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APTGF25DDA120T3G Dual Boost Chopper NPT IGBT Power Module 13 14 VCES = 1200V IC = 25A @ Tc = 80C Application * AC and DC motor control * Switched Mode Power Supplies * Power Factor Correction Features * Non Punch Through (NPT) Fast IGBT(R) - Low voltage drop - Low tail current - Switching frequency up to 50 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - Avalanche energy rated - RBSOA and SCSOA rated - Symmetrical design * Kelvin emitter for easy drive * Very low stray inductance * High level of integration * Internal thermistor for temperature monitoring Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * Easy paralleling due to positive TC of VCEsat * Each leg can be easily paralleled to achieve a single boost of twice the current capability. * RoHS compliant Max ratings 1200 40 25 100 20 208 50A@1150V Unit V A V W July, 2006 1-6 APTGF25DDA120T3G - Rev 1 CR1 CR2 22 7 23 Q1 26 27 8 Q2 4 3 29 15 30 31 R1 32 16 28 27 26 25 29 30 23 22 20 19 18 16 15 31 32 2 3 4 7 8 10 11 12 14 13 All multiple inputs and outputs must be shorted together Example: 13/14 ; 29/30 ; 22/23 ... Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation TC = 25C TC = 80C TC = 25C TC = 25C Tj = 125C Reverse Bias Safe Operating Area These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGF25DDA120T3G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Symbol Cies Coes Cres Qg Qge Qgc Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Test Conditions Min Zero Gate Voltage Collector Current Collector Emitter saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate - Emitter Charge Gate - Collector Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy VGE = 0V VCE = 1200V Tj = 25C Tj = 125C Tj = 25C VGE =15V IC = 25A Tj = 125C VGE = VCE , IC = 1mA VGE = 20V, VCE = 0V Test Conditions VGE = 0V VCE = 25V f = 1MHz VGE = 15V VBus = 300V IC =25A Inductive Switching (25C) VGE = 15V VBus = 400V IC = 25A R G = 22 Inductive Switching (125C) VGE = 15V VBus = 400V IC = 25A R G = 22 VGE = 15V Tj = 125C VBus = 400V IC = 25A Tj = 125C R G = 22 Typ Max 250 500 3.7 6 400 Typ 1650 250 110 160 10 70 60 50 305 30 60 50 346 40 3.5 mJ 1.5 Max Unit A V V nA Unit pF 2.5 4 3.2 4.0 Dynamic Characteristics Min nC ns ns Chopper diode ratings and characteristics Symbol Characteristic VRRM IRM IF VF Maximum Peak Repetitive Reverse Voltage Test Conditions Tj = 25C Tj = 125C Tc = 70C Min 1200 Typ Max 250 500 Unit V A A V July, 2006 2-6 APTGF25DDA120T3G - Rev 1 Maximum Reverse Leakage Current Forward Current Diode Forward Voltage VR=1200V IF = 60A IF = 120A IF = 60A IF = 60A VR = 800V di/dt =200A/s Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C 60 2 2.3 1.8 400 470 1.2 4 2.5 trr Qrr Reverse Recovery Time Reverse Recovery Charge ns C www.microsemi.com APTGF25DDA120T3G Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol Characteristic R25 Resistance @ 25C B 25/85 T25 = 298.15 K Min Typ 50 3952 Max Unit k K RT = R 25 1 1 RT : Thermistor value at T exp B 25 / 85 T - T 25 T: Thermistor temperature Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Thermal and package characteristics Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode Min Typ Max 0.6 0.9 150 125 100 4.7 110 Unit C/W V C N.m g RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz To heatsink M4 2500 -40 -40 -40 2.5 SP3 Package outline (dimensions in mm) 1 12 See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com www.microsemi.com 3-6 APTGF25DDA120T3G - Rev 1 July, 2006 17 28 APTGF25DDA120T3G Typical Performance Curve 80 Ic, Collector Current (A) 70 60 50 40 30 20 10 0 0 2 3 4 5 6 7 VCE, Collector to Emitter Voltage (V) Transfer Characteristics VGE, Gate to Emitter Voltage (V) 250s Pulse Test < 0.5% Duty cycle Output characteristics (VGE=15V) Ic, Collector Current (A) 250s Pulse Test < 0.5% Duty cycle TJ=25C 20 16 12 8 4 0 Output Characteristics (VGE=10V) 250s Pulse Test < 0.5% Duty cycle TJ=25C TJ=125C TJ=125C 1 8 0 0.5 1 1.5 2 2.5 3 3.5 VCE, Collector to Emitter Voltage (V) Gate Charge IC = 25A TJ = 25C V CE =240V V CE=600V 120 Ic, Collector Current (A) 18 16 14 12 10 8 6 4 2 0 0 100 80 60 40 V CE =960V TJ=125C 20 0 0 T J=25C 2.5 5 7.5 10 12.5 VGE, Gate to Emitter Voltage (V) On state Voltage vs Gate to Emitter Volt. TJ = 125C 250s Pulse Test < 0.5% Duty cycle 15 30 60 90 120 150 180 Gate Charge (nC) On state Voltage vs Junction Temperature 250s Pulse Test < 0.5% Duty cycle VGE = 15V Ic=50A Ic=25A VCE, Collector to Emitter Voltage (V) 9 8 7 6 5 4 3 2 1 0 9 VCE, Collector to Emitter Voltage (V) 6 5 4 3 2 1 0 Ic=50A Ic=25A Ic=12.5A Ic=12.5A 10 11 12 13 14 15 16 -50 VGE, Gate to Emitter Voltage (V) Breakdown Voltage vs Junction Temp. Collector to Emitter Breakdown Voltage (Normalized) -25 0 25 50 75 100 TJ, Junction Temperature (C) 125 1.10 Ic, DC Collector Current (A) 60 50 DC Collector Current vs Case Temperature 1.05 1.00 0.95 0.90 0.85 0.80 -50 -25 0 25 50 75 100 TJ, Junction Temperature (C) 125 30 20 10 0 -50 -25 0 25 50 75 100 TC, Case Temperature (C) 125 150 www.microsemi.com 4-6 APTGF25DDA120T3G - Rev 1 July, 2006 40 APTGF25DDA120T3G Turn-On Delay Time vs Collector Current V CE = 600V RG = 22 Turn-Off Delay Time vs Collector Current td(off), Turn-Off Delay Time (ns) td(on), Turn-On Delay Time (ns) 75 70 65 60 55 50 5 15 25 35 45 55 ICE, Collector to Emitter Current (A) Current Rise Time vs Collector Current 400 V GE=15V, TJ=125C 350 300 V GE = 15V 250 V CE = 600V R G = 22 V GE=15V, TJ=25C 200 5 15 25 35 45 55 ICE, Collector to Emitter Current (A) Current Fall Time vs Collector Current 160 V CE = 600V RG = 22 50 45 tf, Fall Time (ns) T J = 125C tr, Rise Time (ns) 120 40 35 30 25 TJ = 25C 80 V GE=15V 40 V CE = 600V, VGE = 15V, RG = 22 0 5 15 25 35 45 55 ICE, Collector to Emitter Current (A) Turn-On Energy Loss vs Collector Current V CE = 600V R G = 22 20 5 15 25 35 45 ICE, Collector to Emitter Current (A) 55 Turn-Off Energy Loss vs Collector Current Eoff, Turn-off Energy Loss (mJ) Eon, Turn-On Energy Loss (mJ) 10 8 6 4 2 0 5 4 V CE = 600V V GE = 15V RG = 22 TJ = 125C TJ=125C, V GE=15V 3 TJ=25C, V GE =15V 2 TJ = 25C 1 0 15 25 35 45 ICE, Collector to Emitter Current (A) 55 5 15 25 35 45 ICE, Collector to Emitter Current (A) Reverse Bias Safe Operating Area 55 Switching Energy Losses (mJ) 5 4 3 2 1 0 Switching Energy Losses vs Gate Resistance VCE = 600V VGE = 15V T J= 125C 60 IC, Collector Current (A) Eon, 25A 50 40 Eoff, 25A 20 10 0 0 10 20 30 40 50 60 0 400 800 1200 Gate Resistance (Ohms) VCE, Collector to Emitter Voltage (V) www.microsemi.com 5-6 APTGF25DDA120T3G - Rev 1 July, 2006 30 APTGF25DDA120T3G Fmax, Operating Frequency (kHz) Capacitance vs Collector to Emitter Voltage 10000 Cies Operating Frequency vs Collector Current 120 100 80 ZVS VCE = 600V D = 50% RG = 22 TJ = 125C TC= 75C C, Capacitance (pF) 1000 Coes 60 40 20 0 0 10 20 30 IC, Collector Current (A) 40 Hard switching ZCS 100 Cres 10 0 10 20 30 40 VCE, Collector to Emitter Voltage (V) 50 0.7 Thermal Impedance (C/W) 0.6 0.5 0.4 0.3 0.2 0.1 0.5 0.3 0.1 0.05 0.9 0.7 Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Single Pulse 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration (Seconds) Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 6-6 APTGF25DDA120T3G - Rev 1 Microsemi reserves the right to change, without notice, the specifications and information contained herein July, 2006 |
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