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3.8x2.0mm DOME LENS SMD CHIP LED LAMP APED3820SGC SUPER BRIGHT GREEN Features lLOW l3.8mmx2.0mm SMT LED,3.2mm THICKNESS. lIDEAL FOR BACKLIGHT AND INDICATOR. lVARIOUS lPACKAGE Description POWER CONSUMPTION. The Super Bright Green source color devices are made with Gallium Phosphide Green Light Emitting Diode. COLORS AND LENS TYPES AVAILABLE. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0342 APPROVED : J. Lu REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU PAGE: 1 OF 4 Selection Guide P ar t N o . APED 3820SGC Dic e SUPER BRIGHT GREEN (GaP) L en s Ty p e WATER C LEAR Iv (m c d ) @ 20 m A V i ew i n g An g le 60 (H) 35 (V) 21/2 Mi n . 10 Ty p . 40 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25C Sy m b o l P ar am et er Peak Wavelength D omi nate Wavelength D ev i c e Super Bri ght Green Super Bri ght Green Ty p . 565 568 30 15 2.2 2.5 10 Max . Un its nm nm nm pF V uA Tes t C o n d i t i o n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V p e a k D 1/2 C VF IR Spectral Li ne Half-wi dth Super Bri ght Green C apaci tance Forward Voltage Reverse C urrent Super Bri ght Green Super Bri ght Green Super Bri ght Green Absolute Maximum Ratings at TA=25C P ar am et er D C Forward C urrent Power di ssi pati on Su p er B r i g h t Gr een 105 140 5 -40C To +85C 25 Un its mW mA V mA Peak Forward C urrent [1] Operati ng / Storage Temperature Reverse Voltage Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0342 APPROVED : J. Lu REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU PAGE: 2 OF 4 Super Bright Green APED3820SGC SPEC NO: DSAB0342 APPROVED : J. Lu REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU PAGE: 3 OF 4 APED3820SGC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0342 APPROVED : J. Lu REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU PAGE: 4 OF 4 |
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