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HSDL-3610 #007/#008
IrDA(R) Data Compliant 115.2 kb/s 3 V to 5 V Infrared Transceiver
Data Sheet
Description The HSDL-3610 is a low-profile infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Data Physical Layer Specifications 1.0 and IEC825-Class 1 Eye Safe. The HSDL-3610 contains a high-speed and highefficiency 870 nm LED, a silicon PIN diode, and an integrated circuit. The IC contains an LED driver and a receiver providing a single output (RXD) for all data rates supported. Features * Fully compliant to IrDA 1.0 physical layer specifications - 9.6 kb/s to 115.2 kb/s operation * Typical link distance > 1.5 m * Compatible with HP-SIR and TV remote * IEC825-Class 1 eye safe * Low power operation range - 2.7 V to 5.25 V * Small module size - 4.0 x 12.2 x 5.1 mm (HxWxD) * Complete shutdown - TXD, RXD, PIN diode * Low shutdown current - 10 nA typical * Adjustable optical power management - Adjustable LED drive-current to maintain link integrity * Integrated EMI shield - Excellent noise immunity * Edge detection input - Prevents the LED from long turn-on time * Interface to various super I/O and controller devices * Designed to accommodate light loss with cosmetic window * Only 2 external components are required Applications * Digital imaging - Digital still cameras - Photo-imaging printers * Data communication - Notebook computers - Desktop PCs - Win CE handheld products - Personal Digital Assistants (PDAs) - Printers - Fax machines, photocopiers - Screen projectors - Auto PCs - Dongles - Set-Top box * Telecommunication products - Cellular phones - Pagers * Small industrial & medical instrumentation - General data collection devices - Patient & pharmaceutical data collection devices
Functional Block Diagram
VCC
R1 LEDA (10)
TXD (9)
SP
MD0 (4) MD1 (5)
HSDL-3610
RXD (8)
GND (3) CX1 GND (7) CX2 VCC (1) AGND (2)
The HSDL-3610 can be completely shut down to achieve very low power consumption. In the shut down mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. The HSDL-3610 also incorporated the capability for adjustable optical power. With two programming pins; MODE 0 and MODE 1, the optical power output can be adjusted lower when the nominal desired link distance is one-third or two-third of the full IrDA link.
The HSDL-3610 comes in two package options; the front view option (HSDL-3610#007/#017), and the top view option (HSDL3610#008/#018). Both options come with integrated shield that helps to ensure low EMI emission and high immunity to EMI field, thus enhancing reliable performance.
Application Support Information The Application Engineering group is available to assist you with the technical understanding associated with HSDL-3610 infrared transceiver module. You can contact them through your local sales representatives for additional details.
Ordering Information Package Option Package Part Number Standard Package Increment
Front View
HSDL-3610#007
400
Front View
HSDL-3610#017
10
Top View
HSDL-3610#008
400
Top View
HSDL-3610#018
10
2
Functional Block Diagram
VCC
I/O Pins Configuration Table Pin 1 2 3 4 5 6 7 8 9 10 Description Supply Voltage Analog Ground Ground Mode 0 Mode 1 No Connection Ground Receiver Data Output Transmitter Data Input LED Anode Symbol Vcc AGND GND MD0 MD1 NC GND RXD TXD LEDA
R1 LEDA (10)
TXD (9)
SP
MD0 (4) MD1 (5)
HSDL-3610
RXD (8)
GND (3) CX1 GND (7) CX2 VCC (1) AGND (2)
10 9 8 7 6 5 4 3 2 1 10 9 8 7 6 5 4 3 2 1
BACK VIEW (HSDL-3610 #007/#017)
BOTTOM VIEW (HSDL-3610 #008/#018)
Transceiver Control Truth Table Mode 0 1 0 0 1
X = Don't Care
Mode 1 0 0 1 1
RX Function Shutdown SIR SIR SIR
TX Function Shutdown Full Distance Power 2/3 Distance Power 1/3 Distance Power
Transceiver I/O Truth Table Transceiver Mode Active Active Active Shutdown
X= Don't Care
Inputs TXD 1 0 0 X[3] EI X High[1] Low Low LED On Off Off Not Valid
Outputs RXD Not Valid Low[2] High Not Valid
EI = In-Band Infrared Intensity at detector
Notes: 1. In-Band El 115.2 kb/s. 2. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity. 3. To maintain low shutdown current, TXD needs to be driven high or low and not left floating.
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Recommended Application Circuit Components Component R1 CX1[5] CX2[6] Recommended Value 6.2 5%, 0.5 Watt, for 2.7 Vcc 3.6 V operation 15.0 5%, 0.5 Watt, for 4.75 Vcc 5.25 V operation 0.47 F 20%, X7R Ceramic 6.8 F 20%, Tantalum
Notes: 4. CX1 must be placed within 0.7 cm of the HSDL-3610 to obtain optimum noise immunity. 5. In environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in "HSDL-3610 Functional Block Diagram" in page 3.
0.7 0.6 0.5
LOP (mW/sr)
ILED (A)
200 180 160 140 120 100 80 60 40
0.4 0.3 0.2 0.1 0 1.3 1.5 1.7 1.9 2.1 2.3
20 0 0 30 60 90 120 150 180 210 240 270 300
LEDA VOLTAGE (V)
ILED (mA)
ILED vs. LEDA.
Light Output Power (LOP) vs. ILED.
Marking Information The HSDL-3610#007/017 is marked "3610YYWW" on the shield where "YY" indicates the unit's manufacturing year, and "WW" refers to the work week in which the unit is tested. The HSDL-3610#008/018 has no marking on the shield.
CAUTIONS: The BiCMOS inherent to the design of this component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
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Absolute Maximum Ratings[6] Parameter Storage Temperature Operating Temperature DC LED Current Peak LED Current LED Anode Voltage Supply Voltage Transmitter Data Input Current Receiver Data Output Voltage Symbol TS TA ILED(DC) ILED(PK) VLEDA Vcc ITXD(DC) VO -0.5 0 -12 -0.5 Minimum -40 -20 Maximum +100 +70 165 750 7 7 12 Vcc+0.5 Unit C C mA mA V V mA V |IO(RXD)| = 20 A Conditions
2 s pulse width, 10% duty cycle
Note: 6. For implementations where case to ambient thermal resistance 50C/W.
Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Logic High Input Voltage for TXD, MD0, MD1, and FIR_SEL Logic Low Transmitter Input Voltage LED (Logic High) Current Pulse Amplitude Receiver Signal Rate Ambient Light Symbol TA Vcc VIH VIL ILEDA Minimum -20 2.7 2 Vcc/3 0 180 2.4 Maximum +70 5.25 Vcc Vcc/3 300 115.2 Unit C V V V mA kb/s See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels Conditions
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Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25C and 3.3 V unless otherwise noted. Parameter Transceiver Supply Current Digital Input Current Transmitter Transmitter Radiant Intensity Symbol Shutdown Idle Logic Low/High Logic High Intensity Peak Wavelength Spectral Line Half Width Viewing Angle Optical Pulse Width Rise and Fall Times Maximum Optical Pulse Width LED Anode On State Voltage LED Anode Off State Leakage Current ICC1 ICC2 IL/H Min. Typ. 10 2.5 -1 Max. 200 5 1 Unit nA mA A Conditions VI(TXD) VIL or VI(TXD) VIH VI(TXD) VIL, EI = 0 0 VI VCC
EIH
50
120
400
mW/sr
VIH = 3.0 V ILEDA = 200 mA 1/2 15
P 1/2
875 35
nm nm
21/2 tpw (EI) tr (EI), tf (EI) tpw (max)
30 1.5
1.6
60 1.8 40
s ns
20
50
s
tpw(TXD) = 1.6 s at 115.2 kb/s tpw(TXD) = 1.6 s at 115.2 kb/s tr/f (TXD) = 10 ns TXD pin stuck high
VON(LEDA) ILK(LEDA) 1
2.4 100
V nA
ILEDA = 200 mA, VI(TXD) VIH VLEDA = VCC = 5.25 V, VI(TXD) VIL
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Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25C and 3.3 V unless otherwise noted. Parameter Receiver Receiver Data Output Voltage Symbol Logic Low[8] VOL Min. 0 Typ. Max. 0.4 Unit V Conditions IOL = 1.0 mA, EI 3.6 W/cm2, 1/2 15 IOH = -20 A, EI 0.3 W/cm2, 1/2 15 For in-band signals 115.2 kb/s[7] For in-band signals[7]
Logic High
VOH
Vcc - 0.2
-
Vcc
V
Viewing Angle Logic High Receiver Input Irradiance Logic Low Receiver Input Irradiance Receiver Peak Sensitivity Wavelength Receiver SIR Pulse Width Receiver Latency Time Receiver Rise/Fall Times Receiver Wake Up Time
21/2 EIH EIL P tpw (SIR) tL tr/f (RXD) tW
30 0.0036
500 0.3 880
mW/cm2 W/cm2 nm
1 20 25
4.0 50 100
s s ns s
1/2 15[9], CL =10 pF
[10]
Notes: 7. An in-band optical signal is a pulse/sequence where the peak wavelength, p, is defined as 850 p 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 8. Logic Low is a pulsed response. The condition is maintained for duration dependent on pattern and strength of the incident intensity. 9. For in-band signals 115.2 kb/s where 3.6 W/cm2 EI 500 mW/cm2. 10. Wake Up Time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and ready to receive infrared signals.
TXD "Stuck ON" Protection
TXD
LED
tpw (MAX.)
7
RXD Output Waveform
tpw VOH 90% 50% 10%
VOL
tf
tr
LED Optical Waveform
tpw LED ON 90% 50% 10% LED OFF
tr
tf
Receiver Wake Up Time Definition (when MD0 1 and MD1 0)
RX LIGHT
RXD
VALID DATA
tw
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HSDL-3610#007 and HSDL3610#017 Package Outline with Dimension and Recommended PC Board Pad Layout HSDL-3610#007/#017 (Front Option)
MOUNTING CENTER 6.10 PIN 1 2 3 4 5 FUNCTION VCC AGND GND MD0 MD1 PIN 6 7 8 9 10 FUNCTION NC GND RXD TXD LEDA 5.09 1.15 4.60
TOP VIEW
2.55
R 2.00
R 1.77
4.00 1.90 0.80 1.20 4.05 SIDE VIEW 3.24 12.20 +0.50 0 FRONT VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. MOUNTING CENTER MID OF LAND PIN 1 0.70 0.43 1.05
PIN 10 PIN 1
1.90 PIN 1 0.82 1.68 3.84 PIN 10
PIN 10
2.40
2.08 0.45 0.70 4.95 10 CASTELLATION: PITCH 1.1 0.1 CUMULATIVE 9.90 0.1 BACK VIEW 2.35
2.84 LAND PATTERN
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HSDL-3610#008 and HSDL3610#018 Package Outline with Dimension and Recommended PC Board Pad Layout HSDL-3610#008/#018 (Top Option)
R 2.00 PIN 1 2 3 4 5 FUNCTION VCC AGND GND MD0 MD1 PIN 6 7 8 9 10 FUNCTION NC GND RXD TXD LEDA FRONT VIEW 4.89
R 1.78
1.35 4.40
LEGEND: MC - MOUNTING CENTER OC - OPTICAL CENTER
0.90
SHIELD PAD RECEIVE 2.40 0.30 0.85 2.50 TRANSMIT 5.00
OC 2.08 1.46 0.30 3.24 5.00
MC
OC 2.08
4.16
1.50 2.25 SIDE VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED.
2.57 3.83 5.10 12.20 TOP VIEW 5.70
1.60
2.85
1.70
PIN 10
PIN 1
1.95 0.70 10 CASTELLATION: PITCH 1.1 0.1 CUM. OF 9 PITCH - 9.9 0.1
9.90
0.43 PIN 1 0.20 PIN 10 PITCH 9 x 1.10 10 x 0.60 PAD LAND PAD PATTERN
1.30
BOTTOM VIEW
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Tape and Reel Dimensions (HSDL-3610#007, #017) All dimensions in millimeters (mm) Quantity = 400 pieces per reel (HSDL-3610#007) = 10 pieces per tape (HSDL-3610#017)
13.00 0.50 R 1.00 (40 mm MIN.) EMPTY PARTS MOUNTED (400 mm MIN.) LEADER
21.00 0.80 2.00 0.50 DIRECTION OF PULLING EMPTY (40 mm MIN.)
CONFIGURATION OF TAPE LABEL
SHAPE AND DIMENSIONS OF REELS
4.00 0.10 2.00 0.10 1.75 0.10 1.50 POLARITY A 12.40 0.10 VDD 24.00 0.20 178.00 2.00 60.00 2.00 + 0.10 0 11.50 0.10
0.40 0.05 4.20 0.10
5.50 0.10 8.00 0.10 DIRECTION OF PULLING + 0.50 25.50 - 1.00
TAPE DIMENSIONS
1.60 0.50
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Tape and Reel Dimensions (HSDL-3610#008, #018) All dimensions in millimeters (mm) Quantity = 400 pieces per reel (HSDL-3610#008) = 10 pieces per tape (HSDL-3610#018)
13.00 0.50 R 1.00 (40 mm MIN.) EMPTY PARTS MOUNTED (400 mm MIN.) LEADER
21.00 0.80 2.00 0.50 DIRECTION OF PULLING EMPTY (40 mm MIN.)
CONFIGURATION OF TAPE LABEL
SHAPE AND DIMENSIONS OF REELS
4.00 0.10 2.00 0.10 1.75 0.10 1.50 + 0.10 11.50 0.10
POLARITY VDD 12.80 0.10 A 24.00 0.20 178.00 2.00 60.00 2.00
4.80 0.10 0.40 0.05 5.10 0.10 DIRECTION OF PULLING 5.65 0.10
5.30 0.10 8.00 0.10 + 0.50 25.50 - 1.00
TAPE DIMENSIONS
1.60 0.50
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Moisture Proof Packaging All HSDL-3610 options are shipped in moisture proof package. Once opened, moisture absorption begins.
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
PACKAGE IS OPENED (UNSEALED)
ENVIRONMENT LESS THAN 25C, AND LESS THAN 60% RH?
YES
NO
NO BAKING IS NECESSARY
PACKAGE IS OPENED MORE THAN 3 DAYS?
NO
YES
PERFORM RECOMMENDED BAKING CONDITIONS
Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In Reel In Bulk Temperature 60C 100C 125C Time 48 hours 4 hours 2 hours
Baking should only be done once.
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Reflow Profile
MAX. 245C R3 R4
230
T - TEMPERATURE - (C)
200 183 170 150 125 100 R1
R2
90 sec. MAX. ABOVE 183C
R5
50 25 0 P1 HEAT UP 50 100 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300
t-TIME (SECONDS) P2 SOLDER PASTE DRY
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
T 25C to 125C 125C to 170C 170C to 230C (245C at 10 seconds max.) 230C to 170C 170C to 25C
Maximum T/time 4C/s 0.5C/s 4C/s -4C/s -3C/s
The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates. The T/time rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3610 castellation I/O pins are heated to a temperature of 125C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL-3610 castellation I/O pins.
Process zone P2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170C (338F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230C (446F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder
connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170C (338F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed -3C per second maximum. This limitation is necessary to allow the PC board and HSDL-3610 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3610 transceiver.
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Appendix A: Test Method A1. Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to IEC 801-3, severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 W/cm2 (with no modulation) at the optical port. The light source faces the optical port. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radiation is covered by the incandescent condition.
3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 Watt to 100 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 Kelvin range and a spectral peak in the 850 to 1050 nm range. 4. Fluorescent Lighting: 1000 lux maximum. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave
signal (0 W/cm2 minimum and 0.3 W/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation.
All IR transceivers operating under the recommended drive conditions are classified as CENELEC EN60825-1 Accessible Emission Limit (AEL) Class 1. This standard is in effect in Europe as of January 1, 1997. AEL Class 1 LED devices are considered eye safe. Please see Application Note 1094 for more information.
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Appendix B: HSDL-3610#007/#017 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
STENCIL APERTURE
METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK PCBA
Figure 1.0. Stencil and PCBA.
1.1 Recommended Land Pattern for HSDL-3610#007/#017 Dim. a b c (pitch) d e f g mm 2.40 0.70 1.10 2.35 2.80 3.13 4.31 Inches 0.095 0.028 0.043 0.093 0.110 0.123 0.170
a theta
SHIELD SOLDER PAD Tx LENS e Rx LENS
d g b
Y
f
X
FIDUCIAL
10x PAD
c
FIDUCIAL
Figure 2.0. Top view of land pattern.
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1.2 Adjacent Land Keep-out and Solder Mask Areas Dim. h j k l mm min. 0.2 13.4 4.7 3.2 Inches min. 0.008 0.528 0.185 0.126
Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended.
j
Tx LENS
Rx LENS
* Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. * "h" is the minimum solder resist strip width required to avoid solder bridging adjacent pads. * It is recommended that 2 fiducial cross be placed at midlength of the pads for unit alignment.
LAND
h Y
SOLDER MASK
k
l
Figure 3.0. HSDL-3610#007/#017 PCBA - Adjacent land keep-out and solder mask.
2.0 Recommended Solder Paste/ Cream Volume for Castellation Joints Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume).
17
2.1 Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing.
This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used:
See Fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.8 0.05 0.110 0.002 0.127 0.005 3.4 0.05 0.134 0.002 w, the width of aperture is fixed at 0.70 mm (0.028 inches) Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
APERTURE AS PER LAND DIMENSIONS t (STENCIL THICKNESS)
SOLDER PASTE
w l
Figure 4.0. Solder paste stencil aperture.
3.0 Pick and Place Misalignment Tolerance and Product SelfAlignment after Solder Reflow If the printed solder paste volume is adequate, the unit will selfalign in the X-direction after solder reflow. Units should be properly reflowed in IR Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter.
Allowable Misalignment Tolerance X - direction Theta - direction 0.2 mm (0.008 inches) 2 degrees
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3.1 Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during
placement of the unit. The castellations will completely selfalign to the pads during solder reflow as seen in the pictures below.
Photo 1.0. Castellation misaligned to land pads in x-axis before reflow.
Photo 2.0. Castellation self-align to land pads after reflow.
3.2 Tolerance for Rotational (Theta) Misalignment Units when mounted should not be rotated more than 2 degrees with reference to center X-Y as specified in Fig 2.0. Pictures 3.0 and 4.0 show units before and
after reflow. Units with a Theta misalignment of more than 2 degrees do not completely self align after reflow. Units with 2 degree rotational or Theta misalignment self-aligned completely after solder reflow.
Photo 3.0. Unit is rotated before reflow.
Photo 4.0. Unit self-aligns after reflow.
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3.3 Y-axis Misalignment of Castellation In the Y-direction, the unit does not self-align after solder reflow. It is recommended that the unit be placed in line with the fiducial
mark (mid-length of land pad.) This will enable sufficient land length (minimum of 1/2 land length.) to form a good joint. See Fig 5.0.
LENS EDGE FIDUCIAL
Y
MINIMUM 1/2 THE LENGTH OF THE LAND PAD
Figure 5.0. Section of a castellation in Y-axis.
3.4 Example of Good HSDL-3610#007/#017 Castellation Solder Joints This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. It should be reflowed in IR Hot-air convection reflow oven. Direction of board travel does not matter.
Photo 5.0. Good solder joint.
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4.0 Solder Volume Evaluation and Calculation Geometry of an HSDL-3610#007/#017 solder fillet.
0.425 0.20
0.8
1.2
0.70
0.4
0.7
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Appendix C : HSDL-3610#008/#018 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
STENCIL APERTURE
METAL STENCIL FOR SOLDER PASTE PRINTING
LAND PATTERN
SOLDER MASK PCBA
Figure 1.0. Stencil and PCBA.
1.1 Recommended Land Pattern for HSDL-3610#008/#018 Dim. a b c (pitch) d e f g h mm 1.95 0.60 1.10 1.60 5.70 3.80 2.40 0.80 Inches 0.077 0.024 0.043 0.063 0.224 0.150 0.094 0.032
SHIELD SOLDER PAD e
d g
Y
Rx LENS b theta Tx LENS f
X
h
a
FIDUCIAL
10x PAD
c
FIDUCIAL
Figure 2.0. Top view of land pattern.
22
1.2 Adjacent Land Keep-out and Solder Mask Areas Dim. h j k l mm min. 0.2 13.4 5.8 3.5 Inches min. 0.008 0.528 0.228 0.130
Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended.
j
Rx LENS
Tx LENS
* Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. * "h" is the minimum solder resist strip width required to avoid solder bridging adjacent pads. * It is recommended that 2 fiducial cross be placed at midlength of the pads for unit alignment.
LAND
h Y
SOLDER MASK
k
l
Figure 3.0. HSDL-3610#008/#018 PCBA - Adjacent land keep-out and solder mask.
2.0 Recommended Solder Paste/ cream Volume for Castellation Joints Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.28 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume).
23
2.1 Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing.
This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used:
See Fig 4.0 t, nominal stencil thickness mm inches 0.152 0.127 l, length of aperture mm inches
0.006 3.1 0.05 0.122 0.002 0.005 3.7 0.05 0.147 0.002 w, the width of aperture is fixed at 0.60 mm (0.024 inches) Aperture opening for shield pad is 5.7 mm x 1.6 mm as per land dimensions
APERTURE AS PER LAND DIMENSIONS t (STENCIL THICKNESS)
SOLDER PASTE
w l
Figure 4.0. Solder paste stencil aperture.
3.0 Pick and Place Misalignment Tolerance and Product SelfAlignment after Solder Reflow If the printed solder paste volume is adequate, the unit will selfalign in X-direction after solder reflow. Units should be properly reflowed in IR Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter.
Allowable Misalignment Tolerance X - direction 0.2 mm (0.008 inches)
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3.1 Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during
placement of the unit. The castellations will completely selfalign to the pads during solder reflow as seen in the pictures below.
Castellation
Photo 1.0. Castellation mis-aligned to land pads in X-axis before reflow.
3.2 Tolerance for Rotational (Theta) Misalignment Units when mounted should not be rotated more than 1 degrees with reference to center X-Y as specified in Fig 2.0. Pictures 3.0
Photo 3.0. Unit is rotated before reflow.
Solder
Photo 2.0. Castellation self-aligned to land pads after reflow.
and 4.0 show that unit cannot be self-aligned back due to the small wetting force. Units with a Theta misalignment of more than 1 degree do not completely self align after reflow.
Photo 4.0. Unit not self-aligned after reflow.
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3.3 Y-axis Misalignment of Castellation In the Y-direction, the unit does not self align after solder reflow. It is recommended that the unit be placed in line with the fiducial mark. This will enable sufficient land length to form a good joint. See Fig. 5.0.
Tx LENS Rx LENS
FIDUCIAL EDGE
Y
Figure 5.0. Section of a castellation in Y-axis.
3.4 Example of Good Castellation Solder Joints
Photo 6.0. Good attachment before reflow.
Photo 7.0. Good solder joint after reflow.
This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. It should be
reflowed in IR Hot-air convection reflow oven. Direction of board travel does not matter.
26
4.0 Solder Volume Evaluation and Calculation Geometry of an HSDL-3610#008/#018 solder fillet.
0.46
0.6 0.6
0.1 0.8 1.15
Vsolder = (0.8 x 0.6 x 0.1) + (0.5 x 0.6 x 0.46 (0.6 + 1.15)/2) = 0.1662 mm3 Vpaste = Vsolder/0.6 = 0.277 mm3
27
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5980-1767E 5988-2314EN April 20, 2006

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