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| SPD06N60C3 CoolMOS Features TM Power Transistor Product Summary V DS @ T j,max R DS(on),max ID 650 0.75 6.2 V A * New revolutionary high voltage technology * Ultra low gate charge * Periodic avalanche rated * High peak current capability * Ultra low effective capacitances * Extreme dv /dt rated * Improved transconductance PG-TO252 Type SPD06N60C3 Package PG-TO252 Ordering Code Q67040-S4630 Marking 06N60C3 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 C T C=100 C Pulsed drain current1) Avalanche energy, single pulse Avalanche energy, repetitive t AR1),2) Avalanche current, repetitive t AR1) Drain source voltage slope Gate source voltage I D,pulse E AS E AR I AR dv /dt V GS V GS Power dissipation Operating and storage temperature Reverse diode dv/dt 7) Rev. 1.4 P tot T j, T stg dv/dt Page 1 I D=6.2 A, V DS=480 V, T j=125 C static AC (f >1 Hz) T C=25 C T C=25 C I D=3.1 A, V DD=50 V I D=6.2 A, V DD=50 V Value 6.2 3.9 18.6 200 0.5 6.2 50 20 30 74 -55 ... 150 15 W C V/ns 2005-10-05 A V/ns V mJ Unit A SPD06N60C3 Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case R thJC R thJA Thermal resistance, junction ambient SMD version, device on PCB, minimal footprint SMD version, device on PCB, 6 cm2 cooling area3) T sold 1.6 mm (0.063 in.) from case for 10 s 1.7 75 K/W Values typ. max. Unit - 50 - Soldering temperature *) - - 260 C Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Avalanche breakdown voltage Gate threshold voltage V (BR)DSS V GS=0 V, I D=250 A V (BR)DS V GS(th) V GS=0 V, I D=6.2 A V DS=V GS, I D=0.26 mA V DS=600 V, V GS=0 V, T j=25 C V DS=600 V, V GS=0 V, T j=150 C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=3.9 A, T j=25 C V GS=10 V, I D=3.9 A, T j=150 C Gate resistance Transconductance RG g fs f =1 MHz, open drain |V DS|>2|I D|R DS(on)max, I D=3.9 A 600 2.1 700 3 3.9 V Zero gate voltage drain current I DSS - 0.1 1 A - 0.68 100 100 0.75 nA - 1.82 1 5.6 S *) reflow soldering, MSL3 Rev. 1.4 Page 2 2005-10-05 SPDT06N60C3 Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance C iss C oss C rss V GS=0 V, V DS=25 V, f =1 MHz V GS=0 V, V DS=0 V to 480 V V DD=480 V, V GS=10 V, I D=6.2 A, R G=12 47 7 12 52 10 ns 620 200 17 28 pF Values typ. max. Unit Effective output capacitance, energy C o(er) related4) Effective output capacitance, time related5) Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage 1) C o(tr) t d(on) tr t d(off) tf Q gs Q gd Qg V plateau V DD=480 V, I D=6.2 A, V GS=0 to 10 V - 3.3 12 24 5.5 31 - nC V Pulse width limited by maximum temperature T j,max only Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f. 2) 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 4) C o(er) is a fixed capacitance that gives the same stored energy as C oss while V DS is rising from 0 to 80% V DSS. C o(tr) is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 to 80% V DSS. 5) 7) ISD<=ID, di/dt<=400A/us, VDClink=400V, Vpeak Page 3 2005-10-05 SPD06N60C3 Parameter Symbol Conditions min. Reverse Diode Diode continuous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current IS I S,pulse V SD t rr Q rr I rrm V R=480 V, I F=I S, di F/dt =100 A/s T C=25 C V GS=0 V, I F=6.2 A, T j=25 C 0.97 400 3.5 25 6.2 18.6 1.2 V ns C A A Values typ. max. Unit Typical Transient Thermal Characteristics Symbol Value typ. R th1 R th2 R th3 R th4 R th5 0.0325 0.0448 0.251 0.31 0.231 K/W C th1 C th2 C th3 C th4 C th5 C th6 Unit Symbol Value typ. 0.0000502 0.000303 0.000428 0.00243 0.00344 0.1986) Ws/K Unit C th6 models the additional heat capacitance of the package in case of non-ideal cooling. It is not needed if R thCA=0 K/W. 6) Rev. 1.4 Page 4 2005-10-05 SPD06N60C3 1 Power dissipation P tot=f(T C) 2 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p 80 102 limited by on-state resistance 1 s 60 10 1 10 s 100 s P tot [W] 40 I D [A] 100 DC 1 ms 10 ms 20 10-1 0 0 40 80 120 160 10-2 100 101 102 103 T C [C] V DS [V] 3 Max. transient thermal impedance I D=f(V DS); T j=25 C parameter: D=t p/T 101 4 Typ. output characteristics I D=f(V DS); T j=25 C parameter: V GS 20 20 V 7V 16 0.5 6.5 V 100 Z thJC [K/W] 12 0.2 0.1 0.05 0.02 0.01 single pulse I D [A] 6V 8 10 -1 5.5 V 4 5V 4.5 V 4V 10-2 10-6 10-5 10-4 10-3 10-2 10-1 100 0 0 5 10 15 20 t p [s] V DS [V] Rev. 1.4 Page 5 2005-10-05 SPD06N60C3 5 Typ. output characteristics I D=f(V DS); T j=150 C parameter: V GS 8 20 V 7V 6.5 V 5.5 V 6V 6 Typ. drain-source on-state resistance R DS(on)=f(I D); T j=150 C parameter: V GS 4 4V 4.5 V 5V 5.5 V 6 3 6V R DS(on) [] 5V I D [A] 20 V 4 2 4.5 V 2 4V 1 0 0 5 10 15 20 0 0 2 4 6 8 10 V DS [V] I D [A] 7 Drain-source on-state resistance R DS(on)=f(T j); I D=3.9 A; V GS=10 V 8 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 2 25 25 C 1.6 20 R DS(on) [] 1.2 15 98 % 0.8 I D [A] typ 10 150 C 0.4 5 0 -60 -20 20 60 100 140 180 0 0 2 4 6 8 10 T j [C] V GS [V] Rev. 1.4 Page 6 2005-10-05 SPD06N60C3 9 Typ. gate charge V GS=f(Q gate); I D=6.2 A pulsed parameter: V DD 12 10 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 102 10 25 C 120 V 480 V 25 C, 98% 150 C, 98% 8 101 150 C V GS [V] 6 I F [A] 100 10-1 0 10 20 30 0 0.5 1 1.5 2 2.5 4 2 0 Q gate [nC] V SD [V] 11 Avalanche SOA I AR=f(t AR) parameter: T j(start) 8 12 Avalanche energy E AS=f(T j); I D=3.1 A; V DD=50 V 250 200 6 150 4 E AS [mJ] 125 C 25 C -3 -2 -1 0 1 2 3 I AV [A] 100 2 50 0 10 10 10 10 10 10 10 0 20 60 100 140 180 t AR [s] T j [C] Rev. 1.4 Page 7 2005-10-05 SPD06N60C3 13 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=0.25 mA 14 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 700 104 660 103 Ciss V BR(DSS) [V] C [pF] 620 102 Coss 580 101 Crss 540 -60 -20 20 60 100 140 180 100 0 100 200 300 400 500 T j [C] V DS [V] 15 Typ. C oss stored energy E oss= f(V DS) 5 4 3 E oss [J] 2 1 0 0 100 200 300 400 500 600 V DS [V] Rev. 1.4 Page 8 2005-10-05 SPD06N60C3 Definition of diode switching characteristics Rev. 1.4 Page 9 2005-10-05 SPD06N60C3 PG-TO252-3-1: Outline , PG-TO-252-3-11 (D-PAK), PG-TO-252-3-21 (D-PAK) Rev. 1.4 Page 10 2005-10-05 SPD06N60C3 Published by Infineon Technologies AG 81726 Munchen Germany (c) Infineon Technologies AG 2006 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies office in Germany or our Infineon Technologies representatives worldwide (see address list). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.4 Page 11 2005-10-05 |
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