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APTGT200H120G Full - Bridge Fast Trench + Field Stop IGBT(R) Power Module VBUS Q1 G1 Q3 G3 VCES = 1200V IC = 200A @ Tc = 80C Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies * Motor control Features * Fast Trench + Field Stop IGBT(R) Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - Avalanche energy rated - RBSOA and SCSOA rated * Kelvin emitter for easy drive * Very low stray inductance - Symmetrical design - M5 power connectors * High level of integration Benefits * Stable temperature behavior * Very rugged * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Easy paralleling due to positive TC of VCEsat * Low profile * RoHS Compliant E1 OUT1 OUT2 E3 Q2 G2 Q4 G4 E2 E4 0/VBUS OUT1 G1 E1 VBUS 0/VBUS G2 E2 E3 G3 OUT2 E4 G4 Absolute maximum ratings Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation TC = 25C TC = 80C TC = 25C TC = 25C Tj = 125C Max ratings 1200 280 200 400 20 890 400A @ 1100V Unit V July, 2006 1-5 APTGT200H120G - Rev 1 A V W Reverse Bias Safe Operating Area These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com APTGT200H120G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter Saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V, VCE = 1200V Tj = 25C VGE =15V IC = 200A Tj = 125C VGE = VCE , IC = 3 mA VGE = 20V, VCE = 0V Min 1.4 5.0 Typ 1.7 2.0 5.8 Max 350 2.1 6.5 500 Unit A V V nA Dynamic Characteristics Symbol Cies Coes Cres Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn on Energy Turn off Energy Test Conditions VGE = 0V VCE = 25V f = 1MHz Inductive Switching (25C) VGE = 15V VBus = 600V IC = 200A R G = 2.7 Inductive Switching (125C) VGE = 15V VBus = 600V IC = 200A R G = 2.7 VGE = 15V Tj = 125C VBus = 600V IC = 200A Tj = 125C R G = 2.7 Min Typ 14 0.8 0.6 260 30 420 70 290 50 520 90 20 Max Unit nF ns ns mJ 20 Reverse diode ratings and characteristics Symbol Characteristic VRRM Maximum Peak Repetitive Reverse Voltage IRM IF VF trr Qrr Er Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy Test Conditions VR=1200V IF = 200A VGE = 0V Tj = 25C Tj = 125C Tc = 80C Tj = 25C Tj = 125C Tj = 25C IF = 200A VR = 600V di/dt =2500A/s Min 1200 Typ Max 350 600 Unit V A A 200 1.6 1.6 170 280 18 36 10 18 2.1 V ns C mJ Tj = 125C Tj = 25C Tj = 125C Tj = 25C Tj = 125C www.microsemi.com 2-5 APTGT200H120G - Rev 1 July, 2006 APTGT200H120G Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight To heatsink For terminals M6 M5 IGBT Diode 2500 -40 -40 -40 3 2 Min Typ Max 0.14 0.25 150 125 100 5 3.5 280 Unit C/W V C N.m g RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz SP6 Package outline (dimensions in mm) www.microsemi.com 3-5 APTGT200H120G - Rev 1 See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com July, 2006 APTGT200H120G Typical Performance Curve 400 Output Characteristics (VGE =15V) Output Characteristics 400 T J = 125C TJ=125C 300 IC (A) TJ=25C 300 IC (A) V GE=17V VGE =13V VGE=15V 200 200 VGE =9V 100 100 0 0 1 2 VCE (V) 3 4 0 0 1 2 VCE (V) 3 4 Transfert Characteristics 400 350 300 E (mJ) 250 IC (A) 200 150 100 50 0 5 6 7 8 9 10 11 12 V GE (V) Switching Energy Losses vs Gate Resistance 50 40 E (mJ) 30 20 10 0 0 4 8 12 16 Gate Resistance (ohms) 20 VCE = 600V VGE =15V IC = 200A T J = 125C Eon 50 40 Energy losses vs Collector Current VCE = 600V VGE = 15V RG = 2.7 T J = 125C Eon Eoff Er Eon TJ=25C TJ=125C 30 20 10 0 0 TJ=125C 50 100 150 200 250 300 350 400 IC (A) Reverse Bias Safe Operating Area 450 400 350 300 IF (A) Eoff Er 250 200 150 100 50 0 0 300 600 900 VCE (V) 1200 1500 VGE =15V T J=125C RG=2.7 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.16 Thermal Impedance (C/W) 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse 0.01 0.1 1 10 IGBT 0 0.00001 rectangular Pulse Duration (Seconds) www.microsemi.com 4-5 APTGT200H120G - Rev 1 July, 2006 APTGT200H120G Operating Frequency vs Collector Current Fmax, Operating Frequency (kHz) 60 50 ZVS VCE=600V D=50% RG =2.7 TJ=125C Tc=75C Forward Characteristic of diode 400 350 300 250 IF (A) 200 150 100 T J=125C T J=25C 40 30 20 10 0 0 40 80 120 160 IC (A) Hard switching ZCS TJ =125C 50 0 200 240 280 0 0.4 0.8 1.2 1.6 V F (V) 2 2.4 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.3 Thermal Impedance (C/W) 0.25 0.2 0.15 0.1 0.05 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 Single Pulse 0.01 0.1 1 10 Diode 0 0.00001 rectangular Pulse Duration (Seconds) Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 5-5 APTGT200H120G - Rev 1 Microsemi reserves the right to change, without notice, the specifications and information contained herein July, 2006 |
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