 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| 3.2X1.6mm SMD CHIP LED LAMP APK3216TGC GREEN Features !3.2mmX1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS !PACKAGE Description The Green source color devices are made with InGaN on SiC Light Emitting Diode. COLORS AND LENS TYPES AVAILABLE. :2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1151 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APK3216TGC GREEN(InGaN) WATER CLEAR 70 Ty p . 180 V i ew i n g An g l e 21/2 90 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Green Green Green Green Green Green D ev i c e Ty p . 500 505 30 56 3.6 4.4 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF = 2 0 m A IF = 2 0 m A IF = 2 0 m A V F = 0 V; f = 1 M Hz IF = 2 0 m A VR = 5V Absolute Maximum Ratings at T)=25C Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Gr een 110 30 150 5 -40C To +85C Un it s mW mA mA V SPEC NO: DSAD1151 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 Green APK3216TGC SPEC NO: DSAD1151 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APK3216TGC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1151 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE:MAR/25/2003 DRAWN: L.ZHANG PAGE: 4 OF 4 |
Price & Availability of APK3216TGC
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |