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| 2.0X1.25mm SMD CHIP LED LAMP APTK2012SEC SUPER BRIGHT ORANGE Features !2.0mmX1.25mm SMT LED, 0.75mm THICKNESS. !LOW Description The Super Bright Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. !WIDE !IDEAL !VARIOUS !PACKAGE Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1047 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APTK2012SEC SUPER BRIGHT ORANGE (InGaAlP) WATER CLEAR 110 Ty p . 28 0 V i ew i n g An g l e 21/2 10 0 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current D ev i c e Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Super Bright Orange Ty p . 6 10 601 29 30 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s IF = 2 0 m A IF = 2 0 m A IF = 2 0 m A V F = 0 V; f = 1 M Hz IF = 2 0 m A VR = 5V Absolute Maximum Ratings at T)=25C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Su p er B r ig h t Or an g e 75 30 195 5 -40C To +85C Un it s mW mA mA V SPEC NO: DSAD1047 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Super Bright Orange APTK2012SEC SPEC NO: DSAD1047 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APTK2012SEC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1047 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4 |
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