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PREPARED BY: Ln ti eds APPROVED BY: ` 7 IAh 37 KLA3-E
DATE: /dJfS DATE: QtV'1, ELECTRON-X COMPONENTS GROUP SHARP CORPORATION
1 SPECNo. ISSUE PAGE REPRESENTATIVE Opto-Electronic
Do996034 Jun/16/99
10 pages
DIVISION: Devices Division
SPECIFICATION
DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
I
GL5ZV43
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharps consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers I r If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Gas leakage sensor breakers * Traffic signals * Rescue and security equipment I C * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment I * Nuclear power control equipment (4) Please contact and consult witha Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY: J-i4x-4~/ f?ry
1
CUSTOMER'S APPROVAL
DATE: BY:
72Lazz , M.Katoh, Department General Manager of Engineering Dept.,IlI Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION
DG996034 MODEL No. GL5ZV43
Jlln/16/%
PAGE
l/10
GL52Y43
Snecification
1. Application This specificationappliesto the light emitting diode&vice Model No. GL5ZV43. [AlGaInP (dicing or scribe/brake type) Amber LED device]
2. Outline dimensions pin connections. . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage2. and
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3-l. Absolute maximumratings 3-2. Eleciro-optical characteristics 3-3. Derating Curve 3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4- 1. Test itemsand testconditions 4-2. Measurement itemsandFailurejudgement criteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6. 5- 1. Applied standard 5-2. Samplingmethodandlevel 5-3. Test items,judgementcriteria and classificaof defect 5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclassifxa of defect
6. Supplement.,...,................................*.............., 6- 1. Packing 6-2. Luminousintensity rank 6-3. Dominant wavelengthrank 6-4. Environment
Refer to the attachedsheetPage7-8.
7*lrecau~onsforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10. 7-1. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions 74. For cleaning
DC2996034
MODELNo.
Jun/16i!W PAGE I 2/10
I
GL5ZV43
2 outline dimensions and pin
co~ections
Colorless transparency
.
Pin coMectiona 0. Lode 0. cathode
unspec*ed to1. to be +0.2Mll Cold rblkd steel. leadsareplated with but unit mm Material Lead : (Fe) Cold rolled steel Package: Epoxy resin Finish Lead : Sn platedor wave soldering ' this part of the product Drawing No. 51106015
DG996034 MODEL No. GL5ZV43
I Jun/l6/!39
1PAGE
3110
I
3. Ratingsandcharacteristics 3- 1. Absolutemaximumratings
I Symbol P
IF
Parameter Power dissipation Continuousforward current Peakforward current(Note 1) Derating factor/ DC !
IFhi !
Value 130 50 100
0.67
(Ta=25"C) Unit mW
mA
mA !mApcl
Pulse
I
I
Reversevoltage Vll Operating temperature Topr -40 85 Storagetemperature Tstg -40 100 Solderingtemperature(Note 2) Tsol 260(within5seconds) (Note 1) Duty ratio=l/lO,Pulse width=O.lms (Note 2) At the positionof 1.6mmfrom the bottom resinpackage
1.33 5 -
T OC "C
Terminal capacitance Ct V=OV,f=lMHz 60 Viewing Angle 281/2 lF=2omA 8 (Note 3) Refer to the suplement item 6. regardingthe standard rank classifidation. of
-
pF deg.
I
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 a .5 100 Z 2 2 2 80 60
60
3 !A -
50 40 30 20 10 0
-25
0 Ambient
25
50
75 OJIOO Ta("CI
125
-25
0 Ambient
25
50
7585100
Ta("C)
125
Temperature
Temperature
DG996034 MODEL No.
Jun/16/99 PAGE
4/10
I
Peak Forward Current vs. Duty Ratio cTa=250C1
GL5ZV43
10
I I I/Ii//IIII/I/j/l iIlll[ I I
l/100 l/10 Duty Raito 1 DR 10
3-4. Characteristics
Forward
Diagram(m)
Current
(Note 1)
vs.Forward Voltage (Ta=25%) 1oDo $ .E ; 2
Oh
Relative Luminous Intensity vs. Ambient Temperature (IF=2OmA)
100
.f E 5 A z .CI m 2 ot 1 1.2 1.4 Forward 1.6 1.6 Voltage 2 2.2 VF(V) 2.4 2.6
0. 1
10 -60-40-20 Ambient 0 20 40 Temprature 60 80 Ta("C) 100120
Relative
Luminous
Intensity
vs.
Frorard
Voltage
'a=25'C)
0.01
1
I
I
l(l!/l/
I
I
lllllli
I
I
l!illjJ
0. 1 Forward
1 Current
10 IFhA)
100
(Note 1) Above characteristic data are typical data and
not a
guarantteed data.
DG996034
MODEL No.
Jud16/99
PAGE
I
GL5ZV43
s/10
4. Reliability The reliability of productsshahbe satisfiedwith itemslisted below. 4-l. Test itemsandtestconditions Test items Solderability Soldering temperature Mechanicalshock Test conditions 230*5C, 5s Prior disposition: Dip in rosin flux 26Oir5"c. 5s 15 00&1/s*, 05ms, 3times/ 3XkY,kZ direction Confidencelevel: 90% Samples (n) LTPD Defective (C) (%) n=ll, C=O n=ll, C=O n=ll, C=O n=ll, C=O n=ll, C=O 20 20 20 20
Variable frequency 2OOm/s*, to 2 Oooto lOOHz/sweep 4min. 100 for vibration .4timesiH~Y,EZ direction Terminal strength Weight:lUN , 3 - ^-- -s/each terminal (Tension) I ---f 0O-t -90' -0" Terminal strength WeightzSN.0" -90" (Bendma /each terminal Temperaturecycling High temp*andhigh humidity storage -4O"c(30mirt)~+l~C(3~in).30 I Ta=+60"C, 9O%RH, t=lOOOh cycles
I
I
I n=ll, C=O I
I
n=22, C=O .I n=22, C=O n=22, C=O n=22, C=O n=22, C=O
10 10 10 10 10
I
H:ightemperature storage Ta=lOO"c, t=lOOOh L ow temperature storageTa=-40"C, t=lOOOh Operationlife Ta=25"C, IrMAX, t=lOOOh*3
4-2. Measurement itemsandFailure judgementcriteria * 1 Measurement Forward voltage Reversecurrent Luminousintensity Splbd VF IR Iv Failurejudgementcriteria *2 v, > U.S.L. x 1.2 Ia > U.S.L. x 2.0 Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv
z Solderability : Soldershall be adhereat the areaof 95% or moreof dippedportion. s Terminal strength: Packageis not destroyed,and terminal is not slack. *l: Measuring conditionis in accordance with specification. *2: U.S.L. is shownby Upper Specification Limit. *3: I, MAX.is shownby forward current of absolutemaximumratings.
DG996034
MODEL No.
JuId16/99
PAGE 6/10
I
GL5ZV43
5. Incominginspection 5- 1. Applied standard IS0 2859-1 : 5-2. Samplingmethodand level : A single samplingplan,.nonnal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4%
- -. Test items. iudeement ___---____-__. _- criteria and classifica - of defect __ ----------- --- ---- -- -_--_ No. Testitems judgementcriteria
5-3.
classifica of defer
1 2 3 4 5 6 7 8 9 10 11 12 13
Disconnection Positionof Cutting off rim Reverse terminal Outline dimensions characteristics Cut off the rim Foreignsubstance Scratch Void Unevendensityof materialfor scattering Unbalanced center Burr Insertionpositionof terminal
Exceed
Not emit light Different from dimension Different from dimension Not satisfy outlinespecification Over the limit value of specification V,, I,, andIv at Exceed-0.2mm White point : Exceed @ 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String form : Exceed 3.Omm(on top view) Exceed 4 0.3mm or O.lmm x I.Omm(on top view) Exceed 4 0.3mm (on top view) Extremely unevendensity M.25mm from package center Minor defect Major defect
Exceed +0.2mm againstprovided dimension
Insertion positionof terminal
5-4. Test itemsthe surfaceis be applied for flat type, judgement criteria andclassificaof defect No. 14
15
Test items Chapped surface the Hollow the surface
judgementcriteria The surfacechappedis striking for seethe lamp top The surface hollow is striking for seethe lamp top
classifica of defer Minor defect
DG996034
MODEL No.
1 Jun/16/99
1 PAGE
I
GLSZV43
1
7110
6. Supplement 6-1. Packing 6- 1- 1. Inner package Put 25Opcs sameluminousintensity rank productsinto pack andput following label by pack. the Productweight : 0.28g (One Product,Typ.) (Indicationlabel sample) SHIPENT TABLE PART No. GLSZV43 + Model number *clEl clclclclcl CJlJAhT1l-Y 250 - Quantity of products ---LOT No. KA99B19 tLotnumber* 0 0 CD@ 0 u-u+Luminousintensity rank dominantwavelengthrank SHARP\ WE IN JAPAN - Production country
1
0 @ @ @ @
Productionplant code(to be indicated alphabetically) Supportcode Year of production(thelast two figures of the year) Month of production (to be indicatedalphabetically with Januarycorrespondingto A) Date of production(Ol-31)
6-l-2. Outer package Put 8 packs (the sameluminousintensity rank) into outerpackage. (approximately670g per one outer package) 6-l-3. Outer package line dimension out Width : 14Omm.Depth : 225mm, Hight : 9Omm
(Note 1) Tolerance:flS% ln regardto luminousintensity , the following rankingshallbe carriedout. However the quantity of eachrank shallnot bepre scribed. In caseof the distribution of the luminousintensity shift to high, at that point new upper rank is prescribedandlower rank isdelete. 6-3.Dominantwavelengthrank (Note 2) Rank Dominant wavelength (Ta=25"C) Condition
Unit
H
581.0
-
584.5
(Note 2) The condition of measurement The measurement the light em&on from the front sideof lamp. : of This rank value is the setting value of whenthat classifies the rank and be not a guaranteevalue. it Also I shall not ask the delivery ratio of eachrank.
DG996034
MODEL No.
JIud16/99
PAGE
GL5ZV43
8110
6-4. Environment 641. Ozonosphere destructive chemicals. (1) The &vice doesn't contain following substance. (2) The &vice doesn't have a production line whose process requires following substance. Restricted part: CFCs,halones,CC&,Trichloroetbane(Methychloroform) 642. Bromic non-burning materiah The &vice doesn't contain bromic non-burning materials(PBBOs,PBBs)
IX996034
MODEL No.
I Jun/16/!w
1PAGE 9110
I
7. Precautions use for
GL5ZV43
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be forned before soldering 7 - 2. Notice of installation 7-2-l installation on a P WB Whenmounting an LED lamp on a PVB,do not apply physical stress to the lead pins. The lead pin pitch should match the PWBpin-hole pitch:absolutely avoid widening or narrowing the lead pins. Whenpositioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 Whenan LED 1 is mounted directly on a P W B If the bottom face of an LED lamp is mounted directly on single-sided PWB,the base of the lead pins may be subjected to physical stress due to PTBwarp, cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc., is found. when an LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the Pm. 7-2-3 Installation using a holder During an LEDlamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat.mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure-A hole of the case should be designed not to subject the inside of resin to any undue stress.
l l
NG
L
Aih
0 I I.611
DC996034 MODEL No. GL5ZV43
Jun/16/!B PAGE lo/lo
7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of S oldering 295Tk5T, within 3 seconds 1. Manual soldering 2603cr5"C. within 5 seconds 2. Wave soldering P reheating 70C to 8O"c, within 30 seconds 3. Auto soldering Soldering 245"ci:5"c, within 5 seconds (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated. For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur.
7-4 (1) (2)
For cleaning Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less Ultrasonic cleaning : The effect to device by-ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time. PIB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. Applicable solvent : Ethyl alcohoLMethyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.
(3)

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