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EC1078
Product Features
DC - 3.5 GHz +21 dBm P1dB at 1 GHz +37 dBm OIP3 at 1 GHz 20 dB Gain at 1 GHz 4.4 dB Noise Figure at 2 GHz Available in Lead-free / green SOT-89 Package Style * Internally matched to 50 * * * * * *
InGaP HBT Gain Block
Product Description
The EC1078B is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the EC1078B typically provides 20 dB of gain, +37 dBm Output IP3, and +21 dBm P1dB. The EC1078B consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a low-cost, surface-mountable lead-free/green/RoHS-compliant SOT89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the EC1078B will work for other various applications within the DC to 3.5 GHz frequency range such as CATV and mobile wireless.
Functional Diagram
GND 4
1 RF IN
2 GND
3 RF OUT
Applications
* * * * * Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro
Function Input Output/Bias Ground
Pin No. 1 3 2, 4
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Large-signal Gain (3) Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Test Frequency Gain Device Voltage Device Current
Typical Performance (1)
Units
MHz MHz dB dBm dBm MHz dB dB dB dB dBm dBm dB MHz dB V mA
Min
DC
Typ
1000 20 +21 +37 2000 17 16 12 8 +20 +33 4.4 3000 14.5 5.6 96
Max
3500
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 20.7 -13 -12 +20.6 +37.5 3.1
Typical
900 20 -14 -12 +21 +37 3.5 1900 17.2 -14 -12 +20.5 +33.5 4.3 2140 16.6 -15 -12 +20 +32.5 4.4
14.7
13 5.3
5.9
1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +7 V, Rbias = 14 , 50 System. 2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Large-signal gain is tested with an input power level of +3 dBm.
Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature
Rating
-40 to +85 C -55 to +150 C 150 mA +12 dBm +250 C
Ordering Information
Part No.
EC1078B-G EC1078B-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
700 - 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 1 of 4 April 2007
EC1078
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +7 V, Rbias = 14 , Icc = 96 mA
MHz dB dB dB dBm dBm dB 100 21.2 -13 -11 +20 +38 3.4 500 20.7 -13 -12 +20.6 +37.5 3.5 900 20 -14 -12 +21 +37 3.5 1900 17.2 -14 -12 +20.5 +33.5 3.8 2140 16.6 -15 -12 +20 +32.5 3.8 2400 15.9 -15 -11 +19 +32 3.9 3500 13.5 -13 -9.2
1. Test conditions: T = 25 C, Supply Voltage = +7 V, Device Voltage = 5.6 V, Rbias = 14 , Icc = 96 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +7 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.
Gain vs. Frequency 30 25
Gain (dB)
S11, S22 vs. Frequency 0 -4 S11, S22 (dB) -8 S22
200 160 Icc (mA) 120 25C 80 40 0
Icc vs. Vde
20 15 10 5 0 0 1 2 3 4 Frequency (GHz) OIP3 vs. Frequency 40 35 5 6
-12 -16 -20 0 1 2 3 4 Frequency (GHz)
S11
5
6
0
2
4 Vde (V)
6
8
Noise Figure vs. Frequency 6 5 P1dB (dBm)
NF (dB)
P1dB vs. Frequency 24
OIP3 (dBm)
20
30 25 25C 20 500 1000 85C -40C 2500 3000
4 3 2 500
16
25C 1000 1500 Frequency (MHz) 2000 12 500 1000
85C
-40C 2500 3000
1500 2000 Frequency (MHz)
1500 2000 Frequency (MHz)
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 4 April 2007
EC1078
InGaP HBT Gain Block
Recommended Application Circuit (EC1078B-PCB)
Vcc Icc = 96 mA
Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF OUT EC1078B C1 Blocking Capacitor R1 6 R2 6 C2 Blocking Capacitor
RF IN
Reference Designator L1 C1, C2, C3
50 820 nH .018 F
Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF
2500 18 nH 56 pF
3500 15 nH 39 pF
1. The proper values for the components are dependent upon the intended frequency of operation. 2. The component values in the table below are contained on the evaluation board to achieve optimal broadband performance. 3. R1 and R2 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to degrade about only 0.5 dB, while overall gain will be about 1 dB less than the performance shown in page 1 and 2 of this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz.
Recommended Bias Resistor Values Supply R bias value Size Voltage 7V 14.6 ohms 1210 8V 25 ohms 1210 9V 35 ohms 2010 10 V 46 ohms 2010 12 V 67 ohms 2512
The proper value for R bias is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +7 V. A 1% tolerance resistor is recommended.
Ref. Desig. L1 C1, C2 C3 C4 R1 R2 R3
Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 F chip capacitor Do Not Place 6 chip resistor 6 chip resistor 14 1% tolerance
Size 0603 0603 0603 0603 0603 2010
Typical Device S-Parameters
S-Parameters (Vdevice = +5.6 V, ICC = 96 mA, T = 25C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-13.94 -13.75 -13.18 -12.31 -11.09 -9.97 -8.87 -7.79 -6.76 -5.72 -4.72 -3.91 -3.22
-3.83 -39.71 -77.85 -113.82 -148.03 -177.99 154.89 129.58 106.00 85.30 66.77 51.00 37.49
21.57 20.96 19.93 18.86 17.94 16.84 15.65 14.44 13.18 11.80 10.39 8.85 7.41
176.70 148.92 122.53 98.71 76.48 54.17 33.67 13.81 -5.36 -23.83 -41.03 -57.10 -71.74
-24.12 -23.37 -22.08 -20.68 -19.38 -18.50 -17.80 -17.41 -17.25 -17.22 -17.40 -17.84 -18.28
0.80 6.98 8.80 4.63 -1.93 -11.42 -21.55 -32.42 -43.17 -53.97 -64.41 -74.10 -83.92
-11.86 -11.69 -10.82 -9.54 -8.31 -7.34 -6.41 -5.63 -4.78 -4.07 -3.41 -2.93 -2.53
-4.93 -48.17 -90.17 -126.09 -158.11 173.96 148.41 125.43 105.05 86.50 70.24 56.07 43.40
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 4 April 2007
EC1078
InGaP HBT Gain Block
EC1078B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260C reflow temperature) and leaded (maximum 245C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an "1078G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an "1078" designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating Land Pattern
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature Thermal Resistance, Rth
Rating
-40 to +85 C 128 C/W
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 4 April 2007

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