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PREPARED
BY: xm
DATE: /I6 /sq DATE: 1 /t/ PS /
SPEC.No. w ELECTRO~C coh4PONENTS GROUP . SHARP CORPORATION ISSUE PAGE REPRESENTATIVE
DG99f5040 J&16/99 10 Pages DIVISION:
7-a Usda APPROVED BY: Ji"! FKL.,+
SPECIFICATION
DEVICE SPECIFICATION FOR
Opto-Electronic Devices Division
Light Emitting Diode
MODEL No.
GL5ZV44
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment I L * Tooling machines * Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment 1 L * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * AMedical equipment C * Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED c2-L.i BY: //8/
1
099
CUSTOMER'S `DATE: BY:
APPROVAL
c%..mJ M.Katoh, Department General Manager of Engineering DeptJII Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION
DG996040 MODEL No. GL5ZV44
Jun/16/99 PAGE l/10
GL5ZV44
Snecification
1. Application `l"h.k spxi.fication applies to the light emitting dicde &vice Model No. GL5ZV44. [AlGahP (dicing or scribe/brake type) Amber LED device]
2. Outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4. 3-l. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram
4. Reliability .,..................................................... 4-l. Test items and test conditions 4-2. Measurement items and Failure judgement criteria
Refer to the attached sheet Page 5.
5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classifica of defect 5-4. Test items the surface is be applied for flat type, judgement criteria and classifxa of defect
6. Supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Refer to the attached sheet Page 7-8. 6-l. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelength rank 6-4. Environment
7 ~ecau~onsforuse.............`...............'.............'... 7-1. Lead forming method 7-2. Notice of installation 7-3. Soldering Conditions .7-4. For cleaning
Refer to the attached sheet Page 9- 10.
DG996040
MODEL No.
Jun/l6/W
PAGE 310
I
GLSZV44
`d $1 ln 0' I 9.
kA.bte) Unspecified tol. to be *O&KU
Pin connectioIls Q. Anode 0. cathode
(Note) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mal
Matelial
Lead : (Fe) Cold rolled steel Package : Epoxy resin
Finish Lead : Sn plated or wave soldering
Drawing 51106021
No.
J?G996040 GL5ZV44
I Jun/16/99
1 PAGE
I
3/10
3. Ratings and characteristics
(Note 1) Duty ratio=1/1O,Pulse width=&lms (Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 3 h g z 2 2 g b : ?Y Lz 20 01 -25 ' 0 Ambient ' 25 I 50 75 85100 Ta("CI I 125 Ambient Temperature TarC) 100 80 60 40
Temperature
DG996040 MODEL No.
JunA6/99
PAGE 1 4110
I
Peak Forward Current vs. Duty Ratio (Ta=25"C)
GL5ZV44
l/l00
l/10 Duty Raito
1 DR
10
3-4. Characteristics
Forward
Diagram(m)
Current
(Note 1)
vs.Forward Voltage (Ta=25"C) Relative Luminous Intensity vs. Ambient Temperature
( I F=2Orn4)
1 1.2
1.4 Forward
1.6
1.8 Voltage
2
2.2 VFW
2.4
2.6
-60 -40 -20
Ambient
0 20 40 60 80
Temprature Ta("C)_
100 120
Relative
Luminous
Intensity
vs.
Froward
Voltage
CTa=25"C)
1000
.$ .I 2 ii
Oh
100
10
.E B 9 .J e .z B
1
0. 1
.-
0.01 0. 1 Forward 1 Current 10 IFhA) loo
(Note 1) Above characteristic data are typical data and not a guarantteed data.
DG996040 MODEL No.
JunJ16/!w
PAGE
I
GL5ZV44
5110
4. Reliability The reliability of products shall be satisfied with items listed below. 4-1. Test items and test conditions Test items Solderability Soldering temperature Mechanical shock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bend&9 Temperature cycling II&h temp' and high humidity storage Test conditions 230f5"C, 5s Prior disposition : Dip in rosin flux 26O+sC, 5s Confidence level: 90% Samples (n) LTPD Defective (C) (%I n=ll, n=ll, n=ll, n=lI, n=ll, n=ll, C=O C=O C=O C=O C=O c=O I 20 20 20 20 20 20 10 10 10 10 10
15 OOOm/s*,0.5ms, 3times 1 kX+Y Sz direction 2OOm/s*, 100 to 2 000 to lOOHz./sweep for 4min. ,&imesk.X,~Y,fZ direction Weight:lON, Ss/each terminal
Weight:SN,O" + 90" + 0% -90" + 0" /each terminal -40@C(3Omin)~+100"C(3Omin),30 Ta=+60"C, 9O%RH, t=looOh cycles
I I
I
n=22, C=O n=22, C=O n=22, C==O
I Iigh temperature storage Ta=lOO"c, t=lOOOh LAW temperature storage ITa=-40"C, t=lOOOh Operation life ITa=25"C, IF MAX, t=lOOOh *3
n=22, C=O I n=22, C==O I
41-2. Measurement items and Failure judgement criteria * 1 Measurement Forward voltage Reverse current Luminous intensity ! % Solderability : Solder shall be adhere at the area of 95% or more of dipped portion. Z Terminal strength : Package is not destroyed, and terminal is not slack * 1: Measuring condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. *3: IF MAX.is shown by forward current of absolute maximum ratings. Symbol VF
IR
Failure judgement criteria *2 v, > U.S.L. x 1.2 Ia > U.S.L. x 2.0 Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
Iv
DGW6040
MODELNo.
GL5ZV44
Junl16l99 PAGE 6/10
5. Incoming inspection 5-l. Applied standard : IS0 2859-l 5-2. Sampling method and level : A single sampling plan,normal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items, judgement criteria and classifica of defect 1 No.
q
Test items
DiscoMection
judgement criteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specification at Vr, I,, and Iv Exceed -0.2mm White point : Exceed d 0.3mm (on top view) Black point : Exceed $0.3mm (on top view) String form : Exceed 3.Omm (on top view) Exceed d 0.3mm or O.lmm x l.Omm (on top view) Exceed 4 0.3mm (on top view) Extremely uneven density Exceed fo.25mm from package center Exceed +0.2mm againstprovided dimension
Insertion position of terminal
:lassifica of defec
1 2
3 4
Position of Cutting off rim Reverse terminal Outline dimensions Characteristics Cut off the rim Foreign substance Scratch Void
mated
Major defect
Minor defect
Uneven density of for scattering
11 12 13
Unbalanced center Burr Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. 14 15 Test items Chapped the surface Hollow the surface judgement criteria The surface chapped is striking for see the lamp top The surface hollow is striking for see the lamp top classifica of defect Minor defect
L
MODEL No. GL5ZV44
PAGE 7110
6. Supplement 6-1. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One ProducfTyp.) (Indication label sample) SHIPHENT TABLE PART No. GL5ZV44 - Model number *cl Cl --- ocln[7 q QUANTITY 250 - Quantity of products LOT No. KA99B19 +Lotnumber* 0 O@ 0 a O-O c-Luminous intensity rank dominant wavelength rank SHARP' MADE IN JAPAN + Production country 0 @ @ @ 0 Production plant code(to be indicated alphabetically) Support code Year of production(the last two figures of the year) (to be indicated alphabetically with January corresponding to A) Month of production Date of production(01 N 3 1)
6-l-2. Outer package Put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width: 14Omm, Depth: 225n~n, l-light: 6-2.Luminous intensity rank (Note 1) I Rank I 9omm (T.a=25"c)
(Note 1) Tolerance:flS% In regard to Iurninous intensity , the following ranking shall be carried out. However the quantity of each rank shall not be pre scribed. Encase of the distribution of the Iuminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. (Ta=25@C) 6-3.Dominant wavelength rank (Note 2) Dominant wavelength 1 Unit 1 Condition 1 Rank I I H 581.0 584.5 ; 583.5 587.0 I I- -- . 1~2urIlA Ml 586.0 589.5 J 592.0 K 588.5 L 591.0 594.5 \ (Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp. This rank value is the setting value of when that classifies it the rank and be not a guarantee value. Also I shall not ask the delivery ratio of each rank.
Do996040
MODEL. No.
Junl16l99
PAGE
GLSZV44
8110
6-4. Environment 64 1. Ozonosphere destructive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requires following substance. Restricted part: c2FCsJlalones,CCt,Trichloroethane(Methyc~~fo~) 642. Bromic non-burning materials The &vice doesn't contain bromic non-burning materials(PBBOs,.PBBs)
DB96040
MODEL No.
Jun/16/99
PAGE
GLSZV44
g/10
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B When mounting an LED lamp on a PWB,donot apply physical stress to the lead pins. *The lead pin pitch should match the PWEI pin-hole pitch:absolutely avoid widening or narrowing the lead pins. lhen positioning an LED lamp,basically employ an LED with tie-bar cut or use a spacer. 7-2-2 When an LED 1 is mounted directly on a P WB If the bottom face of an LED lamp is mounted directly on single-sided PWB,the base of the lead pins may be subjected to physical stress due to PWBwarp,cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc,,is found-When an LED lamp is mounted on a double-sided PWB,the heat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the PWB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used.a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.d hole of the case should be designed not to subject the inside of resin to any undue stress.
l
NG
Good
I
0 n
1
L 611
~
Jx996040
MODEL No.
Juld16/9!I
PAGE
I
GL5ZV44
I
lo/lo
7 - 3. S oldering Conditions Solder thi lead pins under the following conditions _~ --.e 1 Type of Soldering ! __--- -A- Conditions . .. l.Manual soldering 1 295T*5C, wlthin 3 seconds 2. Wave soldering 1 260C+YC. mm"within 5 seconds . Preheating `fU"C tc) 8O'C, within 30 seconds 3. Auto soldering Soldering 245"ct5"c, within 5 seconds I (Note> Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated-For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur.
ins iron
7 - 4. For cleaning (1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less cleaning The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time,PlRB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. Ethyl alcohol, Yethyl alcohol, Isopropyl alcohol
( 2 > Ultrasonic
( 3 > Applicable
solvent
In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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