View 0603LWCT_1190121.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
Features
Extra thin 0.4mm, Top view, Wide view angle, Bluish White color SMD chip LED . Special for Cellular Phone keypad / LCD backlighting or thin touch button LED backlighting. Packing in 8mm tape on 7" diameter reels. Compatible with automatic Pick & Place equipment. Compatible with Reflow soldering and Wave soldering processes. EIA STD package.(ANSI/EIA-481-B-2001) I.C. compatible, low current application Pb free product and acceptable lead-free process!.
PACKAGE OUTLINE DIMENSIONS
+ -
Notes: 1. All dimensions are in millimeters. 2. Tolerance is 0.1mm (.004") unless otherwise noted.
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 1
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
CHIP MATERIALS
Dice Material : InGaN Light Color : Bluish White Lens Color : Light Yellow Diffused.
Absolute Maximum Ratings(Ta=25)
Symbol PD IPF IF VR ESD Topr Tstg Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current De-rating Linear From 25 Reverse Voltage Electrostatic Discharge Threshold(HBM) Operating Temperature Range Storage Temperature Range Wave Soldering Condition (Two times Max.)
Note A
Parameter
Rating 76 80 20 0.25 5 150 -20 + 85 -40 ~ + 85 260 (for 5 seconds)
Unit mW mA mA mA/ V V
Infrared Soldering Condition (Two times MAX.) 240 (for 10 seconds)
Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD.
Electro-Optical Characteristics(Ta=25)
Parameter Luminous Intensity Viewing Angle CIE Chromaticity CIE Chromaticity Forward Voltage Reverse Current Symbol IV 21/2 X Y VF IR 0.19 0.14 2.8 Min. 25 Typ. 60 130 0.22 0.18 3.15 50 V A Max. Unit mcd Deg Test Condition IF=5mA Note 2 IF=5mA IF = 5mA VR = 5V
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE2
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 4. Major standard testing equipment by "Instrument System" Model : CAS140B Compact Array Spectrometer and "KEITHLEY" Source Meter Model : 2400. 5. Tolerance of CIE Value: 1%.
Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 3
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
Typical Electro-Optical Characteristics Curves
(25 Ambient Temperature Unless Otherwise Noted)
Fig.2 Forward Current vs.Forward Voltage
Luminous lntensity(mcd) Fig.3 Luminous Intensity vs.Forward Current 1000 Relative Luminous lntensity Normalized of 20mA Relative luminous intensity(%) 100 10 1 -60 -40 -20 -0 20 40 60 80 100 Ambient Temperature Ta() Fig.4 Relative Luminous Intensity vs.Forward Current 50 Forward Current IF(mA) 40 30 20 10 0 0 20 40 60 80 100 1.0 0.9 0.8 0.7 0.5 0.3 0.1 0.2 0.4 0.6 0 10 Fig.5 Luminous Intensity vs.Ambient Temperature 20 30 40 40 50 60 70 80 90 1.0 0.9 0.8 0.7 0.5 0.3 0.1 0.2 0.4 0.6 60 70 80 90 50 0 10 20 30 Ambient Temperature Ta() Fig.6 Forward Current Derating Curve Fig.7 Relative Intensity vs.Angle Fig.7 Relative Intensity vs.Angle
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 4
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
Reel Dimensions
Notes: 1. Taping Quantity : 3000pcs, (Minimum packing quantity will be 500 pcs for remainders) 2. The tolerances unless mentioned is0.1mm, Angle0.5, Unit : mm.
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 5
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
Package Dimensions Of Tape And Reel
Progressive direction
Cathode
Polarity
Notes:All dimensions are in millimeters.
Moisture Resistant Packaging
Label
Reel
Label Aluminum moistue-proof bag Desiccant
240
145
255
Label
T LIGH
210
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
DRAWING NO. : DS-74-03-0007
DATE : 2004-06-07
PAGE 6
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
Cleaning
If cleaning is required , use the following solutions for less than 1 minute and less than 40. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem.
Suggest Soldering Pad Dimensions
Direction of PWB camber and go to reflow furnace
Notes : Suggest stencil print screen thickness are 0.10mm maximum.
Suggest IR Reflow Soldering Profile Condition:
240 C(MAX) Rising +5/sec (MAX) Temperature()
C C
Cooling -5/sec (MAX)
+5/sec (MAX)
Time
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 7
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
Bin Code List
Luminous Intensity(IV), Unit:mcd@5mA Bin Code N P Min 28.0 45.0 Max 45.0 71.0 Forward Voltage(VF), Unit:V@5mA Bin Code 12 13 14 Tolerance of each bin are15% Min 2.70 2.80 2.90 Max 2.80 2.90 3.00
Tolerance of each bin are0.1Volt
CAUTIONS
1.Application Limitation : The LED's described here are intended to be used for ordinary electronic equipment(such as office equipment, communication equipment and household application).Consult HB's sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED's may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.Storage : Before opening the package : The LEDs should be kept at 5C to 30C or less and 85%RH or less. The LEDs should be used within a year. After opening the package : The LEDs should be kept at 5C to 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours(7 days) after opening the package. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3.Soldering Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering : Pre-heat 120~150C, 120sec. MAX., Peak temperature : 240C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don't to touch LED lens when soldering. Wave soldering : Pre-heat 100C Max, Pre-heat time 60 sec. Max, Solder wave 260C Max, Soldering time 5 sec. Max. performed consecutively cooling process is required between 1st and 2nd soldering processes.
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 8
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
4. Lead-Free Soldering For Reflow Soldering : 1Pre-Heat Temp: 150-180,120sec.Max. 2Soldering Temp: Temperature Of Soldering Pot Over 230,40sec.Max. 3Peak Temperature: 2605sec. 4Reflow Repetition: 2 Times Max. 5Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu For Soldering Iron (Not Recommended) : 1Iron Tip Temp: 350 Max. 2Soldering Iron: 30w Max. 3Soldering Time: 3 Sec. Max. One Time. For Dip Soldering : 1Pre-Heat Temp: 150 Max. 120 Sec. Max. 2Bath Temp: 265 Max. 3Dip Time: 5 Sec. Max. 5. Drive Method Circuit model A Circuit model B
(A)Recommended circuit. (B)The difference of brightness between LEDs could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 9
SURFACE MOUNT DEVICE LED Part No. : 0603LWCT
6.Reliability Test
Classification Test Item Test Condition Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. IR-Reflow In-Board, 2 Times Ta= 655,RH= 9095% *Test Time= 1000HRS2HRS Ta= 1055 Test Time= 1000HRS (-24HRS,72HRS) Ta= -555 *Test Time=1000HRS (-24HRS,72H RS) 1055 10mins -555 10mins Reference Standard MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) MIL-STD-202F:103B(1980) JIS C 7021:B-11(1982) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) JIS C 7021:B-12 (1982) MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021:A-4(1982) MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021:A-1(1982) MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) IEC 68 Part 2-20 JIS C 7021:A-2(1982)
Operation Life High Temperature Endurance Test High Humidity Storage High Temperature Storage Low Temperature Storage Temperature Cycling
100 Cycles
Thermal Shock Environmental Test Solder Resistance
IR-Reflow In-Board, 2 Times 1055 -555 10mins 10mins 100 Cycles Tsol= 260 5 Dwell Time= 10 1sec Tsol= 235 5 Immersion time 20.5 sec Immersion rate 252.5 mm/sec Coverage 95% of the dipped surface
Solder ability
7.Others: The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-75-04-0012
DATE : 2004-08-18
PAGE 10

▲Up To Search▲

Price & Availability of 0603LWCT

	To Download 0603LWCT Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .