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14-Output Clock Generator with Integrated 2.8 GHz VCO AD9516-0
FEATURES
Low phase noise, phase-locked loop On-chip VCO tunes from 2.55 GHz to 2.95 GHz External VCO/VCXO to 2.4 GHz optional One differential or two single-ended reference inputs Reference monitoring capability Auto and manual reference switchover/holdover modes Autorecover from holdover Accepts references to 250 MHz Programmable delays in path to PFD Digital or analog lock detect, selectable 3 pairs of 1.6 GHz LVPECL outputs Each pair shares 1 to 32 divider with coarse phase delay Additive output jitter 225 fS rms Channel-to-channel skew paired outputs <10 ps 2 pairs of 800 MHz LVDS clock outputs Each pair shares two cascaded 1 to 32 dividers with coarse phase delay Additive output jitter 275 fS rms Fine delay adjust (T) on each LVDS output Eight 250 MHz CMOS outputs (two per LVDS output) Automatic synchronization of all outputs on power-up Manual synchronization of outputs as needed Serial control port 64-lead LFCSP
FUNCTIONAL BLOCK DIAGRAM
CP LF
SWITCHOVER AND MONITOR
REF1 REFIN REF2
STATUS MONITOR
PLL
VCO
CLK
DIVIDER AND MUXs OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 OUT9
DIV/ DIV/ DIV/ DIV/ DIV/ DIV/ DIV/
T T T T
LVPECL LVPECL LVPECL LVDS/CMOS LVDS/CMOS
Figure 1.
APPLICATIONS
Low jitter, low phase noise clock distribution Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs High performance wireless transceivers High performance instrumentation Broadband infrastructure ATE
The AD9516-0 features six LVPECL outputs (in three pairs); four LVDS outputs (in two pairs); and eight CMOS outputs (two per LVDS output). The LVPECL outputs operate to 1.6 GHz, the LVDS outputs operate to 800 MHz, and the CMOS outputs operate to 250 MHz. Each pair of outputs has dividers that allow both the divide ratio and coarse delay (or phase) to be set. The range of division for the LVPECL outputs is 1 to 32. The LVDS/CMOS outputs allow a range of divisions up to a maximum of 1024. The AD9516-0 is available in a 64-lead LFCSP and can be operated from a single 3.3 V supply. An external VCO, which requires an extended voltage range, can be accommodated by connecting the charge pump supply (VCP) to 5.5 V. A separate LVPECL power supply can be from 2.375 V to 3.6 V. The AD9516-0 is specified for operation over the industrial range of -40C to +85C.
1
GENERAL DESCRIPTION
The AD9516-0 1 provides a multi-output clock distribution function with subpicosecond jitter performance, along with an onchip PLL and VCO. The on-chip VCO tunes from 2.55 GHz to 2.95 GHz. Optionally, an external VCO/VCXO of up to 2.4 GHz may be used. The AD9516-0 emphasizes low jitter and phase noise to maximize data converter performance, and can benefit other applications with demanding phase noise and jitter requirements.
AD9516 is used throughout to refer to all the members of the AD9516 family. However, when AD9516-0 is used it is referring to that specific member of the AD9516 family.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2007 Analog Devices, Inc. All rights reserved.
06419-001
SERIAL CONTROL PORT AND DIGITAL LOGIC
AD9516-0
AD9516-0 TABLE OF CONTENTS
Features .............................................................................................. 1 Applications....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagram .............................................................. 1 Revision History ............................................................................... 3 Specifications..................................................................................... 4 Power Supply Requirements ....................................................... 4 PLL Characteristics ...................................................................... 4 Clock Inputs .................................................................................. 6 Clock Outputs ............................................................................... 6 Timing Characteristics ................................................................ 7 Clock Output Additive Phase Noise (Distribution Only; VCO Divider Not Used) ........................................................................ 8 Clock Output Absolute Phase Noise (Internal VCO Used).... 9 Clock Output Absolute Time Jitter (Clock Generation Using Internal VCO) ............................................................................. 10 Clock Output Absolute Time Jitter (Clock Cleanup Using Internal VCO) ............................................................................. 10 Clock Output Absolute Time Jitter (Clock Generation Using External VCXO) ......................................................................... 10 Clock Output Additive Time Jitter (VCO Divider Not Used) ....................................................................................................... 11 Clock Output Additive Time Jitter (VCO Divider Used) ..... 11 Delay Block Additive Time Jitter.............................................. 12 Serial Control Port ..................................................................... 12 PD, SYNC, and RESET Pins ..................................................... 13 LD, STATUS, REFMON Pins.................................................... 13 Power Dissipation....................................................................... 14 Timing Diagrams............................................................................ 15 Absolute Maximum Ratings.......................................................... 16 Thermal Resistance .................................................................... 16 ESD Caution................................................................................ 16 Pin Configuration and Function Descriptions........................... 17 Typical Performance Characteristics ........................................... 19 Terminology .................................................................................... 25 Detailed Block Diagram ................................................................ 26 Theory of Operation ...................................................................... 27 Operational Configurations...................................................... 27 High Frequency Clock Distribution--CLK or External VCO >1600 MHz ................................................................... 27 Internal VCO and Clock Distribution................................. 29
Rev. 0 | Page 2 of 84
Clock Distribution or External VCO <1600 MHz ............ 31 Phase-Locked Loop (PLL) .................................................... 33 Configuration of the PLL ...................................................... 33 Phase Frequency Detector (PFD) ........................................ 33 Charge Pump (CP)................................................................. 34 On-Chip VCO ........................................................................ 34 PLL External Loop Filter....................................................... 34 PLL Reference Inputs............................................................. 34 Reference Switchover............................................................. 35 Reference Divider R............................................................... 35 VCXO/VCO Feedback Divider N: P, A, B, R ..................... 35 Digital Lock Detect (DLD) ....................................................... 37 Analog Lock Detect (ALD)................................................... 37 Current Source Digital Lock Detect (DLD) ....................... 37 External VCXO/VCO Clock Input (CLK/CLK) ................ 37 Holdover.................................................................................. 38 Manual Holdover Mode ........................................................ 38 Automatic/Internal Holdover Mode.................................... 38 Frequency Status Monitors ................................................... 39 VCO Calibration .................................................................... 40 Clock Distribution ..................................................................... 41 Internal VCO or External CLK as Clock Source ............... 41 CLK or VCO Direct to LVPECL Outputs........................... 41 Clock Frequency Division..................................................... 42 VCO Divider........................................................................... 42 Channel Dividers--LVPECL Outputs................................. 42 Channel Dividers--LVDS/CMOS Outputs........................ 44 Synchronizing the Outputs--SYNC Function ................... 47 Clock Outputs......................................................................... 49 LVPECL Outputs: OUT0 to OUT5 ..................................... 49 LVDS/CMOS Outputs: OUT6 to OUT9............................. 50 Reset Modes ................................................................................ 50 Power-On Reset--Start-Up Conditions when VS Is Applied ........................................................................... 50 Asynchronous Reset via the RESET Pin ............................. 50 Soft Reset via 0x00<5> .......................................................... 50 Power-Down Modes .................................................................. 50 Chip Power-Down via PD .................................................... 50 PLL Power-Down................................................................... 51 Distribution Power-Down .................................................... 51
AD9516-0
Individual Clock Output Power-Down................................51 Individual Circuit Block Power-Down ................................51 Serial Control Port ..........................................................................52 Serial Control Port Pin Descriptions........................................52 General Operation of Serial Control Port ...............................52 Communication Cycle--Instruction Plus Data..................52 Write .........................................................................................52 Read ..........................................................................................53 The Instruction Word (16 Bits).................................................53 MSB/LSB First Transfers ............................................................53 Register Map Overview ..................................................................56 Register Map Descriptions.............................................................60 Application Notes............................................................................79 Using the AD9516 Outputs for ADC Clock Applications ....79 LVPECL Clock Distribution......................................................79 LVDS Clock Distribution...........................................................79 CMOS Clock Distribution.........................................................80 Outline Dimensions........................................................................81 Ordering Guide ...........................................................................81
REVISION HISTORY
4/07--Revision 0: Initial Version
Rev. 0 | Page 3 of 84
AD9516-0 SPECIFICATIONS
Typical (typ) is given for VS = VS_LVPECL = 3.3 V 5%; VS VCP 5.25 V; TA = 25C; RSET = 4.12 k; CPRSET = 5.1 k, unless otherwise noted. Minimum (min) and maximum (max) values are given over full VS and TA (-40C to +85C) variation.
POWER SUPPLY REQUIREMENTS
Table 1.
Parameter VS VS_LVPECL VCP RSET Pin Resistor CPRSET Pin Resistor BYPASS Pin Capacitor Min 3.135 2.375 VS Typ 3.3 Max 3.465 VS 5.25 Unit V V V k k nF Test Conditions/Comments This is 3.3 V 5% This is nominally 2.5 V to 3.3 V 5% This is nominally 3.3 V to 5.0 V 5% Sets internal biasing currents; connect to ground Sets internal CP current range, nominally 4.8 mA (CP_lsb = 600 A); actual current can be calculated by: CP_lsb = 3.06/CPRSET; connect to ground Bypass for internal LDO regulator; necessary for LDO stability; connect to ground
4.12 5.1 220
PLL CHARACTERISTICS
Table 2.
Parameter VCO (ON-CHIP) Frequency Range VCO Gain (KVCO) Tuning Voltage (VT) Min 2550 50 0.5 VCP - 0.5 Typ Max 2950 Unit MHz MHz/V V Test Conditions/Comments See Figure 15 See Figure 10 VCP VS when using internal VCO; outside of this range, the CP spurs may increase due to CP up/ down mismatch f = 2800 MHz f = 2800 MHz Differential mode (can accommodate singleended input by ac grounding undriven input) Frequencies below about 1 MHz should be dc-coupled; be careful to match VCM (self-bias voltage) PLL figure of merit will increase with increasing slew rate; see Figure 14 Self-bias voltage of REFIN 1 Self-bias voltage of REFIN1 Self-biased1 Self-biased1 Two single-ended CMOS-compatible inputs Slew rate > 50 V/s Slew rate > 50 V/s; CMOS levels Should not exceed VS p-p
Frequency Pushing (Open-Loop) Phase Noise @ 100 kHz Offset Phase Noise @ 1 MHz Offset REFERENCE INPUTS Differential Mode (REFIN, REFIN) Input Frequency Input Sensitivity Self-Bias Voltage, REFIN Self-Bias Voltage, REFIN Input Resistance, REFIN Input Resistance, REFIN Dual Single-Ended Mode (REF1, REF2) Input Frequency (AC-Coupled) Input Frequency (DC-Coupled) Input Sensitivity (AC-Coupled) Input Logic High Input Logic Low Input Current Input Capacitance 1.35 1.30 4.0 4.4 20 0 0
1 -105 -123
MHz/V dBc/Hz dBc/Hz
250 250 1.60 1.50 4.8 5.3 1.75 1.60 5.9 6.4 250 250 0.8
MHz mV p-p V V k k MHz MHz V p-p V V A pF
2.0 -100 2 0.8 +100
Each pin, REFIN/REFIN (REF1/REF2)
Rev. 0 | Page 4 of 84
AD9516-0
Parameter PHASE/FREQUENCY DETECTOR (PFD) PFD Input Frequency Antibacklash Pulse Width Min Typ Max 100 45 1.3 2.9 6.0 Unit MHz MHz ns ns ns Test Conditions/Comments Antibacklash pulse width = 1.3 ns, 2.9 ns Antibacklash pulse width = 6.0 ns 0x17<1:0> = 01b 0x17<1:0> = 00b; 0x17<1:0> = 11b 0x17<1:0> = 10b Programmable With CPRSET = 5.1 k CPV = VCP/2
CHARGE PUMP (CP) ICP Sink/Source High Value Low Value Absolute Accuracy CPRSET Range ICP High Impedance Mode Leakage Sink-and-Source Current Matching ICP vs. CPV ICP vs. Temperature PRESCALER (PART OF N DIVIDER) Prescaler Input Frequency P = 1 FD P = 2 FD P = 3 FD P = 2 DM (2/3) P = 4 DM (4/5) P = 8 DM (8/9) P = 16 DM (16/17) P = 32 DM (32/33) Prescaler Output Frequency PLL DIVIDER DELAYS 000 001 010 011 100 101 110 111 NOISE CHARACTERISTICS In-Band Phase Noise of the Charge Pump/Phase Frequency Detector (In-Band Means Within the LBW of the PLL) @ 500 kHz PFD Frequency @ 1 MHz PFD Frequency @ 10 MHz PFD Frequency @ 50 MHz PFD Frequency PLL Figure of Merit (FOM)
4.8 0.60 2.5 2.7/10 1 2 1.5 2
mA mA % k nA % % %
0.5 < CPV < VCP - 0.5 V 0.5 < CPV < VCP - 0.5 V CPV = VCP/2 V
300 600 900 600 1000 2400 3000 3000 300
MHz MHz MHz MHz MHz MHz MHz MHz MHz
A, B counter input frequency (prescaler input frequency divided by P) Register 0x19: R <5:3>, N <2:0>; see Table 53
Off 330 440 550 660 770 880 990
ps ps ps ps ps ps ps ps The PLL in-band phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20log(N) (where N is the value of the N divider)
-165 -162 -151 -143 -220
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
Reference slew rate > 0.25 V/ns. FOM +10log (fPFD) is an approximation of the PFD/CP in-band phase noise (in the flat region) inside the PLL loop bandwidth. When running closed loop, the phase noise, as observed at the VCO output, is increased by 20log(N)
Rev. 0 | Page 5 of 84
AD9516-0
Parameter PLL DIGITAL LOCK DETECT WINDOW 2 Required to Lock (Coincidence of Edges) Low Range (ABP 1.3 ns, 2.9 ns) High Range (ABP 1.3 ns, 2.9 ns) High Range (ABP 6 ns) To Unlock After Lock (Hysteresis)2 Low Range (ABP 1.3 ns, 2.9 ns) High Range (ABP 1.3 ns, 2.9 ns) High Range (ABP 6 ns)
1 2
Min
Typ
Max
Unit
3.5 7.5 3.5 7 15 11
ns ns ns ns ns ns
Test Conditions/Comments Signal available at LD, STATUS, and REFMON pins when selected by appropriate register settings Selected by 0x17<1:0> and 0x18<4> 0x17<1:0> = 00b, 01b,11b; 0x18<4> = 1b 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 0b 0x17<1:0> = 10b; 0x18<4> = 0b 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 1b 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 0b 0x17<1:0> = 10b; 0x18<4> = 0b
REFIN and REFIN self-bias points are offset slightly to avoid chatter on an open input condition. For reliable operation of the digital lock detect, the period of the PFD frequency must be greater than the unlock-after-lock time.
CLOCK INPUTS
Table 3.
Parameter CLOCK INPUTS (CLK, CLK) Input Frequency Input Sensitivity, Differential Input Level, Differential Input Common-Mode Voltage, VCM Input Common-Mode Range, VCMR Input Sensitivity, Single-Ended Input Resistance Input Capacitance
1
Min 01 01
Typ
Max 2.4 1.6
Unit GHz GHz mV p-p V p-p V V mV p-p k pF
150 2 1.3 1.3 3.9 1.57 150 4.7 2 1.8 1.8 5.7
Test Conditions/Comments Differential input High frequency distribution (VCO divider) Distribution only (VCO divider bypassed) Measured at 2.4 GHz. Jitter performance is improved with slew rates > 1 V/ns Larger voltage swings may turn on the protection diodes and can degrade jitter performance Self-biased; enables ac coupling With 200 mV p-p signal applied; dc-coupled CLK ac-coupled; CLK ac-bypassed to RF ground Self-biased
Below about 1 MHz, the input should be dc-coupled. Care should be taken to match VCM.
CLOCK OUTPUTS
Table 4.
Parameter LVPECL CLOCK OUTPUTS OUT0, OUT1, OUT2, OUT3, OUT4, OUT5 Output Frequency, Maximum Output High Voltage (VOH) Output Low Voltage (VOL) Output Differential Voltage (VOD) LVDS CLOCK OUTPUTS OUT6, OUT7, OUT8, OUT9 Output Frequency Differential Output Voltage (VOD) Delta VOD Output Offset Voltage (VOS) Delta VOS Short-Circuit Current (ISA, ISB) Min Typ Max Unit Test Conditions/Comments Termination = 50 to VS - 2 V Differential (OUT, OUT) Using direct to output; see Figure 25
2950 VS - 1.12 VS - 2.03 550
VS - 0.98 VS - 1.77 790
VS - 0.84 VS - 1.49 980
MHz V V mV
247 1.125
360 1.24 14
800 454 25 1.375 25 24
MHz mV mV V mV mA
Differential termination 100 @ 3.5 mA Differential (OUT, OUT) See Figure 26
Output shorted to GND
Rev. 0 | Page 6 of 84
AD9516-0
Parameter CMOS CLOCK OUTPUTS OUT6A, OUT6B, OUT7A, OUT7B, OUT8A, OUT8B, OUT9A, OUT9B Output Frequency Output Voltage High (VOH) Output Voltage Low (VOL) Min Typ Max Unit Test Conditions/Comments Single-ended; termination = 10 pF 250 VS - 0.1 0.1 MHz V V see Figure 27 @ 1 mA load @ 1 mA load
TIMING CHARACTERISTICS
Table 5.
Parameter LVPECL Output Rise Time, tRP Output Fall Time, tFP PROPAGATION DELAY, tPECL, CLK-TO-LVPECL OUTPUT High Frequency Clock Distribution Configuration Clock Distribution Configuration Variation with Temperature OUTPUT SKEW, LVPECL OUTPUTS 1 LVPECL Outputs That Share the Same Divider LVPECL Outputs on Different Dividers All LVPECL Outputs Across Multiple Parts LVDS Output Rise Time, tRL Output Fall Time, tFL PROPAGATION DELAY, tLVDS, CLK-TO-LVDS OUTPUT OUT6, OUT7, OUT8, OUT9 For All Divide Values Variation with Temperature OUTPUT SKEW, LVDS OUTPUTS1 LVDS Outputs That Share the Same Divider LVDS Outputs on Different Dividers All LVDS Outputs Across Multiple Parts CMOS Output Rise Time, tRC Output Fall Time, tFC PROPAGATION DELAY, tCMOS, CLK-TO-CMOS OUTPUT For All Divide Values Variation with Temperature OUTPUT SKEW, CMOS OUTPUTS1 CMOS Outputs That Share the Same Divider All CMOS Outputs on Different Dividers All CMOS Outputs Across Multiple Parts DELAY ADJUST 3 Shortest Delay Range 4 Zero Scale Full Scale Longest Delay Range4 Zero Scale Quarter Scale Full Scale Min Typ 70 70 835 773 995 933 0.8 5 13 Max 180 180 1180 1090 Unit ps ps ps ps ps/C ps ps ps ps ps Termination = 100 differential; 3.5 mA 20% to 80%, measured differentially 2 20% to 80%, measured differentially2 Delay off on all outputs Test Conditions/Comments Termination = 50 to VS - 2 V; level = 810 mV 20% to 80%, measured differentially 80% to 20%, measured differentially See Figure 42 See Figure 44
15 40 220 350 350
170 160
1.4
1.8 1.25 6 25
2.1
ns ps/C Delay off on all outputs ps ps ps ps ps ns ps/C Fine delay off ps ps ps LVDS and CMOS 0xA1 (0xA4) (0xA7) (0xAA) <5:0> 101111b 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 000000b 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 101111b 0xA1 (0xA4) (0xA7) (0xAA) <5:0> 000000b 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 000000b 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 001100b 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 101111b Termination = open 20% to 80%; CLOAD = 10 pF 80% to 20%; CLOAD = 10 pF Fine delay off
62 150 430 1000 985 2.6
495 475 1.6 2.1 2.6 4 28
66 180 675
50 540 200 1.72 5.7
315 880 570 2.31 8.0
680 1180 950 2.89 10.1
ps ps ps ns ns
Rev. 0 | Page 7 of 84
AD9516-0
Parameter Delay Variation with Temperature Short Delay Range5 Zero Scale Full Scale Long Delay Range 5 Zero Scale Full Scale
1 2 3
Min
Typ
Max
Unit
Test Conditions/Comments
0.23 -0.02 0.3 0.24
ps/C ps/C ps/C ps/C
This is the difference between any two similar delay paths while operating at the same voltage and temperature. Corresponding CMOS drivers set to A for noninverting, and B for inverting. The maximum delay that can be used is a little less than one-half the period of the clock. A longer delay disables the output. 4 Incremental delay; does not include propagation delay. 5 All delays between zero scale and full scale can be estimated by linear interpolation.
CLOCK OUTPUT ADDITIVE PHASE NOISE (DISTRIBUTION ONLY; VCO DIVIDER NOT USED)
Table 6.
Parameter CLK-TO-LVPECL ADDITIVE PHASE NOISE CLK = 1 GHz, OUTPUT = 1 GHz Divider = 1 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset @ 10 MHz Offset @ 100 MHz Offset CLK = 1 GHz, OUTPUT = 200 MHz Divider = 5 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK-TO-LVDS ADDITIVE PHASE NOISE CLK = 1.6 GHz, OUTPUT = 800 MHz Divider = 2 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset @ 10 MHz Offset @ 100 MHz Offset Min Typ Max Unit Test Conditions/Comments Distribution section only; does not include PLL and VCO Input slew rate > 1 V/ns
-109 -118 -130 -139 -144 -146 -147 -149
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Input slew rate > 1 V/ns
-120 -126 -139 -150 -155 -157 -157
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Distribution section only; does not include PLL and VCO Input slew rate > 1 V/ns
-103 -110 -120 -127 -133 -138 -147 -149
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
Rev. 0 | Page 8 of 84
AD9516-0
Parameter CLK = 1.6 GHz, OUTPUT = 400 MHz Divider = 4 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK-TO-CMOS ADDITIVE PHASE NOISE CLK = 1 GHz, OUTPUT = 250 MHz Divider = 4 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK = 1 GHz, OUTPUT = 50 MHz Divider = 20 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset Min Typ Max Unit Test Conditions/Comments Input slew rate > 1 V/ns
-114 -122 -132 -140 -146 -150 -155
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Distribution section only; does not include PLL and VCO Input slew rate > 1 V/ns
-110 -120 -127 -136 -144 -147 -154
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Input slew rate > 1 V/ns
-124 -134 -142 -151 -157 -160 -163
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
CLOCK OUTPUT ABSOLUTE PHASE NOISE (INTERNAL VCO USED)
Table 7.
Parameter LVPECL ABSOLUTE PHASE NOISE VCO = 2.95 GHz; OUTPUT = 2.95 GHz @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset @ 10 MHz Offset @ 40 MHz Offset VCO = 2.75 GHz; OUTPUT = 2.75 GHz @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset @ 10 MHz Offset @ 40 MHz Offset Min Typ Max Unit Test Conditions/Comments Internal VCO; direct to LVPECL output
-47 -78 -104 -122 -140 -146 -49 -79 -105 -123 -141 -146
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
Rev. 0 | Page 9 of 84
AD9516-0
Parameter VCO = 2.55 GHz; OUTPUT = 2.55 GHz @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset @ 10 MHz Offset @ 40 MHz Offset Min Typ -51 -80 -106 -125 -142 -146 Max Unit dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Test Conditions/Comments
CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING INTERNAL VCO)
Table 8.
Parameter LVPECL OUTPUT ABSOLUTE TIME JITTER Min Typ Max Unit Test Conditions/Comments Application example based on a typical setup where the reference source is clean, so a wider PLL loop bandwidth is used; reference = 15.36 MHz; R = 1 Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz
VCO = 2.95 GHz; LVPECL = 491.52 MHz; PLL LBW = 75 kHz VCO = 2.95 GHz; LVPECL = 122.88 MHz; PLL LBW = 75 kHz VCO = 2.70 GHz; LVPECL = 122.88 MHz; PLL LBW = 187 kHz VCO = 2.70 GHz; LVPECL = 61.44 MHz; PLL LBW = 187 kHz VCO = 2.58 GHz; LVPECL = 61.44 MHz; PLL LBW = 75 kHz
148 342 212 320 184 304 221 345 210 334
fS rms fS rms fS rms fS rms fS rms fS rms fS rms fS rms fS rms fS rms
CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK CLEANUP USING INTERNAL VCO)
Table 9.
Parameter LVPECL OUTPUT ABSOLUTE TIME JITTER Min Typ Max Unit Test Conditions/Comments Application example based on a typical setup where the reference source is jittery, so a narrower PLL loop bandwidth is used; reference = 19.44 MHz; R = 1 Integration BW = 12 kHz to 20 MHz Integration BW = 12 kHz to 20 MHz
VCO = 2.80 GHz; LVPECL = 155.52 MHz; PLL LBW = 12.8 kHz VCO = 2.95 GHz; LVPECL = 77.76 MHz; PLL LBW = 12.8 kHz
513 544
fS rms fS rms
CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING EXTERNAL VCXO)
Table 10.
Parameter LVPECL OUTPUT ABSOLUTE TIME JITTER Min Typ Max Unit Test Conditions/Comments Application example based on a typical setup using an external 245.76 MHz VCXO (Toyocom TCO-2112); reference = 15.36 MHz; R = 1 Integration BW = 200 kHz to 5 MHz Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz Integration BW = 200 kHz to 5 MHz Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz
LVPECL = 245.76 MHz; PLL LBW = 125 Hz
LVPECL = 122.88 MHz; PLL LBW = 125 Hz
54 77 109 79 114 163
fS rms fS rms fS rms fS rms fS rms fS rms
Rev. 0 | Page 10 of 84
AD9516-0
Parameter LVPECL = 61.44 MHz; PLL LBW = 125 Hz Min Typ 124 176 259 Max Unit fS rms fS rms fS rms Test Conditions/Comments Integration BW = 200 kHz to 5 MHz Integration BW = 200 kHz to 10 MHz Integration BW = 12 kHz to 20 MHz
CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER NOT USED)
Table 11.
Parameter LVPECL OUTPUT ADDITIVE TIME JITTER Min Typ Max Unit Test Conditions/Comments Distribution section only; does not include PLL and VCO; rising edge of clock signal BW = 12 kHz to 20 MHz BW = 12 kHz to 20 MHz Calculated from SNR of ADC method. DCC not used for even divides Calculated from SNR of ADIC method. DCC on Distribution section only; does not include PLL and VCO; rising edge of clock signal BW = 12 kHz to 20 MHz BW = 12 kHz to 20 MHz Calculated from SNR of ADC method. DCC not used for even divides Distribution section only; does not include PLL and VCO; rising edge of clock signal Calculated from SNR of ADC method. DCC not used for even divides
CLK = 622.08 MHz; LVPECL = 622.08 MHz; Divider = 1 CLK = 622.08 MHz; LVPECL = 155.52 MHz; Divider = 4 CLK = 1.6 GHz; LVPECL = 100 MHz; Divider = 16 CLK = 500 MHz; LVPECL = 100 MHz; Divider = 5 LVDS OUTPUT ADDITIVE TIME JITTER
40 80 215 245
fS rms fS rms fS rms fS rms
CLK = 1.6 GHz; LVDS = 800 MHz; Divider = 2; VCO Divider Not Used CLK = 1 GHz; LVDS = 200 MHz; Divider = 5 CLK = 1.6 GHz; LVDS= 100 MHz; Divider = 16 CMOS OUTPUT ADDITIVE TIME JITTER
85 113 280
fS rms fS rms fS rms
CLK = 1.6 GHz; CMOS = 100 MHz; Divider = 16
365
fS rms
CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER USED)
Table 12.
Parameter LVPECL OUTPUT ADDITIVE TIME JITTER CLK = 2.4 GHz; VCO Div = 2; LVPECL = 100 MHz; Divider = 12; Duty-Cycle Correction = Off LVDS OUTPUT ADDITIVE TIME JITTER CLK = 2.4 GHz; VCO Div = 2; LVDS = 100 MHz; Divider = 12; Duty-Cycle Correction = Off CMOS OUTPUT ADDITIVE TIME JITTER CLK = 2.4 GHz; VCO Div = 2; CMOS = 100 MHz; Divider = 12; Duty-Cycle Correction = Off Min Typ Max Unit Test Conditions/Comments Distribution section only; does not include PLL and VCO; uses rising edge of clock signal Calculated from SNR of ADC method Distribution section only; does not include PLL and VCO; Rising edge of clock signal Calculated from SNR of ADC method Distribution section only; does not include PLL and VCO; rising edge of clock signal Calculated from SNR of ADC method
210
fS rms
285
fS rms
350
fS rms
Rev. 0 | Page 11 of 84
AD9516-0
DELAY BLOCK ADDITIVE TIME JITTER
Table 13.
Parameter DELAY BLOCK ADDITIVE TIME JITTER 1 100 MHz Output Delay (1600 A, 1C) Fine Adj. 000000 Delay (1600 A, 1C) Fine Adj. 101111 Delay (800 A, 1C) Fine Adj. 000000 Delay (800 A, 1C) Fine Adj. 101111 Delay (800 A, 4C) Fine Adj. 000000 Delay (800 A, 4C) Fine Adj. 101111 Delay (400 A, 4C) Fine Adj. 000000 Delay (400 A, 4C) Fine Adj. 101111 Delay (200 A, 1C) Fine Adj. 000000 Delay (200 A, 1C) Fine Adj. 101111 Delay (200 A, 4C) Fine Adj. 000000 Delay (200 A, 4C) Fine Adj. 101111
1
Min
Typ
Max
Unit
Test Conditions/Comments Incremental additive jitter
0.54 0.60 0.65 0.85 0.79 1.2 1.2 2.0 1.3 2.5 1.9 3.8
ps rms ps rms ps rms ps rms ps rms ps rms ps rms ps rms ps rms ps rms ps rms ps rms
This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter should be added to this value using the root sum of squares (RSS) method.
SERIAL CONTROL PORT
Table 14.
Parameter CS (INPUT) Input Logic 1 Voltage Input Logic 0 Voltage Input Logic 1 Current Input Logic 0 Current Input Capacitance SCLK (INPUT) Input Logic 1 Voltage Input Logic 0 Voltage Input Logic 1 Current Input Logic 0 Current Input Capacitance SDIO (WHEN INPUT) Input Logic 1 Voltage Input Logic 0 Voltage Input Logic 1 Current Input Logic 0 Current Input Capacitance SDIO, SDO (OUTPUTS) Output Logic 1 Voltage Output Logic 0 Voltage Min 2.0 0.8 3 110 2 2.0 0.8 110 1 2 2.0 0.8 10 20 2 2.7 0.4 Typ Max Unit V V A A pF SCLK has an internal 30 k pull-down resistor V V A A pF V V nA nA pF V V Test Conditions/Comments CS has an internal 30 k pull-up resistor
Rev. 0 | Page 12 of 84
AD9516-0
Parameter TIMING Clock Rate (SCLK, 1/tSCLK) Pulse Width High, tHI Pulse Width Low, tLO SDIO to SCLK Setup, tDS SCLK to SDIO Hold, tDH SCLK to Valid SDIO and SDO, tDV CS to SCLK Setup and Hold, tS, tH CS Minimum Pulse Width High, tPWH Min Typ Max 25 16 16 2 1.1 8 2 3 Unit MHz ns ns ns ns ns ns ns Test Conditions/Comments
PD, SYNC, AND RESET PINS
Table 15.
Parameter INPUT CHARACTERISTICS Logic 1 Voltage Logic 0 Voltage Logic 1 Current Logic 0 Current Capacitance RESET TIMING Pulse Width Low SYNC TIMING Pulse Width Low Min 2.0 0.8 110 1 2 50 1.5 Typ Max Unit V V A A pF ns High speed clock cycles High speed clock is CLK input signal Test Conditions/Comments These pins each have a 30 k internal pull-up resistor
LD, STATUS, REFMON PINS
Table 16.
Parameter OUTPUT CHARACTERISTICS Min Typ Max Unit Test Conditions/Comments When selected as a digital output (CMOS); there are other modes in which these pins are not CMOS digital outputs; see Table 53, 0x17, 0x1A, and 0x1B
Output Voltage High (VOH) Output Voltage Low (VOL) MAXIMUM TOGGLE RATE
2.7 0.4 100
V V MHz
Applies when mux is set to any divider or counter output, or PFD up/down pulse; also applies in analog lock detect mode; usually only debug mode; beware that spurs may couple to output when any of these pins are toggling On-chip capacitance; used to calculate RC time constant for analog lock detect readback; use a pull-up resistor Frequency above which the monitor always indicates the presence of the reference Frequency above which the monitor always indicates the presence of the reference
ANALOG LOCK DETECT Capacitance REF1, REF2, AND VCO FREQUENCY STATUS MONITOR Normal Range Extended Range (REF1 and REF2 Only) LD PIN COMPARATOR Trip Point Hysteresis
3
pF
1.02 8
MHz kHz
1.6 260
V mV
Rev. 0 | Page 13 of 84
AD9516-0
POWER DISSIPATION
Table 17.
Parameter POWER DISSIPATION, CHIP Power-On Default Full Operation; CMOS Outputs at 229 MHz Min Typ 1.0 1.6 Max 1.2 2.2 Unit W W Test Conditions/Comments No clock; no programming; default register values; does not include power dissipated in external resistors PLL on; internal VCO = 2750 MHz; VCO divider = 2; all channel dividers on; six LVPECL outputs @ 687.5 MHz; eight CMOS outputs (10 pF load) @ 229 MHz; all fine delay on, maximum current; does not include power dissipated in external resistors PLL on; internal VCO = 2800 MHz, VCO divider = 2; all channel dividers on; six LVPECL outputs @ 700 MHz; four LVDS outputs @ 200 MHz; all fine delay on, maximum current; does not include power dissipated in external resistors PD pin pulled low; does not include power dissipated in terminations PD pin pulled low; PLL power-down 0x10<1:0> = 01b; SYNC power-down 0x230<2> = 1b; REF for distribution power-down 0x230<1> = 1b PLL operating; typical closed loop configuration Power delta when a function is enabled/disabled VCO divider not used All references off to differential reference enabled All references off to REF1 or REF2 enabled; differential reference not enabled CLK input selected to VCO selected PLL off to PLL on, normal operation; no reference enabled Divider bypassed to divide-by-2 to 32 No LVPECL output on to one LVPECL output on Second LVPECL output turned on, same channel No LVDS output on to one LVDS output on Second LVDS output turned on, same channel Static. No CMOS output on to one CMOS output on Static. Second CMOS output, same pair, turned on Static. First output, second pair, turned on Delay block off to delay block enabled; maximum current setting
Full Operation; LVDS Outputs at 200 MHz
1.6
2.3
W
PD Power-Down PD Power-Down, Maximum Sleep
75 31
185
mW mW
VCP Supply POWER DELTAS, INDIVIDUAL FUNCTIONS VCO Divider REFIN (Differential) REF1, REF2 (Single-Ended) VCO PLL Channel Divider LVPECL Channel (Divider Plus Output Driver) LVPECL Driver LVDS Channel (Divider Plus Output Driver) LVDS Driver CMOS Channel (Divider Plus Output Driver) CMOS Driver (Second in Pair) CMOS Driver (First in Second Pair) Fine Delay Block
1.5 30 20 4 70 75 30 160 90 120 50 100 0 30 50
mW mW mW mW mW mW mW mW mW mW mW mW mW mW mW
Rev. 0 | Page 14 of 84
AD9516-0 TIMING DIAGRAMS
tCLK
CLK
DIFFERENTIAL
tPECL
80% LVDS
tLVDS
06419-060
20%
06419-062
06419-063
tRL
tFL
tCMOS
Figure 2. CLK/CLK to Clock Output Timing, DIV = 1
DIFFERENTIAL 80% LVPECL 20%
06419-061
Figure 4. LVDS Timing, Differential
SINGLE-ENDED 80% CMOS 10pF LOAD 20%
tRP
tFP
tRC
tFC
Figure 3. LVPECL Timing, Differential
Figure 5. CMOS Timing, Single-Ended, 10 pF Load
Rev. 0 | Page 15 of 84
AD9516-0 ABSOLUTE MAXIMUM RATINGS
Table 18.
Parameter or Pin VS, VS_LVPECL VCP REFIN, REFIN REFIN RSET CPRSET CLK, CLK CLK SCLK, SDIO, SDO, CS OUT0, OUT0, OUT1, OUT1, OUT2, OUT2, OUT3, OUT3, OUT4, OUT4, OUT5, OUT5, OUT6, OUT6 OUT7, OUT7, OUT8, OUT8, OUT9, OUT9 SYNC REFMON, STATUS, LD Junction Temperature1 Storage Temperature Range Lead Temperature (10 sec)
1
With Respect to GND GND GND REFIN GND GND GND CLK GND GND
Rating -0.3 V to +3.6 V -0.3 V to+5.8 V -0.3 V to VS + 0.3 V -3.3 V to +3.3 V -0.3 V to VS + 0.3 V -0.3 V to VS + 0.3 V -0.3 V to VS + 0.3 V -1.2 V to +1.2 V -0.3 V to VS + 0.3 V -0.3 V to VS + 0.3 V
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
THERMAL RESISTANCE
Table 19.
Package Type1 64-Lead LFCSP
1
JA 24
Unit C/W
Thermal impedance measurements were taken on a 4-layer board in still air in accordance with EIA/JESD51-7.
ESD CAUTION
GND GND GND -0.3 V to VS + 0.3 V -0.3 V to VS + 0.3 V -0.3 V to VS + 0.3 V 150C -65C to +150C 300C
See Table 19 for JA.
Rev. 0 | Page 16 of 84
AD9516-0 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
REFIN (REF1) REFIN (REF2) CPRSET VS VS GND RSET VS OUT0 OUT0 VS_LVPECL OUT1 OUT1 VS VS VS
LVPECL LVPECL
LVDS/CMOS w/FINE DELAY ADJUST
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
LVPECL LVPECL
NC = NO CONNECT
CS NC NC NC SDO SDIO RESET PD OUT4 OUT4 VS_LVPECL OUT5 OUT5 VS VS VS 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
LVDS/CMOS w/FINE DELAY ADJUST
VS REFMON LD VCP CP STATUS REF_SEL SYNC LF BYPASS VS VS CLK CLK NC SCLK
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PIN 1 INDICATOR
AD9516-0
TOP VIEW (Not to Scale)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
OUT6 (OUT6A) OUT6 (OUT6B) OUT7 (OUT7A) OUT7 (OUT7B) GND OUT2 OUT2 VS_LVPECL OUT3 OUT3 VS GND OUT9 (OUT9B) OUT9 (OUT9A) OUT8 (OUT8B) OUT8 (OUT8A)
LVPECL LVPECL
Figure 6. Pin Configuration
Table 20. Pin Function Descriptions
Pin No. 1, 11, 12, 30, 31, 32, 38, 49, 50, 51, 57, 60, 61 2 3 4 5 6 7 8 9 10 13 14 15, 18, 19, 20 16 17 21 22 23 24 27, 41, 54 37, 44, 59, EPAD 56 Mnemonic VS Description 3.3 V Power Pins.
REFMON LD VCP CP STATUS REF_SEL SYNC LF BYPASS CLK CLK NC SCLK CS SDO SDIO RESET PD VS_LVPECL GND OUT0
Reference Monitor (Output). This pin has multiple selectable outputs; see Table 53 0x1B. Lock Detect (Output). This pin has multiple selectable outputs; see Table 53 0x1A. Power Supply for Charge Pump (CP); VS < VCP < 5.0 V. Charge Pump (Output). Connects to external loop filter. Status (Output). This pin has multiple selectable outputs; see Table 53 0x17. Reference Select. Selects REF1 (low) or REF2 (high). This pin has an internal 30 k pull-down resistor. Manual Synchronizations and Manual Holdover. This pin initiates a manual synchronization and is also used for manual holdover. Active low. This pin has an internal 30 k pull-up resistor. Loop Filter (Input). Connects to VCO control voltage node internally. This pin is for bypassing the LDO to ground with a capacitor. Along with CLK, this is the differential input for the clock distribution section. Along with CLK, this is the differential input for the clock distribution section. No Connection. Serial Control Port Data Clock Signal. Serial Control Port Chip Select; Active Low. This pin has an internal 30 k pull-up resistor. Serial Control Port Unidirectional Serial Data Out. Serial Control Port Bidirectional Serial Data In/Out. Chip Reset; Active Low. This pin has an internal 30 k pull-up resistor. Chip Power Down; Active Low. This pin has an internal 30 k pull-up resistor. Extended Voltage 2.5 V to 3.3 V LVPECL Power Pins. Ground Pins; Includes External Paddle (EPAD). LVPECL Output; One Side of a Differential LVPECL Output.
Rev. 0 | Page 17 of 84
06419-003
AD9516-0
Pin No. 55 53 52 43 42 40 39 25 26 28 29 48 47 46 45 33 34 35 36 58 62 63 64 Mnemonic OUT0 OUT1 OUT1 OUT2 OUT2 OUT3 OUT3 OUT4 OUT4 OUT5 OUT5 OUT6 (OUT6A) OUT6 (OUT6B) OUT7 (OUT7A) OUT7 (OUT7B) OUT8 (OUT8A) OUT8 (OUT8B) OUT9 (OUT9A) OUT9 (OUT9B) RSET CPRSET REFIN (REF2) REFIN (REF1) Description LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. Resistor Connected Here Sets Internal Bias Currents. Nominal value = 4.12 k. Resistor Connected Here Sets the CP Current Range. Nominal value = 5.1 k. Along with REFIN, this is the differential input for the PLL reference. Alternatively, this pin is a single-ended input for REF2. Along with REFIN, this is the differential input for the PLL reference. Alternatively, this pin is a single-ended input for REF1.
Rev. 0 | Page 18 of 84
AD9516-0 TYPICAL PERFORMANCE CHARACTERISTICS
300 280 260 240
CURRENT (mA)
65 3 CHANNELS - 6 LVPECL 60
220 200 180 160 140 120
06419-007
KVCO (MHz/V)
55
3 CHANNELS - 3 LVPECL
50
2 CHANNELS - 2 LVPECL 45
0
500
1000
1500
2000
2500
3000
2.65
2.75 VCO FREQUENCY (GHz)
2.85
2.95
FREQUENCY (MHz)
Figure 7. Current vs. Frequency, Direct to Output, LVPECL Outputs
180 2 CHANNELS - 4 LVDS
CURRENT FROM CP PIN (mA)
Figure 10. VCO KVCO vs. Frequency
5.0 4.5 4.0 3.5
PUMP DOWN PUMP UP
160
CURRENT (mA)
140 2 CHANNELS - 2 LVDS 120
3.0 2.5 2.0 1.5 1.0 0.5
100 1 CHANNEL - 1 LVDS
06419-008
0
200
400 FREQUENCY (MHz)
600
800
0
0.5
1.0
1.5
2.0
2.5
3.0
VOLTAGE ON CP PIN (V)
Figure 8. Current vs. Frequency--LVDS Outputs
240 220 200 2 CHANNEL - 8 CMOS
CURRENT (mA)
CURRENT FROM CP PIN (mA)
Figure 11. Charge Pump Characteristics @ VCP = 3.3 V
5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 PUMP DOWN PUMP UP
180 2 CHANNEL - 2 CMOS 160 140 120 1 CHANNEL - 2 CMOS 100 80 0 50 100 1 CHANNEL - 1 CMOS
06419-009
150
200
250
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
FREQUENCY (MHz)
VOLTAGE ON CP PIN (V)
Figure 9. Current vs. Frequency--CMOS Outputs
Figure 12. Charge Pump Characteristics @ VCP = 5.0 V
Rev. 0 | Page 19 of 84
06419-012
0
06419-011
80
0
06419-010
100
1 CHANNEL - 1 LVPECL
40 2.55
AD9516-0
-140
PFD PHASE NOISE REFERRED TO PFD INPUT (dBc/Hz)
10 0
-145
RELATIVE POWER (dB)
-10 -20 -30 -40 -50 -60 -70 -80 -90 -100
-150
-155
-160
-165
1
10
100
06419-013
CENTER 122.88MHz
5MHz/DIV
SPAN 50MHz
PFD FREQUENCY (MHz)
Figure 13. PFD Phase Noise Referred to PFD Input vs. PFD Frequency
-210 -212
PLL FIGURE OF MERIT (dBc/Hz)
10 0 -10
RELATIVE POWER (dB)
Figure 16. PFD/CP Spurs; 122.88 MHz; PFD = 15.36 MHz; LBW = 190 kHz; ICP = 4.2 mA; FVCO = 2.7 GHz
-214 -216 -218 -220 -222 -224 0 0.5 1.0 1.5 2.0 2.5 SLEW RATE (V/ns)
-20 -30 -40 -50 -60 -70 -80 -90 -100
06419-136
CENTER 122.8803006MHz
100kHz/DIV
SPAN 1MHz
Figure 14. PLL Figure of Merit (FOM) vs. Slew Rate at REFIN/REFIN
2.1
Figure 17. Output Spectrum, LVPECL; 122.88 MHz; PFD = 15.36 MHz; LBW = 190 kHz; ICP = 4.2 mA; FVCO = 2.7 GHz
10 0
1.9
VCO TUNING VOLTAGE (V)
RELATIVE POWER (dB)
-10 -20 -30 -40 -50 -60 -70 -80 -90 -100
06419-138
1.7
1.5
1.3
1.1
2.60
2.65
2.70
2.75
2.80
2.85
2.90
2.95
CENTER 122.8803006MHz
100kHz/DIV
SPAN 1MHz
FREQUENCY (GHz)
Figure 15. VCO Tuning Voltage vs. Frequency
Figure 18. Output Spectrum, LVDS; 122.88 MHz; PFD = 15.36 MHz; LBW = 190 kHz; ICP = 4.2 mA; FVCO = 2.7 GHz
Rev. 0 | Page 20 of 84
06419-134
0.9 2.55
-110
06419-135
-110
06419-137
-170 0.1
-110
AD9516-0
1.0 0.4
DIFFERENTIAL OUTPUT (V)
DIFFERENTIAL OUTPUT (V)
06419-014
0.6
0.2
0.2
0
-0.2
-0.2
-0.6
0
5
10 TIME (ns)
15
20
25
0
1 TIME (ns)
2
Figure 19. LVPECL Output (Differential) @ 100 MHz
1.0 2.8
DIFFERENTIAL OUTPUT (V) DIFFERENTIAL OUTPUT (V)
Figure 22. LVDS Output (Differential) @ 800 MHz
0.6
0.2
1.8
-0.2
0.8
-0.6
0
1 TIME (ns)
2
06419-015
0
20
40 TIME (ns)
60
80
100
Figure 20. LVPECL Output (Differential) @ 1600 MHz
0.4 2.8
DIFFERENTIAL OUTPUT (V)
Figure 23.CMOS Output @ 25 MHz
0.2
OUTPUT (V)
1.8
0
0.8 -0.2
0
5
10 TIME (ns)
15
20
25
06419-016
0
2
4
6 TIME (ns)
8
10
12
Figure 21. LVDS Output (Differential) @ 100 MHz
Figure 24. CMOS Output @ 250 MHz
Rev. 0 | Page 21 of 84
06419-019
-0.4
-0.2
06419-018
-1.0
-0.2
06419-017
-1.0
-0.4
AD9516-0
1600
-70 -80
DIFFERENTIAL SWING (mV p-p)
1400
PHASE NOISE (dBc/Hz)
06419-020
-90 -100 -110 -120 -130 -140 -150
06419-023 06419-025 06419-024
1200
1000
800 0 1 FREQUENCY (GHz) 2 3
-160 10k
100k
1M FREQUENCY (Hz)
10M
100M
Figure 25. LVPECL Differential Swing vs. Frequency
Figure 28. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2950 MHz
-80
700
DIFFERENTIAL SWING (mV p-p)
-90
PHASE NOISE (dBc/Hz)
-100 -110 -120 -130 -140
600
0
100
200
300
400
500
600
700
800
06419-021
500 FREQUENCY (MHz)
-150 10k
100k
1M FREQUENCY (Hz)
10M
100M
Figure 26. LVDS Differential Swing vs. Frequency
Figure 29. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2750 MHz
-80 -90
CL = 2pF 3
2
PHASE NOISE (dBc/Hz)
OUTPUT SWING (V)
CL = 10pF
-100 -110 -120 -130 -140
CL = 20pF 1
0
100
200
300
400
500
600
06419-133
0 OUTPUT FREQUENCY (MHz)
-150 10k
100k
1M FREQUENCY (Hz)
10M
100M
Figure 27. CMOS Output Swing vs. Frequency and Capacitive Load
Figure 30. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2550 MHz
Rev. 0 | Page 22 of 84
AD9516-0
-120 -125 -120 -130 -135 -140 -145 -150 -155 -160 10 -160 10 -110
PHASE NOISE (dBc/Hz)
PHASE NOISE (dBc/Hz)
06419-026
-130
-140
-150
100
1k
10k
100k
1M
10M
100M
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 31. Phase Noise (Additive) LVPECL @ 245.76 MHz, Divide-by-1
-110
Figure 34. Phase Noise (Additive) LVDS @ 200 MHz, Divide-by-1
-100
-120
-110
PHASE NOISE (dBc/Hz)
PHASE NOISE (dBc/Hz)
-130
-120
-140
-130
-150
-140
06419-027
100
1k
10k
100k
1M
10M
100M
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 32. Phase Noise (Additive) LVPECL @ 200 MHz, Divide-by-5
-100
Figure 35. Phase Noise (Additive) LVDS @ 800 MHz, Divide-by-2
-120
-110
-130
PHASE NOISE (dBc/Hz)
PHASE NOISE (dBc/Hz)
-120
-140
-130
-150
-140
-160
06419-128
100
1k
10k
100k
1M
10M
100M
100
1k
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 33. Phase Noise (Additive) LVPECL @ 1600 MHz, Divide-by-1
Figure 36. Phase Noise (Additive) CMOS @ 50 MHz, Divide-by-20
Rev. 0 | Page 23 of 84
06419-131
-150 10
-170 10
06419-130
-160 10
-150 10
06419-142
AD9516-0
-100 -90 -100
-110
PHASE NOISE (dBc/Hz)
-120
PHASE NOISE (dBc/Hz)
06419-132
-110 -120 -130 -140 -150 -160 1k
-130
-140
-150
100
1k
10k
100k
1M
10M
100M
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 37. Phase Noise (Additive) CMOS @ 250 MHz, Divide-by-4
-120
Figure 39. Phase Noise (Absolute) Clock Cleanup; Internal VCO @ 2.8 GHz; PFD = 19.44 MHz; LBW = 12.8 kHz; LVPECL Output = 155.52 MHz
-120
PHASE NOISE (dBc/Hz)
-140
PHASE NOISE (dBc/Hz)
-130
-130
-140
-150
-150
06419-141
10k
100k
1M
10M
100M
10k
100k
1M
10M
100M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 38. Phase Noise (Absolute) Clock Generation; Internal VCO @ 2.7 GHz; PFD = 15.36 MHz; LBW = 110 kHz; LVPECL Output = 122.88 MHz
Figure 40. Phase Noise (Absolute), External VCXO (Toyocom TCO-2112) @ 245.76 MHz; PFD = 15.36 MHz; LBW = 250 Hz; LVPECL Output = 245.76 MHz
Rev. 0 | Page 24 of 84
06419-140
-160 1k
-160 1k
06419-139
-160 10
AD9516-0 TERMINOLOGY
Phase Jitter and Phase Noise An ideal sine wave can be thought of as having a continuous and even progression of phase with time from 0 to 360 for each cycle. Actual signals, however, display a certain amount of variation from ideal phase progression over time. This phenomenon is called phase jitter. Although many causes can contribute to phase jitter, one major cause is random noise, which is characterized statistically as being Gaussian (normal) in distribution. This phase jitter leads to a spreading out of the energy of the sine wave in the frequency domain, producing a continuous power spectrum. This power spectrum is usually reported as a series of values whose units are dBc/Hz at a given offset in frequency from the sine wave (carrier). The value is a ratio (expressed in dB) of the power contained within a 1 Hz bandwidth with respect to the power at the carrier frequency. For each measurement, the offset from the carrier frequency is also given. It is meaningful to integrate the total power contained within some interval of offset frequencies (for example, 10 kHz to 10 MHz). This is called the integrated phase noise over that frequency offset interval and can be readily related to the time jitter due to the phase noise within that offset frequency interval. Phase noise has a detrimental effect on the performance of ADCs, DACs, and RF mixers. It lowers the achievable dynamic range of the converters and mixers, although they are affected in somewhat different ways. Time Jitter Phase noise is a frequency domain phenomenon. In the time domain, the same effect is exhibited as time jitter. When observing a sine wave, the time of successive zero crossings varies. In a square wave, the time jitter is a displacement of the edges from their ideal (regular) times of occurrence. In both cases, the variations in timing from the ideal are the time jitter. Because these variations are random in nature, the time jitter is specified in units of seconds root mean square (rms) or 1 sigma of the Gaussian distribution. Time jitter that occurs on a sampling clock for a DAC or an ADC decreases the signal-to-noise ratio (SNR) and dynamic range of the converter. A sampling clock with the lowest possible jitter provides the highest performance from a given converter. Additive Phase Noise Additive phase noise is the amount of phase noise that is attributable to the device or subsystem being measured. The phase noise of any external oscillators or clock sources are subtracted. This makes it possible to predict the degree to which the device impacts the total system phase noise when used in conjunction with the various oscillators and clock sources, each of which contribute their own phase noise to the total. In many cases, the phase noise of one element dominates the system phase noise. When there are multiple contributors to phase noise, the total is the square root of the sum of squares of the individual contributors. Additive Time Jitter Additive time jitter is the amount of time jitter that is attributable to the device or subsystem being measured. The time jitter of any external oscillators or clock sources are subtracted. This makes it possible to predict the degree to which the device impacts the total system time jitter when used in conjunction with the various oscillators and clock sources, each of which contribute their own time jitter to the total. In many cases, the time jitter of the external oscillators and clock sources dominates the system time jitter.
Rev. 0 | Page 25 of 84
AD9516-0 DETAILED BLOCK DIAGRAM
REF_ SEL VS GND RSET DISTRIBUTION REFERENCE LD LOCK DETECT STATUS STATUS R DIVIDER VCO STATUS LOW DROPOUT REGULATOR (LDO) PROGRAMMABLE N DELAY PHASE FREQUENCY DETECTOR PROGRAMMABLE R DELAY
PLL REFERENCE
REFMON
CPRSET VCP
REFERENCE SWITCHOVER REF1 REF2 REFIN (REF1) REFIN (REF2) BYPASS
HOLD
P, P + 1 PRESCALER
A/B COUNTERS
CHARGE PUMP
CP
N DIVIDER LF VCO DIVIDE BY 2, 3, 4, 5, OR 6 CLK CLK 1 0 DIVIDE BY 1 TO 32 DIGITAL LOGIC OUT0 OUT0 LVPECL OUT1 OUT1 OUT2 DIVIDE BY 1 TO 32 SCLK SDIO SDO CS SERIAL CONTROL PORT DIVIDE BY 1 TO 32 OUT2 LVPECL OUT3 OUT3 OUT4 OUT4 LVPECL OUT5 OUT5 STATUS
PD SYNC RESET
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT6 (OUT6A) OUT6 (OUT6B)
OUT7 (OUT7A) OUT7 (OUT7B)
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT8 (OUT8A) OUT8 (OUT8B)
AD9516-0
OUT9 (OUT9A) OUT9 (OUT9B)
06419-002
Figure 41. Detailed Block Diagram
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AD9516-0 THEORY OF OPERATION
OPERATIONAL CONFIGURATIONS
The AD9516 can be configured in several ways. These configurations must be setup by loading the control registers (Table 51 and Table 52 through Table 61). Each section or function must be individually programmed by setting the appropriate bits in the corresponding control register or registers. Table 21. Default Settings of Some PLL Registers
Register 0x10<1:0> = 01b 0x1E0<2:0> = 010b 0x1E1<0> = 0b 0x1E1<1> = 0b Function PLL asynchronous power-down (PLL off ) Set VCO divider = 4 Use the VCO divider CLK selected as the source
High Frequency Clock Distribution--CLK or External VCO >1600 MHz
The AD9516 power-up default configuration has the PLL powered off and the routing of the input set so that the CLK/CLK input is connected to the distribution section through the VCO divider (divide-by-2/ divide-by-3/divide-by4/divide-by-5/divide-by-6). This is a distribution only mode that allows for an external input up to 2400 MHz (see Table 3). The maximum frequency that can be applied to the channel dividers is 1600 MHz; therefore, higher input frequencies must be divided down before reaching the channel dividers. This input routing can also be used for lower input frequencies, but the minimum divide is 2 before the channel dividers. When the PLL is enabled, this routing also allows the use of the PLL with an external VCO or VCXO with a frequency less than 2400 MHz. In this configuration, the internal VCO is not used, and is powered off. The external VCO/VCXO feeds directly into the prescaler. The register settings shown in Table 21 are the default values of these registers at power-up or after a reset operation. If the contents of the registers are altered by prior programming after power-up or reset, these registers may also be set intentionally to these values.
When using the internal PLL with an external VCO, the PLL must be turned on. Table 22. Settings when Using an External VCO
Register 0x10 to 0x1E 0x1E1<1> = 0b Function PLL normal operation (PLL on) PLL settings. Select and enable a reference input; set R, N (P, A, B), PFD polarity, and ICP according to the intended loop configuration.
An external VCO requires an external loop filter that must be connected between CP and the tuning pin of the VCO. This loop filter determines the loop bandwidth and stability of the PLL. Make sure to select the proper PFD polarity for the VCO being used. Table 23. Setting the PFD Polarity
Register 0x10<7> = 0b 0x10<7> = 1b Function PFD polarity positive (higher control voltage produces higher frequency) PFD polarity negative (higher control voltage produces lower frequency)
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AD9516-0
REF_SEL VS GND RSET DISTRIBUTION REFERENCE LD LOCK DETECT STATUS STATUS R DIVIDER VCO STATUS LOW DROPOUT REGULATOR (LDO) PROGRAMMABLE N DELAY PHASE FREQUENCY DETECTOR PROGRAMMABLE R DELAY PLL REFERENCE REFMON CPRSET VCP
REFERENCE SWITCHOVER REF1 REF2 REFIN (REF1) REFIN (REF2) BYPASS
HOLD
P, P + 1 PRESCALER
A/B COUNTERS
CHARGE PUMP
CP
N DIVIDER LF VCO DIVIDE BY 2, 3, 4, 5, OR 6 CLK CLK 1 0 DIVIDE BY 1 TO 32 DIGITAL LOGIC OUT0 OUT0 LVPECL OUT1 OUT1 OUT2 DIVIDE BY 1 TO 32 SCLK SDIO SDO CS SERIAL CONTROL PORT DIVIDE BY 1 TO 32 OUT2 LVPECL OUT3 OUT3 OUT4 OUT4 LVPECL OUT5 OUT5 STATUS
PD SYNC RESET
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT6 (OUT6A) OUT6 (OUT6B)
OUT7 (OUT7A) OUT7 (OUT7B)
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT8 (OUT8A) OUT8 (OUT8B)
AD9516-0
OUT9 (OUT9A) OUT9 (OUT9B)
06419-029
Figure 42. High Frequency Clock Distribution or External VCO > 1600 MHz
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AD9516-0
Internal VCO and Clock Distribution
When using the internal VCO and PLL, the VCO divider must be employed to ensure the frequency presented to the channel dividers does not exceed their specified maximum frequency (1600 MHz, see Table 3). The internal PLL uses an external loop filter to set the loop bandwidth. The external loop filter is also crucial to the loop stability. When using the internal VCO, it is necessary to calibrate the VCO (0x18<0>) to ensure optimal performance. For internal VCO and clock distribution applications, the register settings shown in Table 24 should be used. Table 24. Settings when Using Internal VCO
Register 0x10<1:0> = 00b 0x10 to 0x1E Function PLL normal operation (PLL on). PLL settings. Select and enable a reference input; set R, N (P, A, B), PFD polarity, and ICP according to the intended loop configuration. Reset VCO calibration (first time after power-up, this does not have to be done but must be done subsequently). Initiate VCO calibration. VCO divider set to divide-by-2, divide-by-3, divide-by-4, divide-by-5, and divide-by-6. Use the VCO divider as source for distribution section. VCO selected as the source.
0x18<0> = 0, 0x232<0> = 1 0x18<0> = 1, 0x232<0> = 1 0x1E0<2:0> 0x1E1<0> = 0b 0x1E1<1> = 1b
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AD9516-0
REF_SEL VS GND RSET DISTRIBUTION REFERENCE LD LOCK DETECT STATUS STATUS R DIVIDER VCO STATUS LOW DROPOUT REGULATOR (LDO) PROGRAMMABLE N DELAY PHASE FREQUENCY DETECTOR PROGRAMMABLE R DELAY PLL REFERENCE REFMON CPRSET VCP
REFERENCE SWITCHOVER REF1 REF2 REFIN (REF1) REFIN (REF2) BYPASS
HOLD
P, P + 1 PRESCALER
A/B COUNTERS
CHARGE PUMP
CP
N DIVIDER LF VCO DIVIDE BY 2, 3, 4, 5, OR 6 CLK CLK 1 0 DIVIDE BY 1 TO 32 DIGITAL LOGIC OUT0 OUT0 LVPECL OUT1 OUT1 OUT2 DIVIDE BY 1 TO 32 SCLK SDIO SDO CS SERIAL CONTROL PORT DIVIDE BY 1 TO 32 OUT2 LVPECL OUT3 OUT3 OUT4 OUT4 LVPECL OUT5 OUT5 STATUS
PD SYNC RESET
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT6 (OUT6A) OUT6 (OUT6B)
OUT7 (OUT7A) OUT7 (OUT7B)
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT8 (OUT8A) OUT8 (OUT8B)
AD9516-0
OUT9 (OUT9A) OUT9 (OUT9B)
06419-030
Figure 43. Internal VCO and Clock Distribution
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AD9516-0
Clock Distribution or External VCO <1600 MHz
When the external clock source to be distributed or the external VCO/VCXO is less than 1600 MHz, a configuration that bypasses the VCO divider can be used. This only differs from the High Frequency Clock Distribution--CLK or External VCO >1600 MHz section in that the VCO divider (divide-by-2, divide-by-3, divide-by-4, divide-by-5, and divide-by-6) is bypassed. This limits the frequency of the clock source to <1600 MHz (due to the maximum input frequency allowed at the channel dividers). Table 26. Settings for Using Internal PLL with External VCO <1600 MHz
Register 0x1E1<0> = 1b 0x10<1:0> = 00b Function Bypass the VCO divider as source for distribution section PLL normal operation (PLL on) along with other appropriate PLL settings in 0x10 to 0x1E
Configuration and Register Settings
For clock distribution applications where the external clock is <1600 MHz, the register settings shown in Table 25 should be used. Table 25. Settings for Clock Distribution <1600 MHz
Register 0x10<1:0> = 01b 0x1E1<0> = 1b 0x1E1<1> = 0b Function PLL asynchronous power-down (PLL off ) Bypass the VCO divider as source for distribution section CLK selected as the source
An external VCO/VCXO requires an external loop filter that must be connected between CP and the tuning pin of the VCO/VCXO. This loop filter determines the loop bandwidth and stability of the PLL. Make sure to select the proper PFD polarity for the VCO/VCXO being used. Table 27. Setting the PFD Polarity
Register 0x10<7> = 0 0x10<7> = 1 Function PFD polarity positive (higher control voltage produces higher frequency) PFD polarity negative (higher control voltage produces lower frequency)
When using the internal PLL with an external VCO <1600 MHz, the PLL must be turned on.
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AD9516-0
REF_SEL VS GND RSET DISTRIBUTION REFERENCE LD LOCK DETECT STATUS STATUS R DIVIDER VCO STATUS LOW DROPOUT REGULATOR (LDO) PROGRAMMABLE N DELAY PHASE FREQUENCY DETECTOR PROGRAMMABLE R DELAY PLL REFERENCE REFMON CPRSET VCP
REFERENCE SWITCHOVER REF1 REF2 REFIN (REF1) REFIN (REF2) BYPASS
HOLD
P, P + 1 PRESCALER
A/B COUNTERS
CHARGE PUMP
CP
N DIVIDER LF VCO DIVIDE BY 2, 3, 4, 5, OR 6 CLK CLK 1 0 DIVIDE BY 1 TO 32 DIGITAL LOGIC OUT0 OUT0 LVPECL OUT1 OUT1 OUT2 DIVIDE BY 1 TO 32 SCLK SDIO SDO CS SERIAL CONTROL PORT DIVIDE BY 1 TO 32 OUT2 LVPECL OUT3 OUT3 OUT4 OUT4 LVPECL OUT5 OUT5 STATUS
PD SYNC RESET
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT6 (OUT6A) OUT6 (OUT6B)
OUT7 (OUT7A) OUT7 (OUT7B)
T DIVIDE BY 1 TO 32 DIVIDE BY 1 TO 32 T LVDS/CMOS
OUT8 (OUT8A) OUT8 (OUT8B)
AD9516-0
OUT9 (OUT9A) OUT9 (OUT9B)
06419-028
Figure 44. Clock Distribution or External VCO <1600 MHz
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AD9516-0
Phase-Locked Loop (PLL)
REF_SEL VS GND RSET REFMON CPRSET VCP
REFERENCE SWITCHOVER
DIST REF LD
REF1 STATUS REF2 R DIVIDER STATUS REFIN (REF1) REFIN (REF2) BYPASS LOW DROPOUT REGULATOR (LDO) N DIVIDER P, P + 1 PRESCALER A/B COUNTERS PROGRAMMABLE N DELAY PROGRAMMABLE R DELAY
LOCK DETECT
PLL REF
HOLD
PHASE FREQUENCY DETECTOR
CHARGE PUMP
CP
LF VCO CLK CLK 1 0
VCO STATUS STATUS DIVIDE BY 2, 3, 4, 5, OR 6 0 1
06419-064
Figure 45. PLL Functional Blocks
The AD9516 includes an on-chip PLL with an on-chip VCO. The PLL blocks can be used either with the on-chip VCO to create a complete phase-locked loop, or with an external VCO or VCXO. The PLL requires an external loop filter, which usually consists of a small number of capacitors and resistors. The configuration and components of the loop filter help to establish the loop bandwidth and stability of the operating PLL. The AD9516 PLL is useful for generating clock frequencies from a supplied reference frequency. This includes conversion of reference frequencies to much higher frequencies for subsequent division and distribution. In addition, the PLL can be exploited to clean-up jitter and phase noise on a noisy reference. The exact choices of PLL parameters and loop dynamics is very application specific. The flexibility and depth of the AD9516 PLL allows the part to be tailored to function in many different applications and signal environments.
Successful PLL operation and satisfactory PLL loop performance are highly dependant upon proper configuration of the PLL settings. The design of the external loop filter is crucial to the proper operation of the PLL. A thorough knowledge of PLL theory and design is helpful. ADIsimCLKTM (V1.2 or later) is a free program that can help with the design and exploration of the capabilities and features of the AD9516, including the design of the PLL loop filter. It is available at www.analog.com/clocks.
Phase Frequency Detector (PFD)
The PFD takes inputs from the R counter and N counter and produces an output proportional to the phase and frequency difference between them. The PFD includes a programmable delay element that controls the width of the antibacklash pulse. This pulse ensures that there is no dead zone in the PFD transfer function and minimizes phase noise and reference spurs. The antibacklash pulse width is set by 0x17<1:0>. An important limit to keep in mind is the maximum frequency allowed into the PFD. The maximum input frequency to the PFD is a function of the antibacklash pulse setting, as specified in the Phase/Frequency Detector section of Table 2.
Configuration of the PLL
The AD9516 allows flexible configuration of the PLL, accomodating various reference frequencies, PFD comparison frequencies, VCO frequencies, internal or external VCO/VCXO, and loop dynamics. This is accomplished by the various settings that include the R divider, the N divider, the PFD polarity (only applicable to external VCO/VCXO), the antibacklash pulse width, the charge pump current, the selection of internal VCO or external VCO/VCXO, and the loop bandwidth. These are managed through programmable register settings (see Table 51 and Table 53) and by the design of the external loop filter.
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AD9516-0
Charge Pump (CP)
The charge pump is controlled by the PFD. The PFD monitors the phase and frequency relationship between its two inputs, and tells the CP to pump up or pump down to charge or discharge the integrating node (part of the loop filter). The integrated and filtered CP current is transformed into a voltage that drives the tuning node of the internal VCO through the LF pin (or the tuning pin of an external VCO) to move the VCO frequency up or down. The CP can be set (0x10<6:4>) for high impedance (allows holdover operation), for normal operation (attempts to lock the PLL loop), pump up, or pump down (test modes). The CP current is programmable in eight steps from (nominally) 600 A to 4.8 mA. The exact value of the CP current LSB is set by the CP_RSET resistor, which is nominally 5.1 k.
AD9516-0
LF VCO CP CHARGE PUMP
R2 R1
BYPASS
C1
C2
C3
06419-065
CBP = 220nF
Figure 46. Example of External Loop Filter for PLL
PLL Reference Inputs
The AD9516 features a flexible PLL reference input circuit that allows either a fully differential input or two separate singleended inputs. The input frequency range for the reference inputs is specified in Table 2. Both the differential and the single-ended inputs are self-biased, allowing for easy ac coupling of input signals. The differential input and the single-ended inputs share the two pins, REFIN (REF1)/REFIN (REF2). The desired reference input type is selected and controlled by 0x1C (see Table 51 and Table 53). When the differential reference input is selected, the self-bias level of the two sides are offset slightly (~100 mV, see Table 2) to prevent chattering of the input buffer when the reference is slow or missing. This increases the voltage swing required of the driver and overcomes the offset. The single-ended inputs can be driven by either a dc-coupled CMOS level signal, or an ac-coupled sinewave or square wave. Each single-ended input can be independently powered down when not needed to increase isolation and reduce power. Either a differential or a single-ended reference must be specifically enabled. All PLL reference inputs are off by default. The differential reference input is powered down whenever the PLL is powered down, or when the differential reference input is not selected. The single-ended buffers power down when the PLL is powered down, and when their individual power down registers are set. When the differential mode is selected, the single-ended inputs are powered down. In differential mode, the reference input pins are internally selfbiased so that they can be ac-coupled via capacitors. It is possible to dc couple to these inputs. If the differential REFIN is driven by a single-ended signal, the unused side (REFIN) should be decoupled via a suitable capacitor to a quiet ground. Figure 47 shows the equivalent circuit of REFIN.
On-Chip VCO
The AD9516 includes an on-chip VCO covering the frequency range shown in Table 2. Achieving low VCO phase noise was a priority in the design of the VCO. To tune over the wide range of frequencies covered by this VCO, ranges are used. This is largely transparent to the user but is the reason that the VCO must be calibrated when the PLL loop is first set up. The calibration procedure ensures that the VCO is operating within the correct band range for the frequency that it is asked to produce. See the VCO Calibration section for additional information. The on-chip VCO is powered by an on-chip, low drop out (LDO), linear voltage regulator. The LDO provides some isolation of the VCO from variations in the power supply voltage level. The BYPASS pin should be connected to ground by a 220 nF capacitor to ensure stability. This LDO employs the same technology used in the anyCAP(R) line of regulators from Analog Devices, Inc., making it insensitive to the type of capacitor used. Driving an external load from the BYPASS pin is not supported.
PLL External Loop Filter
When using the internal VCO, the external loop filter should be referenced to the BYPASS pin for optimal noise and spurious performance. An example of an external loop filter for the PLL is shown in Figure 46. A loop filter must be calculated for each desired PLL configuration. The values of the components depend upon the VCO frequency, the KVCO, the PFD frequency, the CP current, the desired loop bandwidth, and the desired phase margin. The loop filter affects the phase noise, the loop settling time, and the loop stability. A knowledge of PLL theory is necessary for understanding the subject of loop filter design. There are tools available, such as ADIsimCLK, that can help with the calculation of a loop filter according to the application requirements.
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AD9516-0
VS
85k REF1
VS 10k REFIN 12k 150
REFIN 10k
150 10k
In automatic mode, REF1 is monitored by REF2. If REF1 disappears (two consecutive falling edges of REF2 without an edge transition on REF1), REF1 is considered missing. Upon the next subsequent rising edge of REF2, REF2 is used as the reference clock to the PLL. If 0x1C<3> = 0b (default), when REF1 returns (four rising edges of REF1 without two falling edges of REF2 between the REF1 edges), the PLL reference switchs back to REF1. If 0x1C<3> = 1b, the user has control over when to switch back to REF1. This is done by programming the part to manual reference select mode (0x1C<4> = 0b) and by ensuring that the registers and/or REF_SEL pin are set to select the desired reference. Auto mode can be re-enabled once REF1 is reselected. Manual switchover requires the presence of a clock on the reference input that is being switched to, or that the deglitching feature be disabled (0x1C<7>).
VS REF2
85k
Reference Divider R
The reference inputs are routed to the reference divider, R. R (a 14-bit counter) can be set to any value from 0 to 16383 by writing to 0x11 and 0x12. (Both R = 0 and R = 1 give divide-by-1.) The output of the R divider goes to one of the PFD inputs to be compared to the VCO frequency divided by the N divider. The frequency applied to the PFD must not exceed the maximum allowable frequency, which depends on the antibacklash pulse setting (see Table 2). The R counter has its own reset. R counter can be reset using the shared reset bit of the R, A, and B counters. It may also be reset by a SYNC operation.
06419-066
Figure 47. REFIN Equivalent Circuit
Reference Switchover
The AD9516 supports dual single-ended CMOS inputs, as well as a single differential reference input. In the dual single-ended reference mode, the AD9516 supports automatic and manual PLL reference clock switching between REF1 (on Pin REFIN) and REF2 (on Pin REFIN). This feature supports networking and other applications that require redundant references. When using reference switchover, the single-ended reference inputs should be dc-coupled CMOS levels and never allowed to go to high impedance. If these inputs are allowed to go high impedance, noise may cause the buffer to chatter, causing a false detection of the presence of a reference. There are several configurable modes of reference switchover. The switchover can be performed manually or automatically. The manual switchover is done either through a register setting (0x1D), or by using the REF_SEL pin. The automatic switchover occurs when REF1 disappears. There is also a switchover deglitch feature which ensures that the PLL does not receive rising edges that are far out of alignment with the newly selected reference. There are two reference automatic switchover modes (0x1C): * Prefer REF1: Switch from REF1 to REF2 when REF1 disappears. Return to REF1 from REF2 when REF1 returns. * Stay on REF2: Automatically switch to REF2 if REF1 disappears but do not switch back to REF1 if it reappears. The reference can be set back to REF1 manually at an appropriate time.
VCXO/VCO Feedback Divider N: P, A, B, R
The N divider is a combination of a prescaler (P) and two counters, A and B. The total divider value is N = (P x B) + A where the value of P can be 2, 4, 8, 16, or 32.
Prescaler
The prescaler of the AD9516 allows for two modes of operation: a fixed divide (FD) mode of 1, 2, or 3, and dual modulus (DM) mode where the prescaler divides by P and (P + 1) {2 and 3, 4 and 5, 8 and 9, 16 and 17, or 32 and 33}. The prescaler modes of operation are given in Table 53, 0x16<2:0>. Not all modes are available at all frequencies (see Table 2). When operating the AD9516 in dual modulus mode (P//P + 1), the equation used to relate input reference frequency to VCO output frequency is fVCO = (fREF/R) x (P x B + A) = fREF x N/R However, when operating the prescaler in FD mode, 1, 2, or 3, the A counter is not used (A = 0) and the equation simplifies to fVCO = (fREF/R) x (P x B) = fREF x N/R
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AD9516-0
When A = 0, the divide is a fixed divide of P = 2, 4, 8, 16, or 32, in which case the previous equation also applies. By using combinations of DM and FD modes, the AD9516 can achieve values of N all the way down to N = 1. Table 28 shows how a 10 MHz reference input may be locked to any integer multiple of N. Note that the same value of N may be derived in different ways, as illustrated by the case of N = 12. The user may choose a fixed divide mode P = 2 with B = 6, or use the dual modulus mode 2/3 with A = 0, B = 6, or use the dual modulus mode 4/5 with A = 0, B = 3. The maximum input frequency to the A/B counter is reflected in the maximum prescaler output frequency (~300 MHz) specified in Table 2. This is the prescaler input frequency (VCO or CLK) divided by P. Although manual reset is not normally required, the A/B counters have their own reset bit. A and B counters can be reset using the shared reset bit of the R, A, and B counters. They may also be reset through a SYNC operation.
R, A, and B Counters: SYNC Pin Reset
The R, A and B counters may also be reset simultaneously through the SYNC pin. This function is controlled by 0x19<7:6> (see Table 53). The SYNC pin reset is disabled by default.
A and B Counters
The AD9516 B counter can be bypassed (B = 1). This B counter bypass mode is only valid when using the prescaler in FD mode. When A = 0, the divide is a fixed divide of P = 2, 4, 8, 16, or 32. Unlike the R-counter, an A = 0 is actually a zero. The B counter must be 3 or bypassed.
R and N Divider Delays
Both the R and N dividers feature a programmable delay cell. These delays may be enabled to allow adjustment of the phase relationship between the PLL reference clock and the VCO or CLK. Each delay is controlled by three bits. The total delay range is about 1 ns. See 0x19 in Table 53.
Table 28. How a 10 MHz Reference Input May Be Locked to Any Integer Multiple of N
FREF 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 R 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 P 1 2 1 1 1 2 2 2 2 2 2 2 2 2 2 4 4 A X X X X X X 0 1 2 1 X 0 1 X 0 0 1 B 1 1 3 4 5 3 3 3 3 4 5 5 5 6 6 3 3 N 1 2 3 4 5 6 6 7 8 9 10 10 11 12 12 12 13 FVCO 10 20 30 40 50 60 60 70 80 90 100 100 110 120 120 120 130 Mode FD FD FD FD FD FD DM DM DM DM FD DM DM FD DM DM DM Notes P = 1, B = 1 (bypassed) P = 2, B = 1 (bypassed) P = 1, B = 3 P = 1, B = 4 P = 1, B = 5 P = 2, B = 3 P and P + 1 = 2 and 3, A = 0, B = 3 P and P + 1 = 2 and 3, A = 1, B = 3 P and P + 1 = 2 and 3, A = 2, B = 3 P and P + 1 = 2 and 3, A = 1, B = 4 P = 2, B = 5 P and P + 1 = 2 and 3, A = 0, B = 5 P and P + 1 = 2 and 3, A = 1, B = 5 P = 2, B = 6 P and P + 1 = 2 and 3, A = 0, B = 6 P and P + 1 = 4 and 5, A = 0, B = 3 P and P + 1 = 4 and 5, A = 1, B = 3
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AD9516-0
DIGITAL LOCK DETECT (DLD)
By selecting the proper output through the mux on each pin, the DLD function is available at the LD, STATUS, and REFMON pins. The digital lock detect circuit indicates a lock when the time difference of the rising edges at the PFD inputs is less than a specified value (the lock threshold). The loss of a lock is indicated when the time difference exceeds a specified value (the unlock threshold). Note that the unlock threshold is wider than the lock threshold, which allows some phase error in excess of the lock window to occur without chattering on the lock indicator. The lock detect window timing depends on three settings: the digital lock detect window bit (0x18<4>), the antibacklash pulse width setting (0x17<1:0>, see Table 2), and the lock detect counter (0x18<6:5>). A lock is not indicated until there is a programmable number of consecutive PFD cycles with a time difference less than the lock detect threshold. The lock detect circuit continues to indicate a lock until a time difference greater than the unlock threshold has occurred on a single subsequent cycle. For the lock detect to work properly, the period of the PFD frequency must be greater than the unlock threshold. The number of consecutive PFD cycles required for lock is programmable (0x18<6:5>). current source lock detect function. This function is set by selecting it as the output from the LD pin control (0x1A<5:0>). The current source lock detect provides a current of 110 A when DLD is true and shorts to ground when DLD is false. If a capacitor is connected to the LD pin, it charges at a rate determined by the current source during the DLD true time but is discharged nearly instantly when DLD is false. By monitoring the voltage at the LD pin (top of the capacitor), it is only possible to get a Logic High level after the DLD has been true for a sufficiently long time. Any momentary DLD false resets the charging. By selecting a properly sized capacitor, it is possible to delay a lock detect indication until the PLL is stably locked, and the lock detect does not chatter. The voltage on the capacitor can be sensed by an external comparator connected to the LD pin. However, there is an internal LD pin comparator that can be read at the REFMON pin control (0x1B<4:0>) or the STATUS pin control (0x17<7:2>) as an active high signal. It is also available as an active low signal (REFMON, 0x1B<4:0> and STATUS, 0x17<7:2>). The internal LD pin comparator trip point and hysterisis are given in Table 16.
AD9516-0
110A DLD VOUT C LD PIN COMPARATOR
Analog Lock Detect (ALD)
The AD9516 provides an ALD function that may be selected for use at the LD pin. There are two versions of ALD: * N-channel open-drain lock detect. This signal requires a pull-up resistor to positive supply, VS. The output is normally high with short, low going pulses. Lock is indicated by the minimum duty cycle of the low-going pulses. * P-channel open-drain lock detect. This signal requires a pulldown resistor to GND. The output is normally low with short, high going pulses. Lock is indicated by the minimum duty cycle of the high-going pulses. The analog lock detect function requires a R-C filter to provide a logic level indicating lock/unlock.
VS = 3.3V
LD
Figure 49. Current Source Lock Detect
External VCXO/VCO Clock Input (CLK/CLK)
CLK is a differential input that can be used as an input to drive the AD9516 clock distribution section. This input can receive up to 2.4 GHz. The pins are internally self-biased and the input signal should be ac-coupled via capacitors.
CLOCK INPUT STAGE VS CLK
AD9516-0
LD ALD R1
R2
VOUT
C
06419-067
CLK 2.5k 5k 5k
06419-032
2.5k
Figure 48. Example of Analog Lock Detect Filter, Using N-Channel Open-Drain Driver
Current Source Digital Lock Detect (DLD)
During the PLL locking sequence, it is normal for the DLD signal to toggle a number of times before remaining steady when the PLL is completely locked and stable. There may be applications where it is desirable to have DLD asserted only after the PLL is solidly locked. This is possible by using the
Figure 50. CLK Equivalent Input Circuit
The CLK/CLK input can be used either as a distribution only input (with the PLL off), or as a feedback input for an external VCO/VCXO using the internal PLL, when the internal VCO is not used. The CLK/CLK input can be used for frequencies up to 2.4 GHz.
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06419-068
REFMON OR STATUS
AD9516-0
Holdover
The AD9516 PLL has a holdover function. Holdover is implemented by putting the charge pump into a high impedance state. This is useful when the PLL reference clock is lost. Holdover mode allows the VCO to maintain a relatively constant frequency even though there is no reference clock. Without this function, the charge pump is placed into a constant pump-up or pump-down state resulting in a massive VCO frequency shift. Because the charge pump is placed in a high impedance state, any leakage that occurs at the charge pump output or the VCO tuning node causes a drift of the VCO frequency. This can be mitigated by using a loop filter that contains a large capacitive component because this drift is limited by the current leakage induced slew rate (ILEAK/C) of the VCO control voltage. Both a manual holdover, using the SYNC pin, and an automatic holdover mode are provided. To use either function, the holdover function must be enabled (0x1D<0> and 0x1D<2>). [Note that the VCO cannot be calibrated with the holdover enabled because the holdover resets the N divider during calibration, which prevents proper calibration. Disable holdover before issuing a VCO calibration.]
Automatic/Internal Holdover Mode
When enabled, this function automatically puts the charge pump into a high impedance state when the loop loses lock. The assumption is that the only reason the loop loses lock is due to the PLL loosing the reference clock; therefore, the holdover function puts the charge pump into a high impedance state to maintain the VCO frequency as close as possible to the original frequency before the reference clock disappeared. A flow chart of the internal/automatic holdover function operation is shown in Figure 51.
PLL ENABLED
NO DLD == LOW
LOOP OUT OF LOCK. DIGITAL LOCK DETECT SIGNAL GOES LOW WHEN THE LOOP LEAVES LOCK AS DETERMINED BY THE PHASE DIFFERENCE AT THE INPUT OF THE PFD.
YES
NO ANALOG LOCK DETECT PIN INDICATES LOCK WAS PREVIOUSLY ACHIEVED. (0x1D<3> = 1: USE LD PIN VOLTAGE WITH HOLDOVER. 0x1D<3> = 0: IGNORE LD PIN VOLTAGE, TREAT LD PIN AS ALWAYS HIGH.)
WAS LD PIN == HIGH WHEN DLD WENT LOW?
Manual Holdover Mode
A manual holdover mode can be enabled that allows the user to place the charge pump into a high impedance state when the SYNC pin is asserted low. This operation is edge sensitive, not level sensitive. The charge pump enters a high impedance state immediately. To take the charge pump out of a high impedance state take the SYNC pin high. The charge pump then leaves high impedance state synchronously with the next PFD rising edge from the reference clock. This prevents extraneous charge pump events from occurring during the time between SYNC going high and the next PFD event. This also means the charge pump stays in high impedance state as long as there is no reference clock present. The B-counter (in the N divider) is reset synchronously with the charge pump leaving high impedance state on the reference path PFD event. This helps align the edges out of the R and N dividers for faster settling of the PLL. Because the prescaler is not reset, this feature works best when the B and R numbers are close because this results in a smaller phase difference for the loop to settle out. When using this mode, the channel dividers should be set to ignore the SYNC pin (at least after an initial SYNC event). If the dividers are not set to ignore the SYNC pin, any time SYNC is taken low to put the part into holdover the distribution outputs turn off.
YES
HIGH IMPEDANCE CHARGE PUMP YES NO
CHARGE PUMP IS MADE HIGH IMPEDANCE. PLL COUNTERS CONTINUE OPERATING NORMALLY.
REFERENCE EDGE AT PFD?
CHARGE PUMP REMAINS HIGH IMPEDANCE UNTIL THE REFERENCE HAS RETURNED.
YES RELEASE CHARGE PUMP HIGH IMPEDANCE YES
YES TAKE CHARGE PUMP OUT OF HIGH IMPEDANCE. PLL CAN NOW RESETTLE.
NO
DLD == HIGH
Figure 51. Flow Chart of Automatic/Internal Holdover Mode
The holdover function senses the logic level of the LD pin as a condition to enter holdover. The signal at LD can be from the DLD, ALD, or current source LD mode. It is possible to disable the LD comparator (0x1D<3>), which causes the holdover function to always sense LD as high. If DLD is used, it is possible for the DLD signal to chatter some while the PLL is re-acquiring lock. The holdover function may retrigger, thereby preventing the holdover mode from ever terminating. Use of the current source lock detect mode is recommended to avoid this situation (see the Current Source Digital Lock Detect section).
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WAIT FOR DLD TO GO HIGH. THIS TAKES 5 TO 255 CYCLES (PROGRAMMING OF THE DLD DELAY COUNTER) WITH THE REFERENCE AND FEEDBACK CLOCKS INSIDE THE LOCK WINDOW AT THE PFD. THIS ENSURES THAT THE HOLDOVER FUNCTION WAITS FOR THE PLL TO SETTLE AND LOCK BEFORE THE HOLDOVER FUNCTION CAN BE RETRIGGERED.
AD9516-0
Once in holdover mode, the charge pump stays in a high impedance state as long as there is no reference clock present. As in the external holdover mode, the B counter (in the N divider) is reset synchronously with the charge pump leaving high impedance state on the reference path PFD event. This helps align the edges out of the R and N dividers for faster settling of the PLL and to reduce frequency errors during settling. Because the prescaler is not reset, this feature works best when the B and R numbers are close as this results in a smaller phase difference for the loop to settle out. After leaving holdover, the loop then re-acquires lock and the LD pin must charge (if 0x1D<3> = 1) before it can re-enter holdover (CP high impedance). The holdover function always responds to the state of the currently selected reference (0x1C). If the loop loses lock during a reference switchover (see the Reference Switchover section), holdover is triggered briefly until the next reference clock edge at the PFD. The following registers affect the internal/automatic holdover function: * 0x18<6:5>--lock detect counter. This changes how many consecutive PFD cycles with edges inside the lock detect window are required for the DLD indicator to indicate lock. This impacts the time required before the LD pin can begin to charge as well as the delay from the end of a holdover event until the holdover function can be re-engaged. * 0x18<3>--disable digital lock detect. This bit must be set to a 0 to enable the DLD circuit. Internal/automatic holdover does not operate correctly without the DLD function enabled. * 0x1A<5:0>--lock detect pin output select. Set this to 000100b to put it in the current source lock detect mode if using the LD pin comparator. Load the LD pin with a capacitor of an appropriate value. * 0x1D<3>--enable LD pin comparator. 1 = enable; 0 = disable. When disabled, the holdover function always senses the LD pin as high. * 0x1D<1>--enable external holdover control. * 0x1D<0> and Register 0x1D<2>--holdover function enable. If holdover is disabled, both external and internal/automatic holdover is disabled. For example, to use automatic holdover with: * Automatic reference switchover prefer REF1. * Digital lock detect: five PFD cycles, high range window. * Automatic holdover using the LD pin comparator. The following registers are set (in addition to the normal PLL registers): * 0x18<6:5> = 00b; lock detect counter = five cycles. * 0x18<4> = 0b; lock detect window = high range. * 0x18<3> = 0b; DLD normal operation. * 0x1A<5:0> = 000100b; current source lock detect mode. * 0x1C<4> = 1b; automatic reference switchover enabled. * 0x1C<3> = 0b; prefer REF1. * 0x1C<2:1> = 11b; enable REF1 and REF2 input buffers. * 0x1D<3> = 1b; enable LD pin comparator. * 0x1D<2>=1b; enable the holdover function. * 0x1D<1> = 0b; use internal/automatic holdover mode. * 0x1D<0> = 1b; enable the holdover function.
Frequency Status Monitors
The AD9516 contains three frequency status monitors that are used to indicate if the PLL reference (or references in the case of single-ended mode) and the VCO have fallen below a threshold frequency. A diagram showing their location in the PLL is shown in Figure 52. The PLL reference monitors have two threshold frequencies: normal and extended (see Table 16). The reference frequency monitor thresholds are selected in 0x1F.
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REF_SEL VS GND RSET DISTRIBUTION REFERENCE LD LOCK DETECT STATUS STATUS R DIVIDER PROGRAMMABLE R DELAY REFMON CPRSET VCP
REFERENCE SWITCHOVER REF1 REF2 REFIN (REF1) REFIN (REF2) BYPASS LOW DROPOUT REGULATOR (LDO)
PLL REFERENCE
HOLD
N DIVIDER P, P + 1 PRESCALER A/B COUNTERS PROGRAMMABLE N DELAY
PHASE FREQUENCY DETECTOR
CHARGE PUMP
CP
LF VCO DIVIDE BY 2, 3, 4, 5, OR 6 CLK CLK 1 0 0 1
VCO STATUS STATUS
Figure 52. Reference and VCO Status Monitors
VCO Calibration
The AD9516 on-chip VCO must be calibrated to ensure proper operation over process and temperature. The VCO calibration is controlled by a calibration controller running off of a divided REFIN clock. The calibration requires that the PLL be set up properly to lock the PLL loop and that the REFIN clock be present. During the first initialization after a power-up or a reset of the AD9516, a VCO calibration sequence is initiated by setting 0x18<0> = 1b. This can be done as part of the initial setup, before executing update registers (0x232<0> = 1b). Subsequent to the initial setup, a VCO calibration sequence is initiated by resetting 0x18<0> = 0b, executing an update registers operation, setting 0x18<0> = 1b, and executing another update registers operation. A readback bit (0x1F<6>) indicates when a VCO calibration is finished by returning a logic true (that is, 1b). The sequence of operations for the VCO calibration is: * Program the PLL registers to the proper values for the PLL loop. * For initial setting of registers after a power-up or reset, initiate VCO calibration by setting 0x18<0> = 1. Subsequently, whenever a calibration is desired, set 0x18<0> = 0b, update registers, set 0x18<0> = 1b, update registers. * A SYNC operation is initiated internally, causing the outputs to go to a static state determined by normal SYNC function operation. * VCO calibrates to desired setting for requested VCO frequency. * Internally, the SYNC signal is released, allowing outputs to continue clocking. * PLL loop is closed. * PLL locks.
A SYNC is executed during the VCO calibration; therefore, the outputs of the AD9516 are held static during the calibration, which prevents unwanted frequencies from being produced. However, at the end of a VCO calibration, the outputs may resume clocking before the PLL loop is completely settled. The VCO calibration clock divider is set as shown in Table 53 (0x18<2:1>). The calibration divider divides the PFD frequency (reference frequency divided by R) down to the calibration clock. The calibration occurs at the PFD frequency divided by the calibration divider setting. Lower VCO calibration clock frequencies result in longer times for a calibration to be completed. The VCO calibration clock frequency is given by fCAL_CLOCK = fREFIN/(R x cal_div) where: fREFIN is the frequency of the REFIN signal. R is the value of the R divider. cal_div is the division set for the VCO calibration divider (0x18<2:1>). The VCO calibration takes 4400 calibration clock cycles. Therefore, the VCO calibration time in PLL reference clock cycles is given by Time to Calibrate VCO = 4400 x R x cal_div PLL Reference Clock Cycles Table 29. Example Time to Complete a VCO Calibration with Different fREFIN Frequencies
fREFIN (MHz) 100 10 10 R Divider 1 10 100 PFD 100 MHz 1 MHz 100 kHz Time to Calibrate VCO 88 s 8.8 ms 88 ms
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VCO calibration must be manually initiated. This allows for flexibility in deciding what order to program registers and when to initiate a calibration, instead of having it happen every time certain PLL registers have their values change. For example, this allows for the VCO frequency to be changed by small amounts without having an automatic calibration occur each time (this should be done with caution and only where the user knows the VCO control voltage is not going to exceed the nominal best performance limits, for example, a few 100 kHz steps are fine, a few MHz might not be). Additionally, as the calibration procedure results in rapid changes in the VCO frequency, the distribution section is automatically placed in SYNC until the calibration is finished. Therefore, this temporary loss of outputs must be expected. A VCO calibration should be initiated under the following conditions: * After changing any of the PLL R, P, B, and A divider settings, or after a change in the PLL reference clock frequency. This, in effect, means any time a PLL register or reference clock is changed such that a different VCO frequency results. * Whenever system calibration is desired. The VCO is designed to operate properly over extremes of temperatures even when first calibrated at the opposite extreme. However, a VCO calibration can be initiated at any time, if desired. The channel dividers allow for a selection of various duty cycles, depending on the currently set division. That is, for any specific division, D, the output of the divider can be set to high for N + 1 input clock cycles and low for M + 1 input clock cycles (where D = N + M + 2). For example, a divide-by-5 can be high for one divider input cycle and low for four cycles, or a divideby-5 can be high for three divider input cycles and low for two cycles. Other combinations are also possible. The channel dividers include a duty-cycle correction function, that can be disabled. In contrast to the selectable duty cycle just described, this function can correct a non-50% duty cycle caused by an odd division. However, this requires that the division be set by M = N + 1. In addition, the channel dividers allow a coarse phase offset or delay to be set. Depending on the division selected, the output can be delayed by up to 31 input clock cycles. The divider outputs can also be set to start high or start low.
Internal VCO or External CLK as Clock Source
The clock distribution of the AD9516 has two clock input sources: internal VCO or an external clock connected to the CLK/CLK pins. Either the internal VCO or CLK must be chosen as the source of the clock signal to distribute. When the internal VCO is selected as the source, the VCO divider must be used. When CLK is selected as the source, it is not necessary to use the VCO divider if the CLK frequency is less than the maximum channel divider input frequency (1600 MHz); otherwise, the VCO divider must be used to reduce the frequency to one acceptable by the channel dividers. Table 30 shows how the VCO, CLK, and VCO divider are selected. 0x1E1<1:0> selects the channel divider source and determines whether the VCO divider is used. It is not possible to select the VCO without using the VCO divider. Table 30. Selecting VCO or CLK as Source for Channel Divider, and Whether VCO Divider Is Used
0x1E1 <1> <0> 0 0 0 1 1 0 1 1 Channel Divider Source CLK CLK VCO Not allowed VCO Divider Used Not used Used Not allowed
CLOCK DISTRIBUTION
A clock channel consists of a pair (or double pair, in the case of CMOS) of outputs that share a common divider. A clock output consists of the drivers that connect to the output pins. The clock outputs have either LVPECL or LVDS/CMOS signal levels at the pins. The AD9516 has five clock channels: three channels are LVPECL (six outputs); two channels are LVDS/CMOS (up to four LVDS outputs, or up to eight CMOS outputs). Each channel has its own programmable divider that divides the clock frequency applied to its input. The LVPECL channel dividers contain a divider that can divide by any integer from 1 to 32. Each LVDS/CMOS channel divider contains two cascaded dividers that can be set to divide by any integer from 1 to 32. The total division of the channel is the product of the divide value of the two cascaded dividers. This allows divide values of (1 to 32) x (1 to 32), or up to 1024 (notice that this is not all values from 1 to 1024 but only the set of numbers that are the product of the two dividers). Because the internal VCO frequency is above the maximum channel divider input frequency (1600 MHz), the VCO divider must be used after the on-chip VCO. The VCO divider can be set to divide by 2, 3, 4, 5, or 6. External clock signals connected to the CLK input also require the VCO divider if the frequency of the signal is greater than 1600 MHz.
CLK or VCO Direct to LVPECL Outputs
It is possible to connect either the internal VCO or the CLK (whichever is selected as the input to the VCO divider) directly to the LVPECL outputs, OUT0 to OUT5. This configuration can pass frequencies up to the maximum frequency of the VCO directly to the LVPECL outputs. The LVPECL outputs may not be able to provide full voltage swing at the highest frequencies.
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To connect the LVPECL outputs directly to the internal VCO or CLK, the VCO divider must be selected as the source to the distribution section, even if no channel uses it. Either the internal VCO or the CLK can be selected as the source for the direct to output routing. Table 31. Settings for Routing VCO Divider Input Directly to LVPECL Outputs
Register Setting 0x1E1<1:0> = 00b 0x1E1<1:0> = 10b 0x192<1> = 1b 0x195<1> = 1b 0x198<1> = 1b Selection CLK is the source; VCO divider selected VCO is the source; VCO divider selected Direct to output OUT0, OUT1 Direct to output OUT2, OUT3 Direct to output OUT4, OUT5
The channel dividers feeding the LVPECL output drivers contain one 2-to-32 frequency divider. This divider provides for division by 1 to 32. Division by 1 is accomplished by bypassing the divider. The dividers also provide for a programmable duty cycle, with optional duty-cycle correction when the divide ratio is odd. A phase offset or delay in increments of the input clock cycle is selectable. The channel dividers operate with a signal at their inputs up to 1600 MHz. The features and settings of the dividers are selected by programming the appropriate setup and control registers (see Table 51 through Table 61).
VCO Divider
The VCO divider provides frequency division between the internal VCO or the external CLK input and the clock distribution channel dividers. The VCO divider can be set to divide by 2, 3, 4, 5, or 6 (see Table 59, 0x1E0<2:0>).
Clock Frequency Division
The total frequency division is a combination of the VCO divider (when used) and the channel divider. When the VCO divider is used, the total division from the VCO or CLK to the output is the product of the VCO divider (2, 3, 4, 5, 6) and the division of the channel divider. Table 32 and Table 33 indicate how the frequency division for a channel is set. For the LVPECL outputs, there is only one divider per channel. For the LVDS/ CMOS outputs, there are two dividers (X.1, X.2) cascaded per channel. Table 32. Frequency Division for Divider 0 to Divider 2
CLK or VCO Selected CLK/VCO CLK/VCO CLK/VCO CLK CLK VCO Divider 2 to 6 2 to 6 2 to 6 Not used Not used Channel Divider 1 (bypassed) 1 (bypassed) 2 to 32 1 (bypassed) 2 to 32 Direct to Output Yes No No No No Frequency Division 1 (2 to 6) x (1) (2 to 6) x (2 to 32) 1
Channel Dividers--LVPECL Outputs
Each pair of LVPECL outputs is driven by a channel divider. There are three channel dividers (0, 1, and 2) driving a total of six LVPECL outputs (OUT0 to OUT5). Table 34 gives the register locations used for setting the division and other functions of these dividers. The division is set by the values of M and N. The divider can be bypassed (equivalent to divide-by-1, divider circuit is powered down) by setting the bypass bit. The duty-cycle correction can be enabled or disabled according to the setting of the DCCOFF bits. Table 34. Setting DX for Divider 0, Divider 1, and Divider 2
Divider 0 1 2 Low Cycles M 0x190<7:4> 0x193<7:4> 0x196<7:4> High Cycles N 0x190<3:0> 0x193<3:0> 0x196<3:0> Bypass 0x191<7> 0x194<7> 0x197<7> DCCOFF 0x192<0> 0x195<0> 0x198<0>
Channel Frequency Division (0, 1, and 2)
2 to 32
Table 33. Frequency Division for Divider 3 and Divider 4
CLK or VCO Selected CLK/VCO CLK/VCO CLK/VCO VCO Divider 2 to 6 2 to 6 2 to 6 Channel Divider X.1 X.2 1 1 (bypassed) (bypassed) 2 to 32 1 (bypassed) 2 to 32 2 to 32 Frequency Division (2 to 6) x (1) x (1) (2 to 6) x (2 to 32) x (1) (2 to 6) x (2 to 32) x (2 to 32) 1 (2 to 32) x (1) 2 to 32 x (2 to 32)
For each channel (where the channel number is x: 0, 1, or 2), the frequency division, DX, is set by the values of M and N (four bits each, representing decimal 0 to 15), where Number of Low Cycles = M + 1 Number of High Cycles = N + 1 The cycles are cycles of the clock signal currently routed to the input of the channel dividers (VCO divider out or CLK). When a divider is bypassed, DX = 1. Otherwise, DX = (N + 1) + (M + 1) = N + M + 2. This allows each channel divider to divide by any integer from 1 to 32.
CLK CLK CLK
Not used Not used Not used
1 2 to 32 2 to 32
1 1 2 to 32
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Duty Cycle and Duty-Cycle Correction (0, 1, and 2)
The duty cycle of the clock signal at the output of a channel is a result of some or all of the following conditions: * What are the M and N values for the channel? * Is the DCC enabled? * Is the VCO divider used? * What is the CLK input duty cycle? (The internal VCO has a 50% duty cycle.) The DCC function is enabled by default for each channel divider. However, the DCC function can be disabled individually for each channel divider by setting the DCCOFF bit for that channel. Certain M and N values for a channel divider result in a non50% duty cycle. A non-50% duty cycle can also result with an even division, if M N. The duty-cycle correction function automatically corrects non-50% duty cycles at the channel divider output to 50% duty cycle. Duty-cycle correction requires the following channel divider conditions: * An even division must be set as M = N * An odd division must be set as M = N + 1 When not bypassed or corrected by the DCC function, the duty cycle of each channel divider output is the numerical value of (N + 1)/(N + M + 2) expressed as a %. The duty cycle at the output of the channel divider for various configurations is shown in Table 35 to Table 37. Table 35. Duty Cycle with VCO Divider, Input Duty Cycle Is 50%
VCO Divider Even Odd = 3 Odd = 5 Even, Odd Even, Odd DX N+M+2 1 (divider bypassed) 1 (divider bypassed) 1 (divider bypassed) Even Odd Output Duty Cycle DCCOFF = 1 DCCOFF = 0 50% 50% 33.3% 40% (N + 1)/ (N + M + 2) (N + 1)/ (N + M + 2) 50% 50% 50%; requires M = N 50%; requires M = N + 1
Table 36. Duty Cycle with VCO Divider, Input Duty Cycle Is X%
VCO Divider Even Odd = 3 Odd = 5 Even DX N+M+2 1 (divider bypassed) 1 (divider bypassed) 1 (divider bypassed) Even Odd Odd = 3 Odd = 3 Odd = 5 Odd = 5 Even Odd Even Odd Output Duty Cycle DCCOFF = 1 DCCOFF = 0 50% 50% 33.3% 40% (N + 1)/ (N + M + 2) (N + 1)/ (N + M + 2) (N + 1)/ (N + M + 2) (N + 1)/ (N + M + 2) (N + 1)/ (N + M + 2) (N + 1)/ (N + M + 2) (1 + X%)/3 (2 + X%)/5 50%, requires M = N 50%, requires M = N + 1 50%, requires M = N (3N + 4 + X%)/(6N + 9), requires M = N + 1 50%, requires M = N (5N + 7 + X%)/(10N + 15), requires M = N + 1
Table 37. Channel Divider Output Duty Cycle when the VCO Divider Is Not Used
Input Clock Duty Cycle Any Any 50% X% DX N+M+2 1 Even Odd Odd Output Duty Cycle DCCOFF = 1 DCCOFF = 0 1 (divider Same as input bypassed) duty cycle 50%, requires M = N (N + 1)/ (M + N + 2) (N + 1)/ 50%, requires (M + N + 2) M=N+1 (N + 1)/ (N + 1 + X%)/(2 x N + 3), (M + N + 2) requires M = N + 1
The internal VCO has a duty cycle of 50%. Therefore, when the VCO is connected direct to output, the duty cycle is 50%. If the CLK input is routed direct to output, the duty cycle of the output is the same as the CLK input.
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Phase Offset or Coarse Time Delay (0, 1, and 2)
Each channel divider allows for a phase offset, or a coarse time delay, to be programmed by setting register bits (see Table 38). These settings determine the number of cycles (successive rising edges) of the channel divider input frequency by which to offset, or delay, the rising edge of the output of the divider. This delay is with respect to a nondelayed output (that is, with a phase offset of zero). The amount of the delay is set by 5 bits loaded into the phase offset (PO) register plus the start high (SH) bit for each channel divider. When the start high bit is set, the delay is also affected by the number of low cycles (M) programmed for the divider. It is necessary to use the SYNC function to make phase offsets effective (See the Synchronizing the Outputs--SYNC Function section). Table 38. Setting Phase Offset and Division for Divider 0, Divider 1, and Divider 2
Divider 0 1 2 Start High (SH) 0x191<4> 0x194<4> 0x197<4> Phase Offset (PO) 0x191<3:0> 0x194<3:0> 0x197<3:0> Low Cycles M 0x190<7:4> 0x193<7:4> 0x196<7:4> High Cycles N 0x190<3:0> 0x193<3:0> 0x196<3:0>
CHANNEL DIVIDER INPUT 0 1 2 Tx SH = 0 DIVIDER 0 PO = 0 DIVIDER 1 SH = 0 PO = 1 SH = 0 PO = 2 1 x Tx 2 x Tx
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3
4
5
6
7
8
9
10 11 12 13 14 15
CHANNEL DIVIDER OUTPUTS DIV = 4, DUTY = 50%
DIVIDER 2
Figure 53. Effect of Coarse Phase Offset (or Delay)
Channel Dividers--LVDS/CMOS Outputs
Channel Divider 3 and Channel Divider 4 each drive a pair of LVDS outputs, giving a total of four LVDS outputs (OUT6 to OUT9). Alternatively, each of these LVDS differential outputs can be configured individually as a pair (A and B) of CMOS single-ended outputs, providing for up to eight CMOS outputs. By default, the B output of each pair is off but can be turned on as desired. Channel Divider 3 and Channel Divider 4 each consist of two cascaded, 1 to 32, frequency dividers. The channel frequency division is DX.1 x DX.2 or up to 1024. Both of the dividers also have DCC enabled by default, but this function can be disabled, if desired, by setting the DCCOFF bit of the channel. A coarse phase offset or delay is also programmable (see the Phase Offset or Coarse Time Delay (Divider 3 and Divider 4) section). The channel dividers operate up to 1600 MHz. The features and settings of the dividers are selected by programming the appropriate setup and control registers (see Table 51 and Table 52 through Table 61). Table 39. Setting Division (DX) for Divider 3, Divider 4
Divider 3 3.1 3.2 4 4.1 4.2 M 0x199<7:4> 0x19B<7:4> 0x19E<7:4> 0x1A0<7:4> N 0x199<3:0> 0x19B<3:0> 0x19E<3:0> 0x1A0<3:0> Bypass 0x19C<4> 0x19C<5> 0x1A1<4> 0x1A1<5> DCCOFF 0x19D<0> 0x19D<0> 0x1A2<0> 0x1A2<0>
Let t = delay (in seconds). c = delay (in cycles of clock signal at input to DX). TX = period of the clock signal at the input of the divider, DX (in seconds). = 16 x SH<4> + 8 x PO<3> + 4 x PO<2> + 2 x PO<1> + 1 x PO<0> The channel divide-by is set as N = high cycles and M = low cycles. Case 1 For 15: t = x TX c = t/TX = Case 2 For 16: t = ( - 16 + M + 1) x TX c = t/TX By giving each divider a different phase offset, output-to-output delays can be set in increments of the channel divider input clock cycle. Figure 53 shows the results of setting such a coarse offset between outputs.
Channel Frequency Division (Divider 3 and Divider 4)
The division for each channel divider is set by the bits in the registers for the individual dividers (X.Y = 3.1, 3.2, 4.1, and 4.2) Number of Low Cycles = MX.Y + 1 Number of High Cycles = NX.Y + 1 When both X.1 and X.2 are bypassed, DX = 1 x 1 = 1. When only X.2 is bypassed, DX = (NX.1 + MX.1 + 2) x 1. When both X.1 and X.2 are not bypassed, DX = (NX.1 + MX.1 + 2) x (NX.2 + MX.2 + 2).
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By cascading the dividers, channel division up to 1024 can be obtained. However, not all integer value divisions from 1 to 1024 are obtainable; only the values that are the product of the separate divisions of the two dividers (DX.1 x DX.2) can be realized. If only one divider is needed when using Divider 3 and Divider 4, use the first one (X.1) and bypass the second one (X.2). Do not bypass X.1 and use X.2. Table 41. Divider 3, Divider 4 Duty Cycle; VCO Divider Not Used; Duty Cycle Correction Off (DCCOFF = 1)
Input Clock Duty Cycle 50% X% 50% X% 50% X% DX.1 NX.1 + MX.1 + 2 1 1 Even, Odd Even, Odd Even, Odd Even, Odd DX.2 NX.2 + MX.2 + 2 1 1 1 1 Even, Odd Even, Odd Output Duty Cycle 50% X% (NX.1 + 1)/ (NX.1 + MX.1 + 2) (NX.1 + 1)/ (NX.1 + MX.1 + 2) (NX.2 + 1)/ (NX.2 + MX.2 + 2) (NX.2 + 1)/ (NX.2 + MX.2 + 2)
Duty Cycle and Duty-Cycle Correction (Divider 3 and Divider 4)
The same duty cycle and DCC considerations apply to Divider 3 and Divider 4 as to Divider 0, Divider 1, and Divider 2 (see Duty Cycle and Duty-Cycle Correction (0, 1, and 2)); however, with these channel dividers, the number of possible configurations is even more complex. Duty-cycle correction on Divider 3 and Divider 4 requires the following channel divider conditions: * An even DX.Y must be set with the MX.Y = NX.Y (low cycles = high cycles). * An odd DX.Y must be set as MX.Y = NX.Y + 1 (the number of low cycles must be one greater than the number of high cycles). * If only one divider is bypassed, it must be the second divider, X.2. * If only one divider has an even divide by, it must be the second divider, X.2. The possibilities for the duty cycle of the output clock from Divider 3 and Divider 4 are shown in Table 40 through Table 44 Table 40. Divider 3, Divider 4 Duty Cycle; VCO Divider Used; Duty Cycle Correction Off (DCCOFF = 1)
VCO Divider Even Odd = 3 Odd = 5 Even Odd Even Odd DX.1 NX.1 + MX.1 + 2 1 1 1 Even, Odd Even, Odd Even, Odd Even, Odd DX.2 NX.2 + MX.2 + 2 1 1 1 1 1 Even, Odd Even, Odd Output Duty Cycle 50% 33.3% 40% (NX.1 + 1)/ (NX.1 + MX.1 + 2) (NX.1 + 1)/ (NX.1 + MX.1 + 2) (NX.2 + 1)/ (NX.2 + MX.2 + 2) (NX.2 + 1)/ (NX.2 + MX.2 + 2)
Table 42. Divider 3, Divider 4 Duty Cycle; VCO Divider Used; Duty Cycle Correction Is On (DCCOFF = 0); VCO Divider Input Duty Cycle = 50%
VCO Divider Even Odd Even Odd Even Odd Even Odd Even Odd Even Odd DX.1 NX.1 + MX.1 + 2 1 1 Even (NX.1 = MX.1) Even (NX.1 = MX.1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Even (NX.1 = MX.1) Even (NX.1 = MX.1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) DX.2 NX.2 + MX.2 + 2 1 1 1 1 1 1 Even (NX.2 = MX.2) Even (NX.2 = MX.2) Even (NX.2 = MX.2) Even (NX.2 = MX.2) Odd (MX.2 = NX.2 + 1) Odd (MX.2 = NX.2 + 1) Output Duty Cycle 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50%
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Table 43. Divider 3, Divider 4 Duty Cycle; VCO Divider Used; Duty Cycle Correction On (DCCOFF = 0); VCO Divider Input Duty Cycle = X%
VCO Divider Even Odd = 3 Odd = 5 Even Odd Even Odd = 3 Odd = 5 Even Odd Even Odd Even DX.1 NX.1 + MX.1 + 2 1 1 1 Even (NX.1 = MX.1) Even (NX.1 = MX.1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Even (NX.1 = MX.1) Even (NX.1 = MX.1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) DX.2 NX.2 + MX.2 + 2 1 1 1 1 1 1 1 1 Even (NX.2 = MX.2) Even (NX.2 = MX.2) Even (NX.2 = MX.2) Even (NX.2 = MX.2) Odd (MX.2 = NX.2 + 1) Odd (MX.2 = NX.2 + 1) Output Duty Cycle 50% (1 + X%)/3 (2 + X%)/5 50% 50% 50% (3NX.1 + 4 + X%)/ (6NX.1 + 9) (5NX.1 + 7 + X%)/ (10NX.1 + 15) 50% 50% 50% 50% 50% (6NX.1NX.2 + 9NX.1 + 9NX.2 + 13 + X%)/ (3(2NX.1 + 3) (2NX.2 + 3)) (10NX.1NX.2 + 15NX.1 + 15NX.2 + 22 + X%)/ (5(2 NX.1 + 3) (2 NX.2 + 3))
Table 44. Divider 3, Divider 4 Duty Cycle; VCO Divider Not Used; Duty Cycle Correction On (DCCOFF = 0)
Input Clock Duty Cycle 50% 50% X% X% 50% X% DX.1 NX.1 + MX.1 + 2 1 Even (NX.1 = MX.1) 1 Even (NX.1 = MX.1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Even (NX.1 = MX.1) Even (NX.1 = MX.1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) Odd (MX.1 = NX.1 + 1) DX.2 NX.2 + MX.2 + 2 1 1 1 1 1 1 1 Even (NX.2 = MX.2) Even (NX.2 = MX.2) Even (NX.2 = MX.2) Even (NX.2 = MX.2) Odd (MX.2 = NX.2 + 1) Odd (MX.2 = NX.2 + 1) Output Duty Cycle 50% 50% X% (High) 50% 50% (NX.1 + 1 + X%)/ (2NX.1 + 3) (NX.1 + 1 + X%)/ (2NX.1 + 3) 50% 50% 50% 50% 50% (2NX.1NX.2 + 3NX.1 + 3NX.2 + 4 + X%)/ ((2NX.1 + 3)(2NX.2 + 3))
50% X% 50% X% 50% X%
Odd = 3
Phase Offset or Coarse Time Delay (Divider 3 and Divider 4)
Divider 3 and Divider 4 can be set to have a phase offset or delay. The phase offset is set by a combination of the bits in the phase offset and start high registers (see Table 45). Table 45. Setting Phase Offset and Division for Divider 3 and Divider 4
Divider 3 3.1 3.2 4 4.1 4.2 Start High (SH) 0x19C<0> 0x19C<1> 0x1A1<0> 0x1A1<1> Phase Offset (PO) 0x19A<3:0> 0x19A<7:4> 0x19F<3:0> 0x19F<7:4> Low Cycles M 0x199<7:4> 0x19B<7:4> 0x19E<7:4> 0x1A0<7:4> High Cycles N 0x199<3:0> 0x19B<3:0> 0x19E<3:0> 0x1A0<3:0>
Odd = 5
Odd (MX.1 = NX.1 + 1)
Odd (MX.2 = NX.2 + 1)
Let t = delay (in seconds). x.y = 16 x SH<0> + 8 x PO<3> + 4 x PO<2> + 2 x PO<1> + 1 x PO<0>. TX.1 = period of the clock signal at the input to DX.1 (in seconds). TX.2 = period of the clock signal at the input to DX.2 (in seconds).
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Case 1 When x.1 15 and x.2 15: t = x.1 x TX.1 + X.2 x Tx.2 Case 2 When x.1 15 and x.2 16: t = X.1 x TX.1 + (X.2 - 16 + MX.2 + 1) x TX.2 Case 3 When X.1 16 and X.2 15: t = (X.1 - 16 + MX.1 + 1) x TX.1 + X.2 x TX.2 Case 4 When X.1 16 and X.2 16: t = (X.1 - 16 + MX.1 + 1) x TX.1 + (X.2 - 16 + MX.2 + 1) x TX.2
Calculating the Fine Delay
The following values and equations are used to calculate the delay of the delay block. IRAMP (A) = 200 x (Ramp Current + 1) Number of Capacitors = Number of = 0 in Ramp Capacitors + 1 Example: 101 = 1 + 1 = 2; 110 = 1 + 1 = 2; 100 = 2 + 1 = 3; 001 = 2 + 1 = 3; 111 = 0 + 1 = 1. Delay Range (ns) = 200 x ((No. of Caps + 3)/(IRAMP)) x 1.3286
No.of Caps - 1 x6 Offset (ns ) = 0.34 + (1600 - I RAMP )x 10 -4 + I RAMP Delay Full Scale (ns) = Delay Range + Offset
Fine Delay (ns) = Delay Range x Delay Fraction x (1/63) + Offset Note that only delay fraction values up to 47 decimal (101111b; 0x2F) are supported. In no case can the fine delay exceed one-half of the output clock period. If a delay longer than half of the clock period is attempted, the output stops clocking. The delay function adds some jitter greater than that specified for the nondelayed output. This means that the delay function should be used primarily for clocking digital chips, such as FPGA, ASIC, DUC, and DDC. An output with this delay enabled may not be suitable for clocking data converters. The jitter is higher for long full scales because the delay block uses a ramp and trip points to create the variable delay. A slower ramp time produces more time jitter.
Fine Delay Adjust (Divider 3 and Divider 4)
Each AD9516 LVDS/CMOS output (OUT6 to OUT9) includes an analog delay element that can be programmed to give variable time delays (t) in the clock signal at that output.
VCO CLK DIVIDER BYPASS CMOS T FINE DELAY ADJUST DIVIDER X.1 DIVIDER X.2 BYPASS CMOS T FINE DELAY ADJUST LVDS CMOS OUTN
06419-072
LVDS CMOS
OUTM OUTM OUTPUT DRIVERS
OUTN
Figure 54. Fine Delay (OUT6 to OUT9)
Synchronizing the Outputs--SYNC Function
The AD9516 clock outputs can be synchronized to each other. Outputs can be individually excluded from synchronization. Synchronization consists of setting the nonexcluded outputs to a preset set of static conditions and subsequently releasing these outputs to continue clocking at the same instant with the preset conditions applied. This allows for the alignment of the edges of two or more outputs or for the spacing of edges according to the coarse phase offset settings for two or more outputs.
The amount of delay applied to the clock signal is determined by programming four registers per output (see Table 46). Table 46. Setting Analog Fine Delays
OUTPUT (LVDS/CMOS) OUT6 OUT7 OUT8 OUT9 Ramp Capacitors 0xA1<5:3> 0xA4<5:3> 0xA7<5:3> 0xAA<5:3> Ramp Current 0xA1<2:0> 0xA4<2:0> 0xA7<2:0> 0xAA<2:0> Delay Fraction 0xA2<5:0> 0xA5<5:0> 0xA8<5:0> 0xAB<5:0> Delay Bypass 0xA0<0> 0xA3<0> 0xA6<0> 0xA9<0>
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Synchronization of the outputs is executed in several ways: * The SYNC pin is forced low and then released (manual sync). * By setting and then resetting any one of the following three bits: the soft sync bit (0x230<0>), the soft reset bit (0x00<5> [mirrored]), and the distribution power-down bit (0x230<1>). * Synchronization of the outputs can be executed as part of the chip power-up sequence. * The RESET pin is forced low and then released (chip reset). * The PD pin is forced low and then released (chip power down). * Whenever a VCO calibration is completed, an internal SYNC signal is automatically asserted at the beginning and released upon the completion of a VCO calibration. The most common way to execute the SYNC function is to use the SYNC pin to do a manual synchronization of the outputs. This requires a low-going signal on the SYNC pin, which is held low and then released when synchronization is desired. The timing of the SYNC operation is shown in Figure 55 (using VCO divider) and Figure 56 (VCO divider not used). There is an uncertainty of up to 1 cycle of the clock at the input to the channel divider due to the asynchronous nature of the SYNC signal with respect to the clock edges inside the AD9516. The delay from the SYNC rising edge to the beginning of synchronized output clocking is between 14 and 15 cycles of clock at the channel divider input, plus either one cycle of the VCO divider input (see Figure 55), or one cycle of the channel divider input (see Figure 56), depending on whether the VCO divider is used. Cycles are counted from the rising edge of the signal. Another common way to execute the SYNC function is by setting and resetting the soft sync bit at 0x230<0> (see Table 52 through Table 61 for details). Both setting and resetting of the soft sync bit requires an update all registers (0x232<0> = 1) operation to take effect.
CHANNEL DIVIDER OUTPUT CLOCKING CHANNEL DIVIDER OUTPUT CLOCKING
CHANNEL DIVIDER OUTPUT STATIC
INPUT TO VCO DIVIDER
1
INPUT TO CHANNEL DIVIDER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SYNC PIN
OUTPUT OF CHANNEL DIVIDER 14 TO 15 CYCLES AT CHANNEL DIVIDER INPUT + 1 CYCLE AT VCO DIVIDER INPUT
06419-073
Figure 55. SYNC Timing when VCO Divider Is Used--CLK or VCO Is Input
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CHANNEL DIVIDER OUTPUT CLOCKING CHANNEL DIVIDER OUTPUT STATIC CHANNEL DIVIDER OUTPUT CLOCKING
INPUT TO CLK
1
IINPUT TO CHANNEL DIVIDER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SYNC PIN
OUTPUT OF CHANNEL DIVIDER 14 TO 15 CYCLES AT CHANNEL DIVIDER INPUT + 1 CYCLE AT CLK INPUT
Figure 56. SYNC Timing when VCO Divider Is Not Used--CLK Input Only
A SYNC operation brings all outputs that have not been excluded (by the NOSYNC bit) to a preset condition before allowing the outputs to begin clocking in synchronicity. The preset condition takes into account the settings in each of the channel's start high bit and its phase offset. These settings govern both the static state of each output when the SYNC operation is happening and the state and relative phase of the outputs when they begin clocking again upon completion of the SYNC operation. Between outputs and after synchronization, this allows for the setting of phase offsets. The AD9516 outputs are in pairs, sharing a channel divider per pair (two pairs of pairs, four outputs, in the case of CMOS). The synchronization conditions apply to both outputs of a pair. Each channel (a divider and its outputs) can be excluded from any SYNC operation by setting the NOSYNC bit of the channel. Channels that are set to ignore SYNC (excluded channels) do not set their outputs static during a SYNC operation, and their outputs are not synchronized with those of the nonexcluded channels.
LVPECL Outputs: OUT0 to OUT5
The LVPECL differential voltage (VOD) is selectable (from ~400 mV to ~960 mV, see 0xF0:0xF5<3:2>. The LVPECL outputs have dedicated pins for power supply (VS_LVPECL), allowing for a separate power supply to be used. VS_LVPECL can be from 2.5 V to 3.3 V. The LVPECL output polarity can be set as noninverting or inverting, which allows for the adjustment of the relative polarity of outputs within an application without requiring a board layout change. Each LVPECL output can be powered down or powered up as needed. Because of the architecture of the LVPECL output stages, there is the possibility of electrical overstress and breakdown under certain power-down conditions. For this reason, the LVPECL outputs have several power-down modes. This includes a safe power-down mode that continues to protect the output devices while powered down, although it consumes somewhat more power than a total power-down. If the LVPECL output pins are terminated, it is best to select the safe power-down mode. If the pins are not connected (unused), it is acceptable to use the total power-down mode.
3.3V
Clock Outputs
The AD9516 offers three different output level choices: LVPECL, LVDS, and CMOS. OUT0 to OUT5 are LVPECL differential outputs; and OUT6 to OUT9 are LVDS/CMOS outputs. These outputs can be configured as either LVDS differential or as pairs of single-ended CMOS outputs.
OUT OUT
GND
Figure 57. LVPECL Output Simplified Equivalent Circuit
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06419-074
AD9516-0
LVDS/CMOS Outputs: OUT6 to OUT9
OUT6 to OUT9 can be configured as either an LVDS differential output or as a pair of CMOS single-ended outputs. The LVDS outputs allow for selectable output current from ~1.75 mA to ~7 mA. The LVDS output polarity can be set as noninverting or inverting, which allows for the adjustment of the relative polarity of outputs within an application without requiring a board layout change. Each LVDS output can be powered down if not needed to save power.
3.5mA
Power-On Reset--Start-Up Conditions when VS Is Applied
A power-on reset (POR) is issued when the VS power supply is turned on. This initializes the chip to the power-on conditions that are determined by the default register settings. These are indicated in the Default Value column of Table 51. At power-on, the AD9516 also executes a SYNC operation, which brings the outputs into phase alignment according to the default settings.
Asynchronous Reset via the RESET Pin
An asynchronous hard reset is executed by momentarily pulling RESET low. A reset restores the chip registers to the default settings.
Soft Reset via 0x00<5>
OUT OUT
3.5mA
A soft reset is executed by writing 0x00<5> and 0x00<2> = 1b. This bit is not self-clearing; therefore, it must be cleared by writing 0x00<5> and 0x00<2> = 0b to reset it and complete the soft reset operation. A soft reset restores the default values to the internal registers. The soft reset bit does not require an update registers command (0x232) to be issued.
Figure 58. LVDS Output Simplified Equivalent Circuit with 3.5 mA Typical Current Source
06419-034
POWER-DOWN MODES
Chip Power-Down via PD
The AD9516 can be put into a power-down condition by pulling the PD pin low. Power-down turns off most of the functions and currents inside the AD9516. The chip remains in this power-down state until PD is brought back to Logic High. When woken up, the AD9516 returns to the settings programmed into its registers prior to the power-down, unless the registers are changed by new programming while the PD pin is held low. The PD power-down shuts down the currents on the chip, except the bias current necessary to maintain the LVPECL outputs in a safe shutdown mode. This is needed to protect the LVPECL output circuitry from damage that could be caused by certain termination and load configurations when tristated. Because this is not a complete power-down, it can be called sleep mode. When the AD9516 is in a PD power-down, the chip is in the following state:
OUT6 to OUT9 can also be CMOS outputs. Each LVDS output can be configured to be two CMOS outputs. This provides for up to eight CMOS outputs: OUT6A, OUT6B, OUT7A, OUT7B, OUT8A, OUT8B, OUT9A, and OUT9B. When an output is configured as CMOS, the CMOS Output A is automatically turned on. The CMOS Output B can be turned on or off independently. The relative polarity of the CMOS outputs can also be selected for any combination of inverting and noninverting. See Table 56, 0x140<7:5>, 0x141<7:5>, 0x142<7:5>, and 0x143<7:5>. Each LVDS/CMOS output can be powered-down as needed to save power. The CMOS output power-down is controlled by the same bit that controls the LVDS power-down for that output. This power-down control affects both the CMOS A and CMOS B outputs. However, when the CMOS A output is powered up, the CMOS B output can be powered on or off separately.
VS
OUT1/ OUT1
06419-035
* * * * * * *
The PLL is off (asynchronous power-down). The VCO is off. The CLK input buffer is off. All dividers are off. All LVDS/CMOS outputs are off. All LVPECL outputs are in safe off mode. The serial control port is active, and the chip responds to commands.
Figure 59. CMOS Equivalent Output Circuit
RESET MODES
The AD9516 has several ways to force the chip into a reset condition that restores all registers to their default values, and makes these settings active.
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If the AD9516 clock outputs must be synchronized to each other, a SYNC is required upon exiting power-down (see the Synchronizing the Outputs--SYNC Function section). A VCO calibration is not required when exiting power-down.
Individual Clock Output Power-Down
Any of the clock distribution outputs may be powered down individually by writing to the appropriate registers. The register map details the individual power-down settings for each output. The LVDS/CMOS outputs may be powered down, regardless of their output load configuration. The LVPECL outputs have multiple power-down modes (see Table 55), which give some flexibility in dealing with the various output termination conditions. When the mode is set to 10b, the LVPECL output is protected from reverse bias to 2 VBE + 1 V. If the mode is set to 11b, the LVPECL output is not protected from reverse bias and can be damaged under certain termination conditions. This setting also affects the operation when the distribution block is powered down with 0x230<1> = 1b (see the Distribution Power-Down section).
PLL Power-Down
The PLL section of the AD9516 can be selectively powered down. There are three PLL operating modes set by 0x10<1:0>, as shown in Table 53. In asynchronous power-down mode, the device powers down as soon as the registers are updated. In synchronous power-down mode, the PLL power-down is gated by the charge pump to prevent unwanted frequency jumps. The device goes into power-down on the occurrence of the next charge pump event after the registers are updated.
Distribution Power-Down
The distribution section can be powered down by writing 0x230<1> = 1b. This turns off the bias to the distribution section. If the LVPECL power-down mode is normal operation (00b), it is possible for a low impedance load on that LVPECL output to draw significant current during this power-down. If the LVPECL power-down mode is set to 11b, the LVPECL output is not protected from reverse bias and can be damaged under certain termination conditions.
Individual Circuit Block Power-Down
Other AD9516 circuit blocks (such as CLK, REF1, and REF2) can be powered down individually. This gives flexibility in configuring the part for power savings whenever certain chip functions are not needed.
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AD9516-0 SERIAL CONTROL PORT
The AD9516 serial control port is a flexible, synchronous, serial communications port that allows an easy interface with many industry-standard microcontrollers and microprocessors. The AD9516 serial control port is compatible with most synchronous transfer formats, including both the Motorola SPI(R) and Intel(R) SSR(R) protocols. The serial control port allows read/write access to all registers that configure the AD9516. Single or multiple byte transfers are supported, as well as MSB first or LSB first transfer formats. The AD9516 serial control port can be configured for a single bidirectional I/O pin (SDIO only) or for two unidirectional I/O pins (SDIO/SDO). By default, the AD9516 is in bidirectional mode, long instruction (long instruction is only instruction mode supported). During this period, the serial control port state machine enters a wait state until all data is sent. If the system controller decides to abort the transfer before all of the data is sent, the state machine must be reset by either completing the remaining transfers or by returning the CS low for at least one complete SCLK cycle (but less than eight SCLK cycles). Raising the CS on a nonbyte boundary terminates the serial transfer and flushes the buffer. In the streaming mode (see Table 47), any number of data bytes can be transferred in a continuous stream. The register address is automatically incremented or decremented (see the MSB/LSB First Transfers section). CS must be raised at the end of the last byte to be transferred, thereby ending the stream mode.
SERIAL CONTROL PORT PIN DESCRIPTIONS
SCLK (serial clock) is the serial shift clock. This pin is an input. SCLK is used to synchronize serial control port reads and writes. Write data bits are registered on the rising edge of this clock, and read data bits are registered on the falling edge. This pin is internally pulled down by a 30 k resistor to ground. SDIO (serial data input/output) is a dual-purpose pin and acts as either an input only (unidirectional mode) or as both an input/output (bidirectional mode). The AD9516 defaults to the bidirectional I/O mode (0x00<7> = 0). SDO (serial data out) is used only in the unidirectional I/O mode (0x00<7>) as a separate output pin for reading back data. CS (chip select bar) is an active low control that gates the read and write cycles. When CS is high, SDO and SDIO are in a high impedance state. This pin is internally pulled up by a 30 k resistor to VS.
SCLK CS SDO SDIO
16 17 21 22
Communication Cycle--Instruction Plus Data
There are two parts to a communication cycle with the AD9516. The first writes a 16-bit instruction word into the AD9516, coincident with the first 16 SCLK rising edges. The instruction word provides the AD9516 serial control port with information regarding the data transfer, which is the second part of the communication cycle. The instruction word defines whether the upcoming data transfer is a read or a write, the number of bytes in the data transfer, and the starting register address for the first byte of the data transfer.
Write
If the instruction word is for a write operation, the second part is the transfer of data into the serial control port buffer of the AD9516. Data bits are registered on the rising edge of SCLK. The length of the transfer (1, 2, 3 bytes or streaming mode) is indicated by two bits (W1:W0) in the instruction byte. When the transfer is 1, 2, or 3 bytes, but not streaming, CS can be raised after each sequence of eight bits to stall the bus (except after the last byte, where it ends the cycle). When the bus is stalled, the serial transfer resumes when CS is lowered. Raising CS on a nonbyte boundary resets the serial control port. During a write, streaming mode does not skip over reserved or blank registers; therefore, the user must know what bit pattern to write to the reserved registers to preserve proper operation of the part. It does not matter what data is written to blank registers. Because data is written into a serial control port buffer area, not directly into the actual control registers of the AD9516, an additional operation is needed to transfer the serial control port buffer contents to the actual control registers of the AD9516, thereby causing them to become active. The update registers operation consists of setting 0x232<0> = 1b (this bit is selfclearing). Any number of bytes of data can be changed before executing an update registers. The update registers simultaneously actuates all register changes that have been written to the buffer since any previous update.
AD9516-0
06419-036
SERIAL CONTROL PORT
Figure 60. Serial Control Port
GENERAL OPERATION OF SERIAL CONTROL PORT
A write or a read operation to the AD9516 is initiated by pulling CS low. CS stall high is supported in modes where three or fewer bytes of data (plus instruction data) are transferred (see Table 47). In these modes, CS can temporarily return high on any byte boundary, allowing time for the system controller to process the next byte. CS can go high on byte boundaries only and can go high during either part (instruction or data) of the transfer.
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Read
If the instruction word is for a read operation, the next N x 8 SCLK cycles clock out the data from the address specified in the instruction word, where N is 1 to 3 as determined by W1:W0. If N = 4, the read operation is in streaming mode, continuing until CS is raised. Streaming mode does not skip over reserved or blank registers. The readback data is valid on the falling edge of SCLK. The default mode of the AD9516 serial control port is the bidirectional mode. In bidirectional mode, both the sent data and the readback data appears on the SDIO pin. It is also possible to set the AD9516 to unidirectional mode (SDO enable register, 0x00<7>). In unidirectional mode, the readback data appears on the SDO pin. A readback request reads the data that is in the serial control port buffer area, or the data in the active registers (see Figure 61). Readback of the buffer or active registers is controlled by 0x04<0>. The AD9516 supports only the long instruction mode, therefore 0x00<4:3> must be set to 11b (this register uses mirrored bits). Long instruction mode is the default at power-up or reset. The AD9516 uses Register Address 0x000 to Register Address 0x232.
BUFFER REGISTERS
SCLK SDIO SDO CS SERIAL CONTROL PORT
A12:A0: These 13 bits select the address within the register map that is written to or read from during the data transfer portion of the communications cycle. Only Bits are needed to cover the range of the 0x232 registers used by the AD9516. Bits must always be 0b. For multibyte transfers, this address is the starting byte address. In MSB first mode, subsequent bytes increment the address.
MSB/LSB FIRST TRANSFERS
The AD9516 instruction word and byte data can be MSB first or LSB first. Any data written to 0x000 must be mirrored, the upper four bits (<7:4>) with the lower four bits (<3:0>). This makes it irrelevant whether LSB first or MSB first is in effect. As an example of this mirroring, see the default setting for this register: 0x18, which mirrors Bit 4 and Bit 3. This sets the long instruction mode (default, and only mode supported). The default for the AD9516 is MSB first. When LSB first is set by 0x000<2> and 0x000<6>, it takes effect immediately, because it only affects the operation of the serial control port and does not require that an update be executed. When MSB first mode is active, the instruction and data bytes must be written from MSB to LSB. Multibyte data transfers in MSB first format start with an instruction byte that includes the register address of the most significant data byte. Subsequent data bytes must follow in order from the high address to the low address. In MSB first mode, the serial control port internal address generator decrements for each data byte of the multibyte transfer cycle. When LSB first is active, the instruction and data bytes must be written from LSB to MSB. Multibyte data transfers in LSB first format start with an instruction byte that includes the register address of the least significant data byte followed by multiple data bytes. The internal byte address generator of the serial control port increments for each byte of the multibyte transfer cycle. The AD9516 serial control port register address decrements from the register address just written toward 0x000 for multibyte I/O operations if the MSB first mode is active (default). If the LSB first mode is active, the register address of the serial control port increments from the address just written toward 0x232 for multibyte I/O operations. Streaming mode always terminates when it hits Address 0x232. Note that unused addresses are not skipped during multibyte I/O operations. Table 48. Streaming Mode (No Addresses Are Skipped)
Write Mode LSB first MSB first Address Direction Increment Decrement Stop Sequence 0x230, 0x231, 0x232, stop 0x001, 0x000, 0x232, stop
UPDATE REGISTERS
ACTIVE REGISTERS
WRITE REGISTER 0x232 = 0x01 TO UDATE REGISTERS
Figure 61. Relationship Between Serial Control Port Buffer Registers and Active Registers of the AD9516
THE INSTRUCTION WORD (16 BITS)
The MSB of the instruction word is R/W, which indicates whether the instruction is a read or a write. The next two bits, W1:W0, indicate the length of the transfer in bytes. The final 13 bits are the address (A12:A0) at which to begin the read or write operation. For a write, the instruction word is followed by the number of bytes of data indicated by Bits W1:W0, see Table 47. Table 47. Byte Transfer Count
W1 0 0 1 1 W0 0 1 0 1 Bytes to Transfer 1 2 3 Streaming mode
06419-037
Rev. 0 | Page 53 of 84
AD9516-0
Table 49. Serial Control Port, 16-Bit Instruction Word, MSB First
MSB I15 R/W I14 W1 I13 W0 I12 A12 = 0 I11 A11 = 0 I10 A10 = 0 I9 A9 I8 A8 I7 A7 I6 A6 I5 A5 I4 A4 I3 A3 I2 A2 I1 A1 LSB I0 A0
CS SCLK DON'T CARE SDIO DON'T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 DON'T CARE DON'T CARE
16-BIT INSTRUCTION HEADER
REGISTER (N) DATA
REGISTER (N - 1) DATA
Figure 62. Serial Control Port Write--MSB First, 16-Bit Instruction, Two Bytes Data
CS SCLK DON'T CARE SDIO
R/W W1 W0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 DON'T CARE
16-BIT INSTRUCTION HEADER
REGISTER (N) DATA
REGISTER (N - 1) DATA
REGISTER (N - 2) DATA
REGISTER (N - 3) DATA
DON'T CARE
Figure 63. Serial Control Port Read--MSB First, 16-Bit Instruction, Four Bytes Data
tDS tS
CS
tHI tDH tLO
tCLK
tC
SCLK
DON'T CARE
DON'T CARE
SDIO
Figure 64. Serial Control Port Write--MSB First, 16-Bit Instruction, Timing Measurements
CS
SCLK
06419-041
tDV
SDIO SDO DATA BIT N DATA BIT N - 1
Figure 65. Timing Diagram for Serial Control Port Register Read
CS SCLK DON'T CARE SDIO DON'T CARE A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 W0 W1 R/W D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7 DON'T CARE DON'T CARE
06419-042
16-BIT INSTRUCTION HEADER
REGISTER (N) DATA
REGISTER (N + 1) DATA
Figure 66. Serial Control Port Write--LSB First, 16-Bit Instruction, Two Bytes Data
Rev. 0 | Page 54 of 84
06419-040
DON'T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
A6
A5
D4
D3
D2
D1
D0
DON'T CARE
06419-039
SDO DON'T CARE
06419-038
AD9516-0
tS
CS
tC
tCLK tHI
SCLK
tLO
tDS
tDH
SDIO BI N BI N + 1
Figure 67. Serial Control Port Timing--Write
Table 50. Serial Control Port Timing
Parameter tDS tDH tCLK tS tC tHI tLO tDV Description Setup time between data and rising edge of SCLK Hold time between data and rising edge of SCLK Period of the clock Setup time between CS falling edge and SCLK rising edge (start of communication cycle) Setup time between SCLK rising edge and CS rising edge (end of communication cycle) Minimum period that SCLK should be in a Logic High state Minimum period that SCLK should be in a Logic Low state SCLK to valid SDIO and SDO (see Figure 65)
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06419-043
AD9516-0 REGISTER MAP OVERVIEW
Table 51. Register Map Overview
Addr Bit 7 (Hex) (MSB) Parameter Serial Port Configuration 00 Serial Port SDO Configuration Active 01 02 to 03 04 Default Value (Hex) 18
Bit 6 LSB First
Bit 5 Soft Reset
Bit 4 Long Instruction
Bit 3 Long Instruction
Bit 2 Soft Reset
Bit 1 LSB First
Bit 0 (LSB) SDO Active
Blank Reserved Read Back Control Blank Read Back Active Registers Charge Pump Mode PLL Power-Down 00
PLL 10 11 12 13 14 15 16 17 18
PFD and Charge Pump R Counter A Counter B Counter PLL Control 1 PLL Control 2 PLL Control 3
PFD Polarity Blank Blank
Charge Pump Current
7D 01 00 00 03 00 06 00 06
19 1A
PLL Control 4 PLL Control 5
1B
PLL Control 6
1C
PLL Control 7
14-Bit R Divider Bits<7:0> (LSB) 14-Bit R Divider Bits<3:8> (MSB) 6-Bit A Counter 13-Bit B Counter Bits<7:0> (LSB) Blank 13-Bit B Counter Bits<12:8> (MSB) Set CP Pin Reset R Reset A and Reset All B Counter Prescaler P to VCP/2 Counter B Counters Counters Bypass STATUS Pin Control Antibacklash Pulse Width VCO Calibration Divider VCO Cal Disable Reserved Lock Detect Counter Digital Lock Now Digital Lock Detect Detect Window R Path Delay N Path Delay R, A, B Counters SYNC Pin Reset LD Pin Control Reserved Reference Frequency Monitor Threshold REFMON Pin Control REF2 REF1 (REFIN) VCO Frequency Frequency (REFIN) Monitor Monitor Frequency Monitor Stay on REF2 REF1 Differential Select Use Automatic Disable REF2 Power On Power On Reference REF_SEL Pin Reference Switchover REF2 Switchover Deglitch Reserved PLL Status Register Disable LD Pin Comparator Enable Reserved Reserved VCO Cal Finished Holdover Active REF2 Selected VCO Frequency > Threshold Blank REF2 Frequency > Threshold REF1 Frequency >Threshold Digital Lock Detect Holdover Enable External Holdover Control Holdover Enable
00 00
00
00
1D
PLL Control 8
00
1E 1F
PLL Control 9 PLL Readback
00 --
20 to 4F
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AD9516-0
Addr Bit 7 (Hex) (MSB) Parameter Bit 6 Fine Delay Adjust: OUT6 to OUT9 A0 OUT6 Delay Bypass A1 OUT6 Delay Blank Full-Scale A2 OUT6 Delay Blank Fraction A3 A4 A5 A6 A7 A8 A9 AA AB OUT7 Delay Bypass OUT7 Delay Full-Scale OUT7 Delay Fraction OUT8 Delay Bypass OUT8 Delay Full-Scale OUT8 Delay Fraction OUT9 Delay Bypass OUT9 Delay Full-Scale OUT9 Delay Fraction Default Value (Hex) 01 00 00 OUT7 Delay Bypass OUT7 Ramp Current OUT7 Delay Fraction Blank Blank Blank Blank Blank Blank Blank OUT9 Ramp Capacitors OUT9 Delay Fraction OUT8 Ramp Capacitors OUT8 Delay Fraction OUT9 Delay Bypass OUT9 Ramp Current OUT8 Delay Bypass OUT8 Ramp Current 01 00 00 01 00 00 01 00 00
Bit 5
Bit 4 Blank
Bit 3
Bit 2
Bit 1
Bit 0 (LSB)
OUT6 Ramp Capacitors OUT6 Delay Fraction Blank
OUT6 Delay Bypass OUT6 Ramp Current
Blank Blank
OUT7 Ramp Capacitors
AC to EF LVPECL Outputs F0 OUT0 F1 F2 F3 F4 F5 F6 to 13F LVDS/CMOS Outputs 140 OUT6 OUT1 OUT2 OUT3 OUT4 OUT5
Blank Blank Blank Blank Blank Blank
OUT0 Invert OUT1 Invert OUT2 Invert OUT3 Invert OUT4 Invert OUT5 Invert Blank
OUT0 LVPECL Differential Voltage OUT1 LVPECL Differential Voltage OUT2 LVPECL Differential Voltage OUT3 LVPECL Differential Voltage OUT4 LVPECL Differential Voltage OUT5 LVPECL Differential Voltage
OUT0 Power-Down OUT1 Power-Down OUT2 Power-Down OUT3 Power-Down OUT4 Power-Down OUT5 Power-Down
08 A 08 0A 08 0A
OUT6 CMOS Output Polarity
141
OUT7
OUT7 CMOS Output Polarity
142
OUT8
OUT8 CMOS Output Polarity
143
OUT9
OUT9 CMOS Output Polarity
OUT6 LVDS/ CMOS Output Polarity OUT7 LVDS/ CMOS Output Polarity OUT8 LVDS/ CMOS Output Polarity OUT9 LVDS/ CMOS Output Polarity
OUT6 CMOS B
OUT6 Select LVDS/CMOS
OUT6 LVDS Output Current
OUT6 Power-Down
42
OUT7 CMOS B
OUT7 Select LVDS/CMOS
OUT7 LVDS Output Current
OUT7 Power-Down
43
OUT8 CMOS B
OUT8 Select LVDS/CMOS
OUT8 LVDS Output Current
OUT8 Power-Down
42
OUT9 CMOS B
OUT9 Select LVDS/CMOS
OUT9 LVDS Output Current
OUT9 Power-Down
43
Rev. 0 | Page 57 of 84
AD9516-0
Addr (Hex) 144 to 18F Bit 7 (MSB) Default Value (Hex)
Parameter
Bit 6
Bit 5
Bit 4
Bit 3 Blank
Bit 2
Bit 1
Bit 0 (LSB)
LVPECL Channel Dividers 190 Divider 0 (PECL) 191 Divider 0 Bypass 192 Blank
Divider 0 Low Cycles Divider 0 Nosync Divider 0 Force High Divider 0 Start High Reserved
Divider 0 High Cycles Divider 0 Phase Offset Divider 0 Direct to Output Divider 1 High Cycles Divider 1 Phase Offset Divider 1 Direct to Output Divider 2 High Cycles Divider 2 Phase Offset Divider 2 Direct to Output High Cycles Divider 3.1 Phase Offset Divider 3.1 High Cycles Divider 3.2 Bypass Divider 3.1 Divider 3 Nosync Reserved Divider 3 Force High Start High Divider 3.2 Start High Divider 3.1 Divider 3 DCCOFF Divider 2 DCCOFF Divider 1 DCCOFF Divider 0 DCCOFF
00 80 00
193 194 195
Divider 1 (PECL) Divider 1 Bypass
Divider 1 Low Cycles Divider 1 Nosync Blank Divider 1 Force High Divider 1 Start High Reserved
BB 00 00
196 197 198
Divider 2 (PECL) Divider 2 Bypass
Divider 2 Low Cycles Divider 2 Nosync Blank Divider 2 Force High Divider 2 Start High Reserved
00 00 00
LVDS/CMOS Channel Dividers 199 19A 19B 19C 19D 19E 19F 1A0 1A1 1A2 1A3 1A4 to 1DF VCO Divider and CLK Input 1E0 VCO Divider 1E1 Input CLKs Reserved Divider 4 (LVDS/CMOS) Divider 3 (LVDS/CMOS) Low Cycles Divider 3.1 Phase Offset Divider 3.2 Low Cycles Divider 3.2 Reserved Blank Low Cycles Divider 4.1 Phase Offset Divider 4.2 Low Cycles Divider 4.2 Bypass Divider 4.2 Blank Bypass Divider 3.2 22 00 11 00 00 22 00 11 00 00
High Cycles Divider 4.1 Phase Offset Divider 4.1 High Cycles Divider 4.2 Divider 4 Start High Force High Divider 4.2
Reserved
Bypass Divider 4.1
Divider 4 Nosync Reserved
Start High Divider 4.1 Divider 4 DCCOFF
Reserved Blank
Blank PowerDown Clock Input Section
Reserved Power-Down VCO Clock Interface PowerDown VCO and CLK
VCO Divider Select VCO or CLK Bypass VCO Divider
02 00
1E2 to 22A
Blank
Rev. 0 | Page 58 of 84
AD9516-0
Addr (Hex) Parameter System 230 Power Down and Sync Bit 7 (MSB) Default Value (Hex) 00
Bit 6
Bit 5 Reserved
Bit 4
Bit 3
Bit 2 PowerDown Sync
Bit 1 PowerDown Distribution Reference Reserved
Bit 0 (LSB) Soft Sync
231 Update All Registers 232 Update All Registers
Blank Blank
00 Update All Registers (SelfClearing Bit) 00
Rev. 0 | Page 59 of 84
AD9516-0 REGISTER MAP DESCRIPTIONS
Table 52 through Table 61 are a detailed description of each of the control register functions. The registers are listed by hexadecimal address. Reference to a specific bit or range of bits within a register is indicated by angle brackets. Example: <3> refers to Bit 3, while <5:2> refers to the range of bits from Bit 5 through Bit 2. Table 52. Serial Port Configuration
Reg. Addr (Hex) 00 Bit(s) <7> Name SDO Active Description Selects unidirectional or bidirectional data transfer mode. <7> = 0; SDIO pin used for write and read; SDO set high impedance; bidirectional mode. <7> = 1; SDO used for read; SDIO used for write; unidirectional mode. MSB or LSB data orientation. <6> = 0; data-oriented MSB first; addressing decrements. <6> = 1; data-oriented LSB first; addressing increments. Soft Reset. <5> = 1 (not self-clearing). Soft reset; restores default values to internal registers. Not self-clearing. Must be cleared to 0b to complete reset operation. Short/long instruction mode (this part uses long instruction mode only, so this bit should always be = 1). <4> = 0; 8-bit instruction (short). <4> = 1; 16-bit instruction (long). Bits<3:0> should always mirror<7:4> so that it does not matter whether the part is in MSB or LSB first mode (see Register 0x00<6>). User should set bits as follows: <0> = <7> <1> = <6> <2> = <5> <3> = <4> Select register bank used for a readback. <0> = 0; read back buffer registers. <0> = 1; read back active registers.
00
<6>
LSB First
00
<5>
Soft Reset
00
<4>
Long Instruction
00
<3:0>
Mirror<7:4>
04
<0>
Read Back Active Registers
Rev. 0 | Page 60 of 84
AD9516-0
Table 53. PLL
Reg. Addr (Hex) Bit(s) Name Description 10 <7> PFD Polarity Sets the PFD polarity. Negative polarity is for use (if needed) with external VCO/VCXO only. The on-chip VCO requires positive polarity <7> = 0. <7> = 0; positive (higher control voltage produces higher frequency). <7> = 1; negative (higher control voltage produces lower frequency). 10 <6:4> CP Current Charge pump current (with CPRSET = 5.1 k). <6> <5> <4> ICP (mA) 0 0 0 0.6 0 0 1 1.2 0 1 0 1.8 0 1 1 2.4 1 0 0 3.0 1 0 1 3.6 1 1 0 4.2 1 1 1 4.8 10 <3:2> CP Mode Charge pump operating mode. <3> <2> Charge Pump Mode 0 0 High impedance state. 0 1 Force source current (pump up). 1 0 Force sink current (pump down). 1 1 Normal operation. 10 <1:0> PLL Power- PLL operating mode. Down <1> <0> Mode 0 0 Normal operation. 0 1 Asynchronous power-down. 1 0 Normal operation. 1 1 Synchronous power-down. R divider LSBs--lower eight bits. 11 <7:0> 14-Bit R Divider Bits<7:0> (LSB) R divider MSBs--upper six bits. 12 <5:0> 14-Bit R Divider Bits<13:8> (MSB) A counter (part of N divider). 13 <5:0> 6-Bit A Counter B counter (part of N divider)--lower eight bits. 14 <7:0> 13-Bit B Counter Bits<7:0> (LSB) B counter (part of N divider)--upper five bits. 15 <4:0> 13-Bit B Counter Bits<12:8> (MSB) 16 <7> Set CP Pin Set the CP pin to one-half of the VCP supply voltage. to VCP/2 <7> = 0; CP normal operation. <7> = 1; CP pin set to VCP/2. 16 <6> Reset R Reset R counter (R divider). Counter <6> = 0; normal. <6> = 1; reset R counter. 16 <5> Reset A and B Reset A and B counters (part of N divider). Counters <5> = 0; normal. <5> = 1; reset A and B counters.
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AD9516-0
Reg. Addr (Hex) Bit(s) Name 16 <4> Reset All Counters 16 <3> B Counter Bypass Description Reset R, A, and B counters. <4> = 0; normal. <4> = 1; reset R, A, and B counters. B counter bypass. This is valid only when operating the prescaler in FD mode. <3> = 0; normal. <3> = 1; B counter is set to divide-by-1. This allows the prescaler setting to determine the divide for the N divider. Prescaler: DM = dual modulus and FD = fixed divide. <2> <1> <0> Mode Prescaler 0 0 0 FD Divide-by-1. 0 0 1 FD Divide-by-2. 0 1 0 DM Divide-by-2 and divide-by-3 when A 0; divide-by-2 when A = 0. 0 1 1 DM Divide-by-4 and divide-by-5 when A 0; divide-by-4 when A = 0. 1 0 0 DM Divide-by-8 and divide-by-9 when A 0; divide-by-8 when A = 0. 1 0 1 DM Divide-by-16 and divide-by-17 when A 0; divide-by-16 when A = 0. 1 1 0 DM Divide-by-32 and divide-by-33 when A 0; divide-by-32 when A = 0. 1 1 1 FD Divide-by-3. Select the signal which is connected to the STATUS pin Level or Dynamic <7> <6> <5> <4> <3> <2> Signal Signal at STATUS Pin 0 0 0 0 0 0 LVL Ground (DC). 0 0 0 0 0 1 DYN N divider output (after the delay). 0 0 0 0 1 0 DYN R divider output (after the delay). 0 0 0 0 1 1 DYN A divider output. 0 0 0 1 0 0 DYN Prescaler output. 0 0 0 1 0 1 DYN PFD up pulse. 0 0 0 1 1 0 DYN PFD down pulse. 0 X X X X X LVL Ground (dc); for all other cases of 0XXXXX not specified above. The selections below are same as REFMON 1 0 0 0 0 0 LVL Ground (dc). 1 0 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 1 0 0 0 1 0 DYN REF2 clock (N/A in differential mode). 1 0 0 0 1 1 DYN Selected reference to PLL (differential reference when in differential mode). 1 0 0 1 0 0 DYN Unselected reference to PLL (not available in differential mode). 1 0 0 1 0 1 LVL Status of selected reference (status of differential reference); active high. 1 0 0 1 1 0 LVL Status of unselected reference (not available in differential mode); active high. 1 0 0 1 1 1 LVL Status REF1 frequency (active high). 1 0 1 0 0 0 LVL Status REF2 frequency (active high). 1 0 1 0 0 1 LVL (Status REF1 frequency) AND (status REF2 frequency). 1 0 1 0 1 0 LVL (DLD) AND (status of selected reference) AND (status of VCO). 1 0 1 0 1 1 LVL Status of VCO frequency (active high). 1 0 1 1 0 0 LVL Selected reference (Low = REF1, High = REF2). 1 0 1 1 0 1 LVL Digital lock detect (DLD); active high. 1 0 1 1 1 0 LVL Holdover active (active high). 1 0 1 1 1 1 LVL LD pin comparator output (active high). 1 1 0 0 0 0 LVL VS (PLL supply).
16
<2:0> Prescaler P
17
<7:2> STATUS Pin Control
Rev. 0 | Page 62 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name Description Level or Dynamic <2> Signal 1 DYN 0 DYN 1 DYN 0 1 0 DYN LVL LVL
<7> 1 1 1 1 1 1
<6> 1 1 1 1 1 1
<5> 0 0 0 0 0 0
<4> 0 0 0 1 1 1
<3> 0 1 1 0 0 1
17
<1:0> Antibacklash Pulse Width
18
<6:5> Lock Detect Counter
18
<4>
Digital Lock Detect Window
18
<3>
18
Disable Digital Lock Detect <2:1> VCO Cal Divider
18
<0>
VCO Cal Now
1 1 0 1 1 1 LVL 1 1 1 0 0 0 LVL 1 1 1 0 0 1 LVL 1 1 1 0 1 0 LVL 1 1 1 0 1 1 LVL 1 1 1 1 0 0 LVL 1 1 1 1 0 1 LVL 1 1 1 1 1 0 LVL 1 1 1 1 1 1 LVL <1> <0> Antibacklash Pulse Width (ns) 0 0 2.9 0 1 1.3 1 0 6.0 1 1 2.9 Required consecutive number of PFD cycles with edges inside lock detect window before the DLD indicates a locked condition. <6> <5> PFD Cycles to Determine Lock 0 0 5 0 1 16 1 0 64 1 1 255 If the time difference of the rising edges at the inputs to the PFD are less than the lock detect window time, the digital lock detect flag is set. The flag remains set until the time difference is greater than the loss-of-lock threshold. <4> = 0; high range. <4> = 1; low range. Digital lock detect operation. <3> = 0; normal lock detect operation. <3> = 1; disable lock detect. VCO Calibration Divider. Divider used to generate the VCO calibration clock from the PLL reference clock. <2> <1> VCO Calibration Clock Divider 0 0 2 0 1 4 1 0 8 1 1 16 (default) Bit used to initiate the VCO calibration. This bit must be toggled from 0 to 1 in the active registers. The sequence to initiate a calibration is: program to a 0, followed by an update bit (Register 0x232<0>); then programmed to 1, followed by another update bit (Register 0x232<0>). This sequence gives complete control over when the VCO calibration occurs relative to the programming of other registers that can impact the calibration.
Signal at STATUS Pin REF1 clock (differential reference when in differential mode). REF2 clock (not available in differential mode). Selected reference to PLL (differential reference when in differential mode). Unselected reference to PLL (not available when in differential mode). Status of selected reference (status of differential reference); active low. Status of unselected reference (not available in differential mode); active low. Status of REF1 frequency (active low). Status of REF2 frequency (active low). (Status of REF1 frequency) AND (Status of REF2 frequency). (DLD) AND (Status of selected reference) AND (Status of VCO). Status of VCO Frequency (active low). Selected reference (Low = REF2, High = REF1). Digital lock detect (DLD) (active low). Holdover active (active low). LD pin comparator output (active low).
Rev. 0 | Page 63 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name 19 <7:6> R, A, B Counters SYNC Pin Reset 19 19 1A Description <7> <6> 0 0 0 1 1 0 1 1
1A
Action Do nothing on SYNC (default). Asynchronous reset. Synchronous reset. Do nothing on SYNC. <5:3> R Path Delay <5:3> R Path Delay (see Table 2). <2:0> N Path Delay <2:0> N Path Delay (see Table 2). <6> Reference Sets the reference (REF1/REF2) frequency monitor's detection threshold frequency. This does not affect Frequency the VCO frequency monitor's detection threshold (see Table 16, REF1, REF2, and VCO Frequency Status Monitor). Monitor <6> = 0; frequency valid if frequency is above the higher frequency threshold Threshold <6> = 1; frequency valid if frequency is above the lower frequency threshold <5:0> LD Pin Select the signal which is connected to the LD pin. Control Level or Dynamic <5> <4> <3> <2> <1> <0> Signal Signal at LD Pin 0 0 0 0 0 0 LVL Digital lock detect (high = lock, low = unlock). 0 0 0 0 0 1 DYN P-channel, open-drain lock detect (analog lock detect). 0 0 0 0 1 0 DYN N-channel, open-drain lock detect (analog lock detect). 0 0 0 0 1 1 HIZ High-Z LD pin. 0 0 0 1 0 0 CUR Current source lock detect (110 A when DLD is true). 0 X X X X X LVL Ground (dc); for all other cases of 0XXXXX not specified above. The selections that follow are the same as REFMON. 1 0 0 0 0 0 LVL Ground (dc). 1 0 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 1 0 0 0 1 0 DYN REF2 clock (N/A in differential mode). 1 0 0 0 1 1 DYN Selected reference to PLL (differential reference when in differential mode). 1 0 0 1 0 0 DYN Unselected reference to PLL (not available in differential mode). 1 0 0 1 0 1 LVL Status of selected reference (status of differential reference); active high. 1 0 0 1 1 0 LVL Status of unselected reference (not available in differential mode); active high. 1 0 0 1 1 1 LVL Status REF1 frequency (active high). 1 0 1 0 0 0 LVL Status REF2 frequency (active high). 1 0 1 0 0 1 LVL (Status REF1 frequency) AND (status REF2 frequency). 1 0 1 0 1 0 LVL (DLD) AND (status of selected reference) AND (status of VCO). 1 0 1 0 1 1 LVL Status of VCO frequency (active high). 1 0 1 1 0 0 LVL Selected reference (Low = REF1, High = REF2). 1 0 1 1 0 1 LVL Digital lock detect (DLD); active high. 1 0 1 1 1 0 LVL Holdover active (active high). 1 0 1 1 1 1 LVL N/A--do not use. 1 1 0 0 0 0 LVL VS (PLL supply). 1 1 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 1 1 0 0 1 0 DYN REF2 clock (not available in differential mode). 1 1 0 0 1 1 DYN Selected reference to PLL (differential reference when in differential mode). 1 1 0 1 0 0 DYN Unselected reference to PLL (not available when in differential mode). 1 1 0 1 0 1 LVL Status of selected reference (status of differential reference); active low.
Rev. 0 | Page 64 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name Description
1B
1B
1B
1B
Level or Dynamic <5> <4> <3> <2> <1> <0> Signal Signal at LD Pin 1 1 0 1 1 0 LVL Status of unselected reference (not available in differential mode); active low. 1 1 0 1 1 1 LVL Status of REF1 frequency (active low). 1 1 1 0 0 0 LVL Status of REF2 frequency (active low). 1 1 1 0 0 1 LVL (Status of REF1 frequency) AND (Status of REF2 frequency). 1 1 1 0 1 0 LVL (DLD) AND (Status of selected reference) AND (Status of VCO). 1 1 1 0 1 1 LVL Status of VCO frequency (active low). 1 1 1 1 0 0 LVL Selected reference (Low = REF2, High = REF1). 1 1 1 1 0 1 LVL Digital lock detect (DLD); active low. 1 1 1 1 1 0 LVL Holdover active (active low). 1 1 1 1 1 1 LVL N/A--do not use. <7> VCO Enable or disable VCO frequency monitor. Frequency <7> = 0; disable VCO frequency monitor. Monitor <7> = 1; enable VCO frequency monitor. <6> REF2 (REFIN) Enable or disable REF2 frequency monitor. Frequency <6> = 0; disable REF2 frequency monitor. Monitor <6> = 1; enable REF2 frequency monitor. <5> REF1 (REFIN) REF1 (REFIN) frequency monitor enable; this is for both REF1 (single-ended) and REFIN (differential) inputs Frequency (as selected by differential reference mode). Monitor <5> = 0; disable REF1 (REFIN) frequency monitor. <5> = 1; enable REF1 (REFIN) frequency monitor. <4:0> REFMON Pin Select the signal that is connected to the REFMON pin. Control Level or Dynamic <4> <3> <2> <1> <0> Signal Signal at REFMON pin 0 0 0 0 0 LVL Ground (dc). 0 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 0 0 0 1 0 DYN REF2 clock (N/A in differential mode). 0 0 0 1 1 DYN Selected reference to PLL (differential reference when in differential mode). 0 0 1 0 0 DYN Unselected reference to PLL (not available in differential mode). 0 0 1 0 1 LVL Status of selected reference (status of differential reference); active high. 0 0 1 1 0 LVL Status of unselected reference (not available in differential mode); active high. 0 0 1 1 1 LVL Status REF1 frequency (active high). 0 1 0 0 0 LVL Status REF2 frequency (active high). 0 1 0 0 1 LVL (Status REF1 frequency) AND (status REF2 frequency). 0 1 0 1 0 LVL (DLD) AND (status of selected reference) AND (status of VCO). 0 1 0 1 1 LVL Status of VCO frequency (active high). 0 1 1 0 0 LVL Selected reference (Low = REF1, High = REF2) 0 1 1 0 1 LVL Digital lock detect (DLD); active low. 0 1 1 1 0 LVL Holdover active (active high). 0 1 1 1 1 LVL LD pin comparator output (active high). 1 0 0 0 0 LVL VS (PLL supply). 1 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 1 0 0 1 0 DYN REF2 clock (not available in differential mode). 1 0 0 1 1 DYN Selected reference to PLL (differential reference when in differential mode).
Rev. 0 | Page 65 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name Description Level or Dynamic <0> Signal 0 DYN
1C
<7>
1C
<6>
1C
<5>
1C
<4>
1C
<3>
1C
<2>
1C
<1>
1C
<0>
1D
<4>
Signal at REFMON pin Unselected reference to PLL (not available when in differential mode). 1 0 1 0 1 LVL Status of selected reference (status of differential reference); active low. 1 0 1 1 0 LVL Status of unselected reference (not available in differential mode); active low. 1 0 1 1 1 LVL Status of REF1 frequency (active low). 1 1 0 0 0 LVL Status of REF2 frequency (active low). 1 1 0 0 1 LVL (Status of REF1 frequency) AND (Status of REF2 frequency). 1 1 0 1 0 LVL (DLD) AND (Status of selected reference) AND (Status of VCO). 1 1 0 1 1 LVL Status of VCO frequency (active low). 1 1 1 0 0 LVL Selected reference (Low = REF2, High = REF1). 1 1 1 0 1 LVL Digital lock detect (DLD); active low. 1 1 1 1 0 LVL Holdover active (active low). 1 1 1 1 1 LVL LD pin comparator output (active low). Disable Disable or enable the switchover deglitch circuit. Switchover <7> = 0; enable switchover deglitch circuit. Deglitch <7> = 1; disable switchover deglitch circuit. Select REF2 If Register 0x1C<5> = 0, select reference for PLL. <6> = 0; select REF1. <6> = 1; select REF2. Use REF_SEL If Register 0x1C<4> = 0 (manual), set method of PLL reference selection. Pin <5> = 0; use Register 0x1C<6>. <5> = 1; use REF_SEL pin. Automatic Automatic or manual reference switchover. Single-ended reference mode must be selected by Reference Register 0x1C<0> = 0. Switchover <4> = 0; manual reference switchover. <4> = 1; automatic reference switchover. Stay on REF2 Stay on REF2 after switchover. <3> = 0; return to REF1 automatically when REF1 status is good again. <3> = 1; stay on REF2 after switchover. Do not automatically return to REF1. REF2 When automatic reference switchover is disabled, this bit turns the REF2 power on. Power On <2> = 0; REF2 power off. <2> = 1; REF2 power on. REF1 When automatic reference switchover is disabled, this bit turns the REF1 power on. Power On <1> = 0; REF1 power off. <1> = 1; REF1 power on. Differential Selects the PLL reference mode, differential or single-ended. Single-ended must be selected for the Reference auto switchover or REF1 and REF2 to work. <0> = 0; single-ended reference mode. <0> = 1; differential reference mode. PLL Status Disables the PLL status register readback. Register <4> = 0; PLL status register enable. Disable <4> = 1; PLL status register disable.
<4> <3> <2> 1 0 1
<1> 0
Rev. 0 | Page 66 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name 1D <3> LD Pin Comparator Enable Description Enables the LD pin voltage comparator. This is used with the LD pin current source lock detect mode. When in the internal (automatic) holdover mode, this enables the use of the voltage on the LD pin to determine if the PLL was previously in a locked state (see Figure 51). Otherwise, this can be used with the REFMON and STATUS pins to monitor the voltage on this pin. <3> = 0; disable LD pin comparator; internal/automatic holdover controller treats this pin as true (high). <3> = 1; enable LD pin comparator. Along with <0> enables the holdover function. <2> = 0; holdover disabled. <2> = 1; holdover enabled. Enables the external hold control through the SYNC pin. (This disables the internal holdover mode.) <1> = 0; automatic holdover mode--holdover controlled by automatic holdover circuit. <1> = 1; external holdover mode--holdover controlled by SYNC pin. Along with <2> enables the holdover function. <0> = 0; holdover disabled. <0> = 1; holdover enabled. Readback register: status of the VCO calibration. <6> = 0; VCO calibration not finished. <6> = 1; VCO calibration finished. Readback register: indicates if the part is in the holdover state (see Figure 51). This is not the same as holdover enabled. <5> = 0; not in holdover. <5> = 1; holdover state active. Readback register: indicates which PLL reference is selected as the input to the PLL. <4> = 0; REF1 selected (or differential reference if in differential mode). <4> = 1; REF2 selected. Readback register: indicates if the VCO frequency is greater than the threshold (see Table 16, REF1, REF2, and VCO Frequency Status Monitor). <3> = 0; VCO frequency is less than the threshold. <3> = 1; VCO frequency is greater than the threshold. Readback register: indicates if the frequency of the signal at REF2 is greater than the threshold frequency set by Register 0x1A<6>. <2> = 0; REF2 frequency is less than threshold frequency. <2> = 1; REF2 frequency is greater than threshold frequency. Readback register: indicates if the frequency of the signal at REF2 is greater than the threshold frequency set by Register 0x1A<6>. <1> = 0; REF1 frequency is less than threshold frequency. <1> = 1; REF1 frequency is greater than threshold frequency. Readback register: digital lock detect. <0> = 0; PLL is not locked. <0> = 1; PLL is locked.
1D
<2>
Holdover Enable External Holdover Control Holdover Enable VCO Cal Finished Holdover Active
1D
<1>
1D
<0>
1F
<6>
1F
<5>
1F
<4>
REF2 Selected VCO Frequency > Threshold REF2 Frequency > Threshold REF1 Frequency > Threshold Digital Lock Detect
1F
<3>
1F
<2>
1F
<1>
1F
<0>
Rev. 0 | Page 67 of 84
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Table 54. Fine Delay Adjust: OUT6 to OUT9
Reg. Addr (Hex) Bit(s) Name A0 <0> OUT6 Delay Bypass A1 <5:3> OUT6 Ramp Capacitors
A1
<2:0> OUT6 Ramp Current
A2
<5:0> OUT6 Delay Fraction <0> OUT7 Delay Bypass
A3
A4
<5:3> OUT7 Ramp Capacitors
Description Bypass or use the delay function. <0> = 0; use delay function. <0> = 1; bypass delay function. Selects the number of ramp capacitors used by the delay function. The combination of number of the capacitors and the ramp current sets the delay full scale. <5> <4> <3> Number of Capacitors 0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1 Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale. <2> <1> <0> Current (A) 0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 Selects the fraction of the full-scale delay desired (6-bit binary). 000000 gives zero delay. Only delay values up to 47 decimal (101111b; 0x2F) are supported. Bypass or use the delay function. <0> = 0; use delay function. <0> = 1; bypass delay function. Selects the number of ramp capacitors used by the delay function. The combination of number of the capacitors and the ramp current sets the delay full scale. <5> <4> <3> Number of Capacitors 0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1
Rev. 0 | Page 68 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name A4 <2:0> OUT7 Ramp Current Description Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale. <2> <1> <0> Current (A) 0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 Selects the fraction of the full-scale delay desired (6-bit binary). 000000 give zero delay. Only delay values up to 47 decimal (101111b; 0x2F) are supported. Bypass or use the delay function. <0> = 0; use delay function. <0> = 1; bypass delay function. Selects the number of ramp capacitors used by the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale. <5> <4> <3> Number of Capacitors 0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1 Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale. <2> <1> <0> Current (A) 0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 Selects the fraction of the full-scale delay desired (6-bit binary). 000000 gives zero delay. Only delay values up to 47 decimal (101111b; 0x2F) are supported. Bypass or use the delay function. <0> = 0; use delay function. <0> = 1; bypass delay function.
A5
<5:0> OUT7 Delay Fraction <0> OUT8 Delay Bypass
A6
A7
<5:3> OUT8 Ramp Capacitors
A7
<2:0> OUT8 Ramp Current
A8
<5:0> OUT8 Delay Fraction <0> OUT9 Delay Bypass
A9
Rev. 0 | Page 69 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name AA <5:3> OUT9 Ramp Capacitors Description Selects the number of ramp capacitors used by the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale. <5> <4> <3> Number of Capacitors 0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1 Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale. <2> <1> <0> Current Value (A) 0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 Selects the fraction of the full-scale delay desired (6-bit binary). 000000 gives zero delay. Only delay values up to 47 decimal (101111b; 0x2F) are supported.
AA
<2:0> OUT9 Ramp Current
AB
<5:0> OUT9 Delay Fraction
Table 55. LVPECL Outputs
Reg. Addr (Hex) Bit(s) Name F0 <4> OUT0 Invert
F0
F0
F1
Description Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. <3:2> OUT0 LVPECL Sets the LVPECL output differential voltage (VOD). Differential <3> <2> VOD (mV) Voltage 0 0 400 0 1 600 1 0 780 1 1 960 <1:0> OUT0 LVPECL power-down modes. Power-Down <1> <0> Mode 0 0 Normal operation. 0 1 Partial power-down, reference on; use only if there are no external load resistors. 1 0 Partial power-down, reference on, safe LVPECL power-down. 1 1 Total power-down, reference off; use only if there are no external load resistors. <4> OUT1 Invert Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting.
Output On Off Off Off
Rev. 0 | Page 70 of 84
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Reg. Addr (Hex) Bit(s) Name F1 <3:2> OUT1 LVPECL Differential Voltage Description Sets the LVPECL output differential voltage (VOD). <3> <2> VOD (mV) 0 0 400 0 1 600 1 0 780 1 1 960 LVPECL power-down modes. <1> <0> Mode 0 0 Normal operation. 0 1 Partial power-down, reference on; use only if there are no external load resistors. 1 0 Partial power-down, reference on, safe LVPECL power-down. 1 1 Total power-down, reference off; use only if there are no external load resistors. Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. Sets the LVPECL output differential voltage (VOD). <3> <2> VOD (mV) 0 0 400 0 1 600 1 0 780 1 1 960 LVPECL Power-down modes. <1> <0> Mode 0 0 Normal operation. 0 1 Partial power-down, reference on; use only if there are no external load resistors. 1 0 Partial power-down, reference on, safe LVPECL power-down. 1 1 Total power-down, reference off; use only if there are no external load resistors. Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. Sets the LVPECL output differential voltage (VOD). <3> <2> VOD (mV) 0 0 400 0 1 600 1 0 780 1 1 960 LVPECL power-down modes. <1> <0> Mode 0 0 Normal operation. 0 1 Partial power-down, reference on; use only if there are no external load resistors. 1 0 Partial power-down, reference on, safe LVPECL power-down. 1 1 Total power-down, reference off; use only if there are no external load resistors. Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. Sets the LVPECL output differential voltage (VOD). <3> <2> VOD (mV) 0 0 400 0 1 600 1 0 780 1 1 960
Rev. 0 | Page 71 of 84
F1
<1:0> OUT1 Power-Down
Output On Off Off Off
F2
<4>
OUT2 Invert
F2
<3:2> OUT2 LVPECL Differential Voltage
F2
<1:0> OUT2 Power-Down
Output On Off Off Off
F3
<4>
OUT3 Invert
F3
<3:2> OUT3 LVPECL Differential Voltage
F3
<1:0> OUT3 Power-Down
Output On Off Off Off
F4
<4>
OUT4 Invert
F4
<3:2> OUT4 LVPECL Differential Voltage
AD9516-0
Reg. Addr (Hex) Bit(s) Name Description F4 <1:0> OUT4 LVPECL power-down modes. Power-Down <1> <0> Mode 0 0 Normal operation. 0 1 Partial power-down, reference on; use only if there are no external load resistors. 1 0 Partial power-down, reference on, safe LVPECL power-down. 1 1 Total power-down, reference off; use only if there are no external load resistors. F5 <4> OUT5 Invert Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. F5 <3:2> OUT5 LVPECL Sets the LVPECL output differential voltage (VOD). Differential <3> <2> VOD (mV) Voltage 0 0 400 0 1 600 1 0 780 1 1 960 F5 <1:0> OUT5 LVPECL power-down modes. Power-Down <1> <0> Mode 0 0 Normal operation. 0 1 Partial power-down, reference on; use only if there are no external load resistors. 1 0 Partial power-down, reference on, safe LVPECL power-down. 1 1 Total power-down, reference off; use only if there are no external load resistors.
Output On Off Off Off
Output On Off Off Off
Table 56. LVDS/CMOS Outputs
Reg. Addr (Hex) Bit(s) Name 140 <7:5> OUT6 Output Polarity
140
<4>
OUT6 CMOS B
140
<3>
OUT6 Select LVDS/CMOS
140
<2:1> OUT6 LVDS Output Current
Description In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity. <7> <6> <5> OUT6A (CMOS) OUT6B (CMOS) OUT6 (LVDS) 0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode. <4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output. Select LVDS or CMOS logic levels. <3> = 0; LVDS. <3> = 1; CMOS. Set output current level in LVDS mode. This has no effect in CMOS mode. <2> <1> Current (mA) Recommended Termination () 0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50
Rev. 0 | Page 72 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name 140 <0> OUT6 Power-Down Description Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off. In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity. <7> <6> <5> OUT7A (CMOS) OUT7B (CMOS) OUT7 (LVDS) 0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode. <4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output. Select LVDS or CMOS logic levels. <3> = 0; LVDS. <3> = 1; CMOS. Set output current level in LVDS mode. This has no effect in CMOS mode. <2> <1> Current (mA) Recommended Termination () 0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50 Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off. In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity. <7> <6> <5> OUT8A (CMOS) OUT8B (CMOS) OUT8 (LVDS) 0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode. <4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output. Select LVDS or CMOS logic levels. <3> = 0; LVDS. <3> = 1; CMOS. Set output current level in LVDS mode. This has no effect in CMOS mode. <2> <1> Current (mA) Recommended Termination () 0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50
Rev. 0 | Page 73 of 84
141
<7:5> OUT7 Output Polarity
141
<4>
OUT7 CMOS B
141
<3>
OUT7 Select LVDS/CMOS
141
<2:1> OUT7 LVDS Output Current
141
<0>
OUT7 Power-Down
142
<7:5> OUT8 Output Polarity
142
<4>
OUT8 CMOS B
142
<3>
OUT8 Select LVDS/CMOS
142
<2:1> OUT8 LVDS Output Current
AD9516-0
Reg. Addr (Hex) Bit(s) Name 142 <0> OUT8 Power-Down Description Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off. In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity. <7> <6> <5> OUT9A (CMOS) OUT9B (CMOS) OUT9 (LVDS) 0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode. <4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output. Select LVDS or CMOS logic levels. <3> = 0; LVDS. <3> = 1; CMOS. Set output current level in LVDS mode. This has no effect in CMOS mode. <2> <1> Current (mA) Recommended Termination () 0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50 Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off.
143
<7:5> OUT9 Output Polarity
143
<4>
OUT9 CMOS B
143
<3>
OUT9 Select LVDS/CMOS
143
<2:1> OUT9 LVDS Output Current
143
<0>
OUT9 Power-Down
Table 57. LVPECL Channel Dividers
Reg. Addr (Hex) Bit(s) Name 190 <7:4> Divider 0 Low Cycles 190 191 <3:0> Divider 0 High Cycles <7> Divider 0 Bypass
Description Number of clock cycles of the divider input during which divider output stays low. Number of clock cycles of the divider input during which divider output stays high. Bypass and power-down the divider; route input to divider output. <7> = 0; use divider. <7> = 1; bypass divider. Nosync. <6> = 0; obey chip-level SYNC signal. <6> = 1; ignore chip-level SYNC signal. Force divider output to high. This requires that nosync also be set. <5> = 0; divider output forced to low. <5> = 1; divider output forced to high. Selects clock output to start high or start low. <4> = 0; start low. <4> = 1; start high. Phase offset.
191
<6>
Divider 0 Nosync
191
<5>
Divider 0 Force High
191
<4>
Divider 0 Start High
191
<3:0> Divider 0 Phase Offset
Rev. 0 | Page 74 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name 192 <1> Divider 0 Direct to Output Description Connect OUT0 and OUT1 to Divider 0 or directly to VCO or CLK. <1> = 0: OUT0 and OUT1 are connected to Divider 0. <1> = 1: If 0x1E1<1:0> = 10b, the VCO is routed directly to OUT0 and OUT1. If 0x1E1<1:0> = 00b, the CLK is routed directly to OUT0 and OUT1. If 0x1E1<1:0> = 01b, there is no effect. Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction. Number of clock cycles of the divider input during which divider output stays low. Number of clock cycles of the divider input during which divider output stays high. Bypass and power-down the divider; route input to divider output. <7> = 0; use divider. <7> = 1; bypass divider. Nosync. <6> = 0; obey chip-level SYNC signal. <6> = 1; ignore chip-level SYNC signal. Force divider output to high. This requires that nosync also be set. <5> = 0; divider output forced to low. <5> = 1; divider output forced to high. Selects clock output to start high or start low. <4> = 0; start low. <4> = 1; start high. Phase offset. Connect OUT2 and OUT3 to Divider 1 or directly to VCO or CLK. <1> = 0; OUT2 and OUT3 are connected to Divider 1. <1> = 1: If 0x1E1<1:0> = 10b, the VCO is routed directly to OUT2 and OUT3. If 0x1E1<1:0> = 00b, the CLK is routed directly to OUT2 and OUT3. If 0x1E1<1:0> = 01b, there is no effect. Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction. Number of clock cycles of the divider input during which divider output stays low. Number of clock cycles of the divider input during which divider output stays high. Bypass and power-down the divider; route input to divider output. <7> = 0; use divider. <7> = 1; bypass divider. Nosync. <6> = 0; obey chip-level SYNC signal. <6> = 1; ignore chip-level SYNC signal. Force divider output to high. This requires that nosync also be set. <5> = 0; divider output forced to low. <5> = 1; divider output forced to high. Selects clock output to start high or start low. <4> = 0; start low. <4> = 1; start high. Phase offset.
192
<0>
Divider 0 DCCOFF
193 193 194
<7:4> Divider 1 Low Cycles <3:0> Divider 1 High Cycles <7> Divider 1 Bypass
194
<6>
Divider 1 Nosync
194
<5>
Divider 1 Force High
194
<4>
Divider 1 Start High
194 195
<3:0> Divider 1 Phase Offset <1> Divider 1 Direct to Output
195
<0>
Divider 1 DCCOFF
196 196 197
<7:4> Divider 2 Low Cycles <3:0> Divider 2 High Cycles <7> Divider 2 Bypass
197
<6>
Divider 2 Nosync
197
<5>
Divider 2 Force High
197
<4>
Divider 2 Start High
197
<3:0> Divider 2 Phase Offset
Rev. 0 | Page 75 of 84
AD9516-0
Reg. Addr (Hex) Bit(s) Name 198 <1> Divider 2 Direct to Output Description Connect OUT4 and OUT5 to Divider 2 or directly to VCO or CLK. <1> = 0; OUT4 and OUT5 are connected to Divider 2. <1> = 1: If 0x1E1<1:0> = 10b, the VCO is routed directly to OUT4 and OUT5. If 0x1E1<1:0> = 00b, the CLK is routed directly to OUT4 and OUT5. If 0x1E1<1:0> = 01b, there is no effect. Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction.
198
<0>
Divider 2 DCCOFF
Table 58. LVDS/CMOS Channel Dividers
Reg. Addr (Hex) Bit(s) Name 199 <7:4> Low Cycles Divider 3.1 199 19A 19A 19B 19B 19C <3:0> High Cycles Divider 3.1 <7:4> Phase Offset Divider 3.2 <3:0> Phase Offset Divider 3.1 <7:4> Low Cycles Divider 3.2 <3:0> High Cycles Divider 3.2 <5> Bypass Divider 3.2
Description Number of clock cycles of 3.1 divider input during which 3.1 output stays low. Number of clock cycles of 3.1 divider input during which 3.1 output stays high. Refer to LVDSCMOS channel divider function description. Refer to LVDSCMOS channel divider function description. Number of clock cycles of 3.2 divider input during which 3.2 output stays low. Number of clock cycles of 3.2 divider input during which 3.2 output stays high. Bypass (and power-down) 3.2 divider logic, route clock to 3.2 output. <5> = 0; do not bypass. <5> = 1; bypass. Bypass (and power-down) 3.1 divider logic, route clock to 3.1 output. <4> = 0; do not bypass. <4> = 1; bypass. Nosync. <3> = 0; obey chip-level SYNC signal. <3> = 1; ignore chip-level SYNC signal. Force Divider 3 output high. Requires that nosync also be set. <2> = 0; force low. <2> = 1; force high. Divider 3.2 start high/low. <1> = 0; start low. <1> = 1; start high. Divider 3.1 start high/low. <0> = 0; start low. <0> = 1; start high. Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction. Number of clock cycles of divider 4.1 input during which 4.1 output stays low. Number of clock cycles of 4.1 divider input during which 4.1 output stays high. Refer to LVDSCMOS channel divider function description. Refer to LVDSCMOS channel divider function description. Number of clock cycles of 4.2 divider input during which 4.2 output stays low. Number of clock cycles of 4.2 divider input during which 4.2 output stays high.
19C
<4>
Bypass Divider 3.1
19C
<3>
Divider 3 Nosync
19C
<2>
Divider 3 Force High
19C
<1>
Start High Divider 3.2
19C
<0>
Start High Divider 3.1
19D
<0>
Divider 3 DCCOFF
19E 19E 19F 19F 1A0 1A0
<7:4> Low Cycles Divider 4.1 <3:0> High Cycles Divider 4.1 <7:4> Phase Offset Divider 4.2 <3:0> Phase Offset Divider 4.1 <7:4> Low Cycles Divider 4.2 <3:0> High Cycles Divider 4.2
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AD9516-0
Reg. Addr (Hex) Bit(s) 1A1 <5> Name Bypass Divider 4.2 Description Bypass (and power-down) 4.2 divider logic, route clock to 4.2 output. <5> = 0; do not bypass. <5> = 1; bypass. Bypass (and power-down) 4.1 divider logic, route clock to 4.1 output. <4> = 0; do not bypass. <4> = 1; bypass. Nosync. <3> = 0; obey chip-level SYNC signal. <3> = 1; ignore chip-level SYNC signal. Force Divider 4 output high. Requires that nosync also be set. <2> = 0; force low. <2> = 1; force high. Divider 4.2 start high/low. <1> = 0; start low. <1> = 1; start high. Divider 4.1 start high/low. <0> = 0; s tart low. <0> = 1; start high. Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction.
1A1
<4>
Bypass Divider 4.1
1A1
<3>
Divider 4 Nosync
1A1
<2>
Divider 4 Force High
1A1
<1>
Start High Divider 4.2
1A1
<0>
Start High Divider 4.1
1A2
<0>
Divider 4 DCCOFF
Table 59. VCO Divider and CLK Input
Reg. Addr (Hex) Bit(s) Name 1E0 <2:0> VCO Divider
Description <2>
<1>
<0>
Divide
1E1
<4>
1E1
<3>
1E1
<2>
1E1
<1>
1E1
<0>
0 0 0 2 0 0 1 3 0 1 0 4 0 1 1 5 1 0 0 6 1 0 1 Output static 1 1 0 Output static 1 1 1 Output static Power-Down Clock Input Section Power down the clock input section (including CLK buffer, VCO divider, and CLK tree). <4> = 0; normal operation. <4> = 1; Power-down. Power-Down VCO Clock Interface Power down the interface block between VCO and clock distribution. <3> = 0; normal operation. <3> = 1; power-down. Power-Down VCO and CLK Power down both VCO and CLK input. <2> = 0; normal operation. <2> = 1; Power-down. Select VCO or CLK Select either the VCO or the CLK as the input to VCO divider. <1> = 0; Select external CLK as input to VCO divider. <1> = 1; Select VCO as input to VCO divider; cannot bypass VCO divider when this is selected. Bypass VCO Divider Bypass or use the VCO divider. <0> = 0; use VCO divider. <0> = 1; bypass VCO divider; cannot select VCO as input when this is selected.
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AD9516-0
Table 60. System
Reg. Addr (Hex) Bit(s) Name 230 <2> Power-Down Sync
230
<1>
Power-Down Distribution Reference
230
<0>
Soft SYNC
Description Power down the SYNC function. <2> = 0; normal operation of the SYNC function. <2> = 1; power-down sync circuitry. Power down the reference for distribution section. <1> = 0; normal operation of the reference for the distribution section. <1> = 1; power down the reference for the distribution section. The soft SYNC bit works the same as the SYNC pin, except that the polarity of this bit reversed. That is, a high level forces selected channels into a predetermined static state, and a 1-to-0 transition triggers a sync. <0> = 0; same as SYNC high. <0> = 1; same as SYNC low.
Table 61. Update All Registers
Reg. Addr (Hex) Bit(s) Name 232 <0> Update All Registers
Description This bit must be set to 1 to transfer the contents of the buffer registers into the active registers. This happens on the next SCLK rising edge. This bit is self-clearing; that is, it does not have to be set back to 0. <0> = 1 (self-clearing); update all active registers to the contents of the buffer registers.
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AD9516-0 APPLICATION NOTES
USING THE AD9516 OUTPUTS FOR ADC CLOCK APPLICATIONS
Any high speed, ADC is extremely sensitive to the quality of its sampling clock. An ADC can be thought of as a sampling mixer, and any noise, distortion, or timing jitter on the clock is combined with the desired signal at the analog-to-digital output. Clock integrity requirements scale with the analog input frequency and resolution, with higher analog input frequency applications at 14-bit resolution being the most stringent. The theoretical SNR of an ADC is limited by the ADC resolution and the jitter on the sampling clock. Considering an ideal ADC of infinite resolution where the step size and quantization error can be ignored, the available SNR can be expressed approximately by
LVPECL CLOCK DISTRIBUTION
The LVPECL outputs of the AD9516 provide the lowest jitter clock signals available from the AD9516. The LVPECL outputs (because they are open emitter) require a dc termination to bias the output transistors. The simplified equivalent circuit in Figure 57 shows the LVPECL output stage. In most applications, an LVPECL far-end Thevenin termination is recommended, as shown in Figure 69. The resistor network is designed to match the transmission line impedance (50 ) and the switching threshold (VS - 1.3 V).
VS_LVPECL VS_LVPECL 50 SINGLE-ENDED (NOT COUPLED) 50
06419-045
127
127
VS
1 SNR(dB) = 20 x log 2f t AJ

LVPECL
LVPECL
where: fA is the highest analog frequency being digitized. tJ is the rms jitter on the sampling clock. Figure 68 shows the required sampling clock jitter as a function of the analog frequency and effective number of bits (ENOB).
110 100 90 80 1 SNR = 20log 2f t AJ 18
VT = VS - 1.3V
83
83
Figure 69. LVPECL Far-End Thevenin Termination
VS_LVPECL 0.1nF 100 DIFFERENTIAL 100 (COUPLED) 0.1nF TRANSMISSION LINE 200 VS_LVPECL
LVPECL
LVPECL
16
SNR (dB)
tJ = 100 fS 200 fS
400 f 1ps 2ps
S
14 12 10 8 6
06419-044
Figure 70. LVPECL with Parallel Transmission Line
ENOB
70 60 50 40 30 10
LVDS CLOCK DISTRIBUTION
The AD9516 provides four clock outputs (OUT6 to OUT9) that are selectable as either CMOS or LVDS level outputs. LVDS is a differential output option that uses a current mode output stage. The nominal current is 3.5 mA, which yields 350 mV output swing across a 100 resistor. The LVDS output meets or exceeds all ANSI/TIA/EIA-644 specifications. A recommended termination circuit for the LVDS outputs is shown in Figure 71.
VS VS
10p s
100
1k
fA (MHz)
Figure 68. SNR and ENOB vs. Analog Input Frequency
See AN-756 and AN-501 application notes at www.analog.com. Many high performance ADCs feature differential clock inputs to simplify the task of providing the required low jitter clock on a noisy PCB. (Distributing a single-ended clock on a noisy PCB can result in coupled noise on the sample clock. Differential distribution has inherent common-mode rejection that can provide superior clock performance in a noisy environment.) The AD9516 features both LVPECL and LVDS outputs that provide differential clock outputs, which enable clock solutions that maximize converter SNR performance. The input requirements of the ADC (differential or single-ended, logic level, termination) should be considered when selecting the best clocking/converter solution.
LVDS
100 100 DIFFERENTIAL (COUPLED)
LVDS
06419-047
Figure 71. LVDS Output Termination
See AN-586 application note at www.analog.com for more information on LVDS.
Rev. 0 | Page 79 of 84
06419-046
200
AD9516-0
CMOS CLOCK DISTRIBUTION
The AD9516 provides four clock outputs (OUT6 to OUT9) that are selectable as either CMOS or LVDS level outputs. When selected as CMOS, each output becomes a pair of CMOS outputs, each of which can be individually turned on or off and set as noninverting or inverting. These outputs are 3.3 V CMOS compatible. Whenever single-ended CMOS clocking is used, some of the following general guidelines should be used. Point-to-point nets should be designed such that a driver has only one receiver on the net, if possible. This allows for simple termination schemes and minimizes ringing due to possible mismatched impedances on the net. Series termination at the source is generally required to provide transmission line matching and/or to reduce current transients at the driver. The value of the resistor is dependent on the board design and timing requirements (typically 10 to 100 is used). CMOS outputs are also limited in terms of the capacitive load or trace length that they can drive. Typically, trace lengths less than 3 inches are recommended to preserve signal rise/fall times and preserve signal integrity.
06419-076
Termination at the far-end of the PCB trace is a second option. The CMOS outputs of the AD9516 do not supply enough current to provide a full voltage swing with a low impedance resistive, far-end termination, as shown in Figure 73. The farend termination network should match the PCB trace impedance and provide the desired switching point. The reduced signal swing may still meet receiver input requirements in some applications. This can be useful when driving long trace lengths on less critical nets.
VS 50 100 CMOS 100
06419-077
CMOS
10
Figure 73. CMOS Output with Far-End Termination
Because of the limitations of single-ended CMOS clocking, consider using differential outputs when driving high speed signals over long traces. The AD9516 offers both LVPECL and LVDS outputs that are better suited for driving long traces where the inherent noise immunity of differential signaling provides superior performance for clocking converters.
CMOS
10
60.4 (1.0 INCH) CMOS MICROSTRIP
Figure 72. Series Termination of CMOS Output
Rev. 0 | Page 80 of 84
AD9516-0 OUTLINE DIMENSIONS
9.00 BSC SQ 0.60 MAX 0.60 MAX
49 48
0.30 0.25 0.18
64 1
PIN 1 INDICATOR
PIN 1 INDICATOR
TOP VIEW
8.75 BSC SQ
EXPOSED PAD
(BOTTOM VIEW)
6.35 6.20 SQ 6.05
0.50 0.40 0.30
33 32
17 16
1.00 0.85 0.80
12 MAX
0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 0.50 BSC 0.20 REF
7.50 REF
SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
Figure 74. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 9 mm x 9 mm Body, Very Thin Quad CP-64-4 Dimensions shown in millimeters
ORDERING GUIDE
Model AD9516-0BCPZ 1 AD9516-0BCPZ-REEL71 AD9516-0/PCBZ1
1
Temperature Range -40C to +85C -40C to +85C
Package Description 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) Evaluation Board
063006-B
Package Option CP-64-4 CP-64-4
Z = RoHS Compliant Part.
Rev. 0 | Page 81 of 84
AD9516-0 NOTES
Rev. 0 | Page 82 of 84
AD9516-0 NOTES
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AD9516-0 NOTES
(c)2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06419-0-4/07(0)
Rev. 0 | Page 84 of 84

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