G4 G3 G2 G1 H4 H3 H2 H1 J4 J3 J2 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 J1 K4 K3 K2 K1 L4 L3 L2 L1 M4 M3 M2 M1 N4 N3 N2 N1 P4 P1 P3 P2 R1 R2 T1 R3 U1 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 T2 T3 U2 U3 R4 T4 U4 P5 R5 T5 U5 P6 R6 T6 U6 P7 R7 T7 U7 P8 R8 T8 U8 P9 R9 T9 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 U9 P10 R10 T10 U10 P11 R11 T11 U11 P12 R12 T12 U12 P13 R13 T13 U13 P14 U14 R14 T14 U15 T15 U16 R15 U17 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 T16 R16 T17 R17 P15 P16 P17 N14 N15 N16 N17 M14 M15 M16 M17 L14 L15 L16 L17 K14 K15 K16 K17 J14 J15 J16 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 J17 H14 H15 H16 H17 G14 G15 G16 G17 F14 F15 F16 F17 E14 E15 E16 E17 D14 D17 D15 D16 C17 C16 B17 C15 A17 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 B16 B15 A16 A15 C14 B14 A14 D13 C13 B13 A13 D12 C12 B12 A12 D11 C11 B11 A11 D10 C10 B10 A10 D9 C9 B9 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 A9 D8 C8 B8 A8 D7 C7 B7 A7 D6 C6 B6 A6 D5 C5 B5 A5 D4 A4 C4 B4 A3 B3 A2 C3 A1
Productization
13 14 15 16 17 18 19 20 21 22 23 24 25 26
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-13
Appendix B Package Data Sheets
Package Data Sheets
240GGW PACKAGE OUTLINE (15 x 15 mm, 0.8 mm pitch)
GGW (S-PBGA-N240) PLASTIC BALL GRID ARRAY GGW 240 TOP VIEW
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 INDEX MARK A B C D E F GH J K L MNP R T U
DAISY CHAIN NET LIST
B2-C2 B1-C1 D3-D2 D1-E5
J2-J1 K5-K4 K3-K2 K1-L5 L4-L3 L2-L1 M5-M4 M3-M2 M1-N4
T2-T3 U2-U3 R4-T4 U4-N5 P5-R5 T5-U5 N6-P6 R6-T6 U6-N7 P7-R7 T7-U7 N8-P8 R8-T8 U8-N9 P9-R9
T9-U9 N10-P10 R10-T10 U10-N11 P11-R11 T11-U11 N12-P12 R12-T12 U12-P13 R13-T13 U13-P14 U14-R14 T14-U15 T15-U16 R15-U17
T16-R16 T17-R17 P15-P16
J16-J17 H13-H14 H15-H16
B16-B15 B9-A9 A16-A15 E8-D8 C14-B14 C8-B8 A14-E13 A8-E7 D13-C13 D7-C7 B13-A13 B7-A7 E12-D12 E6-D6 C12-B12 C6-B6 A12-E11 A6-D5 D11-C11 C5-B5 B11-A11 A5-D4
P17-N13 H17-G13 N14-N15 G14-G15 N16-N17 G16-G17 M13-M14 F13-F14 M15-M16 F15-F16 M17-L13 F17-E14 L14-L15 L16-L17 K13-K14 K15-K16 K17-J13 J14-J15 E15-E16 E17-D14 D17-D15 D16-C17 C16-B17 C15-A17
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics
E4-E3 E2-E1 F5-F4 F3-F2 F1-G5
G4-G3 N3-N2 G2-G1 N1-P4 H5-H4 H3-H2 H1-J5 P1-P3 P2-R1 R2-T1 R3-U1
E10-D10 A4-C4 C10-B10 B4-A3 A10-E9 D9-C9 B3-A2 C3-A1
Thermal Characteristics
J4-J3
GGW 240
1 2 3 4 5 6 7 8 9 10 11 12 13 14 B2 C2 B1 C1 D3 D2 D1 E5 E4 E3 E2 E1 F5 F4 F3 F2 F1 G5 G4 G3 G2 G1 H5 H4 H3 H2 H1 J5 J4 J3 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 J2 J1 K5 K4 K3 K2 K1 L5 L4 L3 L2 L1 M5 M4 M3 M2 M1 N4 N3 N2 N1 P4 P1 P3 P2 R1 R2 T1 R3 U1 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 T2 T3 U2 U3 R4 T4 U4 N5 P5 R5 T5 U5 N6 P6 R6 T6 U6 N7 P7 R7 T7 U7 N8 P8 R8 T8 U8 N9 P9 R9 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 T9 U9 N10 P10 R10 T10 U10 N11 P11 R11 T11 U11 N12 P12 R12 T12 U12 P13 R13 T13 U13 P14 U14 R14 T14 U15 T15 U16 R15 U17 121
PIN ASSIGNMENT NET LIST
T16 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 J16 J17 H13 H14 H15 H16 H17 G13 G14 G15 G16 G17 F13 F14 F15 F16 F17 E14 E15 E16 E17 D14 D17 D15 D16 C17 C16 B17 C15 A17 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 B16 B15 A16 A15 C14 B14 A14 E13 D13 C13 B13 A13 E12 D12 C12 B12 A12 E11 D11 C11 B11 A11 E10 D10 C10 B10 A10 E9 D9 C9 211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 B9 A9 E8 D8 C8 B8 A8 E7 D7 C7 B7 A7 E6 D6 C6 B6 A6 D5 C5 B5 A5 D4 A4 C4 B4 A3 B3 A2 C3 A1
PIN#BALL# PIN#BALL# PIN#BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL#
122 R16 123 T17
124 R17 125 126 127 P15 P16 P17
128 N13 129 N14 130 N15 131 N16 132 N17 133 M13 134 M14 135 M15 136 M16 137 M17 138 139 140 141 142 143 144 145 146 147 148 149 150 L13 L14 L15 L16 L17 K13 K14 K15 K16 K17 J13 J14 J15
Productization
15 16 17 18
Appendix B Package Data Sheets
19 20 21 22 23 24 25 26 27 28 29 30
MicroStar BGA is a trademark of Texas Instruments Incorporated. B-14
MicroStar BGA Packaging Reference Guide
Package Data Sheets
196GHC PACKAGE OUTLINE (15 x 15 mm, 1.0 mm pitch)
GHC (S-PBGA-N196) PLASTIC BALL GRID ARRAY GHC 196 TOP VIEW
14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK
DAISY CHAIN NET LIST
AB J4 J2 J5 K3 K2 L4 L3 N1 N5 P5 M5 L5 K5
CD
EF P10 P11 P12 N11 N12 N13 P14 N14
GHJ J14 J10 H13 H12 G12 G13 G10 F14 F12 E11 E14 D14 C14
K J11
L
MN
P E8 A7 D7 D6 B6 E6 C5 B5 D4 C4 A2 C7 B7 E7 A6 C6 D5 A5 A4 A3 B4 B3
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics R () Min. Mean Max. 0.078 0.092 0.123 L (nH) 2.174 3.288 6.418 C (pF) 0.256 0.470 1.071
B2 A1 B1 C1 E2 E3 F3 F1 F5
C2 D2 D3 D1 E1 E4 F2 F4 G4 G1 G5 H1 H4
H5 J1 J3 K4 K1 L1 M1 L2 M2 N2 P1 P2 P3
M10 N10 L11 M11 P13 M12 M13 L13 L12 L14 K14 K11 J12
D13
B14 C12 B12 B11 C11 A11 A10 D10 C9 A9 E9 B8 C8
H11 C13 H14 B13 H10 A14 G14 A13 G11 A12 F11 B10 F13 C10 F10 E10 E12 B9 E13 D9 D11 D8 D12 A8
M6
N6 P6 L6 L7 P7 K7 K6 N7 M7 M8 N8 K8 P9
M3 P8 N3 N4 L8 L9
M14 K13 K12 K10 J13
Thermal Characteristics
G2 G3 H3 H2
M4 N9 M9 P4 K9 L10
Internal connection - E5,F6,F7,F8,F9,G6,G7,G8,G9,H6,H7,H8,H9,J6,J7,J8,J9 NC - C3
GHC 196
PIN ASSIGNMENT NET LIST
PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# 1 2 3 4 5 6 7 8 B2 C2 A1 D2 B1 D3 C1 D1 E2 E1 E3 E4 F3 F2 F1 F4 F5 G4 G2 G1 G3 G5 H3 H1 H2 H4 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 H5 J4 J1 J2 J3 J5 K4 K3 K1 K2 L1 L4 M1 L3 L2 N1 M2 M3 N2 N3 P1 N4 P2 M4 P3 P4 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 N5 P5 M5 L5 K5 M6 N6 P6 L6 K6 L7 N7 P7 M7 K7 M8 P8 N8 L8 K8 L9 P9 N9 M9 K9 L10 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 M10 P10 N10 P11 L11 P12 M11 N11 P13 N12 M12 N13 M13 P14 L13 N14 L12 M14 L14 K13 K14 K12 K11 K10 J12 J13 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 J14 J11 J10 H11 H13 H14 H12 H10 G12 G14 G13 G11 G10 F11 F14 F13 F12 F10 E11 E12 E14 E13 D14 D11 C14 D12 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 D13 B14 C13 C12 B13 B12 A14 B11 A13 C11 A12 A11 B10 A10 C10 D10 E10 C9 B9 A9 D9 E9 D8 B8 A8 C8 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 E8 C7 A7 B7 D7 E7 D6 A6 B6 C6 E6 D5 C5 A5 B5 A4 D4 A3 C4 B4 A2 B3 C3
Productization
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Internal connection - E5,F6,F7,F8,F9,G6,G7,G8,G9,H6,H7,H8,H9,J6,J7,J8,J9
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-15
Appendix B Package Data Sheets
Package Data Sheets
257GHK PACKAGE OUTLINE (16 x 16 mm, 0.8 mm pitch)
GHK (S-PBGA-N257) PLASTIC BALL GRID ARRAY GHK 257 TOP VIEW
19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F G HJ K L MN P R T U V W R10-P10 U11-P11 V12-U12 P12-R12 U13-P13 R13-U14 V15-R14 V18-V19 U19-T18 P15-N14 R18-R19 N15-P19 N18-N19 K15-K14 J19-J18 J17-J14 J15-H19 H18-H17 H14-H15 G19-G18 G17-G14 G15-F17 B18-A18 A17-B16 E14-F13 B15-A15 E13-A14 F12-C13 B13-A13 B12-A12 A11-B11 C11-E11 F11-A10 E10-F10 C9-F9 B8-C8 F8-E8 C7-F7 A6-B6 E7-C6 B5-E6 C5-A4 B4-A3 C4-B3
DAISY CHAIN NET LIST
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics
B2-B1 K5-K6 V2-W2 D3-C2 L1-L2 C1-D2 L3-L6 U4-V3 W3-V4
W11-V11 T17-U18 R11-W12 T19-R17
C16-B17 A9-B9 A16-C15 E9-A8
D1-E3 L5-M1 W4-U5 F5-G6 M2-M3 R6-P7 E2-E1 M6-M5 V5-W5 F3-F2 N1-N2 U6-V6 G5-F1 N3-N6 R7-W6 H6-G3 P1-P2 P8-U7 G2-G1 N5-P3 V7-W7 H5-H3 R1-P6 R8-U8
W13-V13 P17-P18
C14-B14 A7-B7
W14-V14 M14-N17 F19-F18 W15-P14 M15-M17 E19-F14 M18-M19 E18-F15 E17-D19 D18-C19 D17-C18 B19-C17 U15-W16 L19-L18 V16-W17 L17-L15 L14-K19
E12-C12 A5-F6
Thermal Characteristics
H2-H1 R2-P5 V8-W8 J1-J2 J3-J5 J6-K1 R3-T1 W9-V9 T2-U1 U9-R9
T3-U2 P9-W10 U16-V17
K2-K3 V1-U3 V10-U10 W18-U17 K18-K17 NC-E5
B10-C10 A2-C3
GHK 257
PIN ASSIGNMENT NET LIST
PIN#BALL# PIN#BALL# PIN#BALL# 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 K15 K14 J19 J18 J17 J14 J15 H19 H18 H17 H14 H15 G19 G18 G17 G14 F19 F18 G15 F17 E19 F14 E18 F15 E17 D19 D18 C19 D17 C18 B19 C17 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 B18 A18 C16 B17 A17 B16 A16 C15 E14 F13 B15 A15 C14 B14 E13 A14 F12 C13 B13 A13 E12 C12 B12 A12 A11 B11 C11 E11 F11 A10 B10 C10 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 241 242 243 244 245 246 247 248 249 250 251 252 253 254 255 256 E10 F10 A9 B9 C9 F9 E9 A8 B8 C8 F8 E8 A7 B7 C7 F7 A6 B6 E7 C6 A5 F6 B5 E6 C5 A4 B4 A3 C4 B3 A2 C3
PIN#BALL# PIN#BALL# PIN#BALL# PIN#BALL# PIN#BALL# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 B2 B1 D3 C2 C1 D2 D1 E3 F5 G6 E2 E1 F3 F2 G5 F1 H6 G3 G2 G1 H5 H3 H2 H1 J1 J2 J3 J5 J6 K1 K2 K3 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 K5 K6 L1 L2 L3 L6 L5 M1 M2 M3 M6 M5 N1 N2 N3 N6 P1 P2 N5 P3 R1 P6 R2 P5 R3 T1 T2 U1 T3 U2 V1 U3 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 V2 W2 U4 V3 W3 V4 W4 U5 R6 P7 V5 W5 U6 V6 R7 W6 P8 U7 V7 W7 R8 U8 V8 W8 W9 V9 U9 R9 P9 W10 V10 U10 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 R10 P10 W11 V11 U11 P11 R11 W12 V12 U12 P12 R12 W13 V13 U13 P13 W14 V14 R13 U14 W15 P14 V15 R14 U15 W16 V16 W17 U16 V17 W18 U17 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 V18 V19 T17 U18 U19 T18 T19 R17 P15 N14 R18 R19 P17 P18 N15 P19 M14 N17 N18 N19 M15 M17 M18 M19 L19 L18 L17 L15 L14 K19 K18 K17
Productization
Appendix B Package Data Sheets
ID BALL - E5
MicroStar BGA is a trademark of Texas Instruments Incorporated. B-16
MicroStar BGA Packaging Reference Guide
Package Data Sheets
257GJG PACKAGE OUTLINE (16 x 16 mm, 0.8 mm pitch)
GJG (S-PBGA-N257) PLASTIC BALL GRID ARRAY GJG 257 TOP VIEW
19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 INDEX MARK A B C D E F G H J K L MN P R T U V W
DAISY CHAIN NET LIST
B2-B1 C1-C2 D1-D2 E4-E5 E1-E2 F5-F4 F1-F2 G6-G5 G2-G1 G4-H6 H1-H2 H4-H5 J4-J1 J2-J5 J6-K6 K1-K2
NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. MicroStar BGATM configuration Electrical Characteristics
K4-K5 L6-L1 L2-L4 L5-M6 M1-M2 M4-M5 N7-N1 N2-N4 N5-N6 P1-P2 P4-P5 P6-R1 R2-R4 T1-T2 U1-T4 U2-V1
V2-W2 T10-R10 W3-V3 P11-W11 W4-V4 V11-T11 R11-P12 T5-R5 W5-V5 W12-V12 T12-R12 R6-T6 W6-V6 N13-W13 V13-T13 P7-R7 V7-W7 R13-P13 W14-V14 T7-P8 W8-V8 T14-R14 P14-W15 T8-R8 T9-W9 V15-T15 W16-V16 V9-R9 P9-P10 W17-T16 W10-V10 V17-W18
V18-V19 U19-U18 T19-T18 R16-R15 R19-R18 P15-P16 P19-P18 N14-N15 N18-N19 N16-M14 M19-M18 M16-M15 L16-L19 L18-L15 L14-K14 K19-K18
K16-K15 J14-J19 J18-J16 J15-H14 H19-H18 H16-H15 G13-G19 G18-G16 G15-G14 F19-F18 F16-F15 F14-E19 E18-E16 D19-D18 C19-D16 C18-B19
B18-A18 D10-E10 A17-B17 A16-B16 D15-E15 A15-B15 E14-D14 A14-B14 F13-E13 B13-A13 D13-F12 A12-B12 D12-E12 D11-A11 B11-E11 F11-F10 A10-B10 F9-A9 B9-D9 E9-F8 A8-B8 D8-E8 G7-A7 B7-D7 E7-F7 A6-B6 D6-E6 F6-A5 B5-D5 A4-B4 A3-D4 B3-A2
ID BALL-C3
Thermal Characteristics GJG 257 PIN ASSIGNMENT NET LIST
PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN#BALL# PIN#BALL# 1 2 3 4 5 6 7 8 9 B2 B1 C1 C2 D1 D2 E4 E5 E1 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 K4 K5 L6 L1 L2 L4 L5 M6 M1 M2 M4 M5 N7 N1 N2 N4 N5 N6 P1 P2 P4 P5 P6 R1 R2 R4 T1 T2 U1 T4 U2 V1 65 V2 66 W2 67 W3 68 V3 69 W4 70 V4 71 T5 72 R5 73 W5 74 V5 75 R6 76 T6 77 W6 78 V6 79 P7 80 R7 81 V7 82 W7 83 T7 84 P8 85 W8 86 V8 87 T8 88 R8 89 T9 90 W9 91 V9 92 R9 93 P9 94 P10 95 W10 96 V10 97 T10 98 R10 99 P11 100 W11 101 V11 102 T11 103 R11 104 P12 105 W12 106 V12 107 T12 108 R12 109 N13 110 W13 111 V13 112 T13 113 R13 114 P13 115 W14 116 V14 117 T14 118 R14 119 P14 120 W15 121 V15 122 T15 123 W16 124 V16 125 W17 126 T16 127 V17 128 W18 129 V18 130 V19 131 U19 132 U18 133 T19 134 T18 135 R16 136 R15 137 R19 138 R18 139 P15 140 P16 141 P19 142 P18 143 N14 144 N15 145 N18 146 N19 147 N16 148 M14 149 M19 150 M18 151 M16 152 M15 153 L16 154 L19 155 L18 156 L15 157 L14 158 K14 159 K19 160 K18 161 K16 162 K15 163 J14 164 J19 165 J18 166 J16 167 J15 168 H14 169 H19 170 H18 171 H16 172 H15 173 G13 174 G19 175 G18 176 G16 177 G15 178 G14 179 F19 180 F18 181 F16 182 F15 183 F14 184 E19 185 E18 186 E16 187 D19 188 D18 189 C19 190 D16 191 C18 192 B19 193 B18 194 A18 195 A17 196 B17 197 A16 198 B16 199 D15 200 E15 201 A15 202 B15 203 E14 204 D14 205 A14 206 B14 207 F13 208 E13 209 B13 210 A13 211 D13 212 F12 213 A12 214 B12 215 D12 216 E12 217 D11 218 A11 219 B11 220 E11 221 F11 222 F10 223 A10 224 B10 225 D10 226 E10 227 F9 228 A9 229 B9 230 D9 231 E9 232 F8 233 A8 234 B8 235 D8 236 E8 237 G7 238 A7 239 B7 240 D7 241 E7 242 F7 243 A6 244 B6 245 D6 246 E6 248 A5 249 B5 250 D5 251 A4 252 B4 253 A3 254 D4 255 B3 256 A2 247 F6
10 E2 11 F5 12 F4 13 F1 14 F2 15 G6 16 G5 17 G2 18 G1 19 G4 20 H6 21 H1 22 H2 23 H4 24 H5 25 J4 26 J1 27 J2 28 J5 29 J6 30 K6 31 K1 32 K2
Productization
1PIN MARK - C3
MicroStar BGA is a trademark of Texas Instruments Incorporated.
MicroStar BGA Packaging Reference Guide
B-17
Appendix B Package Data Sheets
Package Data Sheets
Notes
B-18
MicroStar BGA Packaging Reference Guide

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