 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Mini PROFET(R) BSP 550 MiniPROFET * High-side switch * Short-circuit protection * Input protection * Overtemperature protection with hysteresis * Overload protection * Overvoltage protection * Switching inductive load * Clamp of negative output voltage with inductive loads * Undervoltage shutdown * Maximum current internally limited * Electrostatic discharge (ESD) protection * Reverse battery protection1) Package: SOT 223 Type Ordering code Q67000-S311 Pins 1 OUT 2 GND 3 IN 4 Vbb 4 3 2 1 BSP 550 Maximum Ratings Parameter Supply voltage range Load current self-limited Maximum input voltage2) Maximum input current Inductive load switch-off energy dissipation single pulse IL = 1.0A , TA = 85C Operating temperature range Storage temperature range Max. power dissipation (DC)3) TA = 25 C Electrostatic discharge capability (ESD) 4) Thermal resistance chip - soldering point: chip - ambient3) Symbol Vbb IL VIN IIN EAS Values -0.3...48 IL(SC) -5.0...Vbb 5 0.3 -40 ...+125 -55 ...+150 1.4 1 7 70 Unit V A V mA J C W kV K/W Tj Tstg Ptot VESD RthJS RthJA + V bb 4 Voltage source ESDDiode Overvoltage protection Current limit Gate protection V Logic Voltage sensor Charge pump Level shifter Rectifier Limit for unclamped ind. loads OUT Temperature sensor 1 3 R IN in Load ESD Logic GND MINI-PROFET Load GND 2 Signal GND GND=150 in GND connection, resistor in series with IN connections reverse load current limited by connected load. 2) At V > V , the input current is not allowed to exceed 5 mA. IN bb 3) BSP 550 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm 2 copper area for V connection bb 4) HBM according to MIL-STD 883D, Methode 3015.7 1) With resistor R Semiconductor Group Page 1 of 7 20.06.96 BSP 550 Electrical Characteristics Parameter and Conditions at Tj = 25 C, Vbb = 24V unless otherwise specified Symbol min Values typ Unit max Load Switching Capabilities and Characteristics On-state resistance (pin 4 to 1) IL = 1.0 A, Vin = high Tj = 25C Tj = 125C 5) Nominal load current (pin 4 to 1) ISO Standard: VON = Vbb - VOUT = 0.5 V TS = 85 C Turn-on time to 90% VOUT Turn-off time to 10% VOUT RL = 24 Slew rate on 10 to 30% VOUT, RL = 24 Slew rate off 70 to 40% VOUT, RL = 24 RON IL(ISO) --1.4 0.16 --- 0.2 0.38 -- A ton toff dV /dton -dV/dtoff ----- 60 90 2 2 100 150 4 4 s V/s V/s Input Allowable input voltage range, (pin 3 to 2) Input turn-on threshold voltage Vbb = 18...30V Tj = -25...+125C Input turn-off threshold voltage Vbb = 18...30V Tj = -25...+125C Input threshold hysteresis Off state input current (pin 3) VIN(off) = 1.82 V Tj = -25...+125C On state input current (pin 3) VIN(on) = 3.0 V to Vbb Tj = -25...+125C Input resistance Tj = -25...+125C VIN VIN(T+) VIN(T-) VIN(T) IIN(off) -3.0 -1.82 -20 -1.5 ---0.1 --2.8 Vbb 3.0 ---110 3.5 V V V V A A k IIN(on) RIN 5) I L(ISO) is limited by the current limitation, see IL(SC) Semiconductor Group Page 2 20.06.96 BSP 550 Parameter and Conditions at Tj = 25 C, Vbb = 24V unless otherwise specified Symbol min Values typ Unit max Operating Parameters Operating voltage Tj =-25...+125C Undervoltage shutdown Tj =-25...+125C Undervoltage restart Tj =-25...+125C: Undervoltage hysteresis Standby current (pin 4), Vin = low Tj =-25...+100C Tj =125C6) Operating current (pin 2), Vin = high Tj =-25...+125C leakage current (pin 1) Vin = low Tj =-25...+125C Protection Functions Current limit (pin 4 to 1) Vbb(on) Vbb(under) Vbb(u rst) Vbb(under) Ibb(off) IGND IL(off) 12 7 ------ --0.4 10 1 -- 40 10.5 11 -25 50 1.6 2 V V V V A mA A Tj = 25C Tj = -25...+125C Overvoltage protection Ibb=4mA Tj =-25...+125C Output clamp (ind. load switch off) VOUT = Vbb - VON(CL), Ibb = 4mA Thermal overload trip temperature Thermal hysteresis Inductive load switch-off energy dissipation 7) Tj Start = 85 C, single pulse, IL = 1.0 A, Vbb = 12 V IL(SC) Vbb(AZ) VON(CL) Tjt Tjt EAS 1.4 1.4 48 -135 --- 2.5 --72 150 10 -- 4.0 4.8 ----0.3 A V V C K J Reverse Battery Reverse battery voltage 8) Continious reverse drain current Drain-Source diode voltage IF = 1 A, Vin = low TA = 25C VOUT>Vbb -Vbb -IS -VON --- --- 30 1 1.2 V A V 6) increase of standby current at T = 125C caused by temperature sense current j 7) while demagnetizing load inductance, dissipated energy is E = (V AS ON(CL) * iL(t) dt, VON(CL) 1/ * L * I2 * ( ) approx. EAS= 2 L VON(CL)-Vbb 8) Requires 150 resistor in GND connection. Reverse load current (through intrinsic drain-source diode) is normally limited by the connected load. Semiconductor Group Page 3 20.06.96 BSP 550 Max allowable power dissipation Ptot = f (TA,TSP) Ptot [W] 16 14 12 10 8 TS P Current limit characteristic IL(SC) = f (Von), (Von see testcircuit) IL(SC) [A] 3 ,5 3 1 2 5 C 2 ,5 -2 5 C 2 5 C 2 1 ,5 6 4 TA 2 0 0 25 50 75 100 125 1 0 ,5 0 0 5 10 15 20 25 TA, TSP[C] On state resistance (Vbb-pin to OUT pin) RON = f (Tj);Vbb = 24 V;IL = 1.0 A RON [] 0.4 0.35 0.3 0.25 0.2 Von [V] Typ. input current IIN = f(VIN); Vbb = 24 V IIN [A] 90 80 70 60 -25C 25C 98% 125C 50 40 0.15 30 0.1 0.05 0 -50 -25 0 25 50 75 100 125 20 10 0 0 5 10 15 20 25 Tj [C] VIN [V] Semiconductor Group Page 4 20.06.96 BSP 550 Typ. overload current IL(lim) = f (t), Vbb=24V, no heatsink, Param.:Tjstart IL(lim) [A] Typ. operating current IGND = f (Tj), Vbb=30V, VIN=high IGND [mA] 1 3 2.5 0.8 2 0.6 1.5 125C -25C 0.4 1 0.2 0.5 0 -2 0 2 4 6 8 10 12 14 16 18 t [ms] 0 -25 0 25 50 75 100 125 Tj [C] Short circuit current IL(SC) = f (Tj);Vbb = 30 V; IL(SC) [] 3 Typ. standby current Ibb(off) = f(Tj); Vbb = 30 V, VIN = low Ibb(off) [A] 7 2,5 6 5 2 4 1,5 3 1 2 0,5 1 0 -25 0 0 25 50 75 100 125 -25 0 25 50 75 100 125 150 Tj [C] Tj [C] Semiconductor Group Page 5 20.06.96 BSP 550 Typ. input turn on voltage threshold VIN(T+) = f (Tj) VIN(T+) [V] 3 18V Test circuit 2.5 2 30V 1.5 1 0.5 0 -25 0 25 50 75 100 125 Tj [C] Typ. on-state resistance (Vbb-Pin to OUT-Pin) RON = f (Vbb); IL = 1.0A, Tj = 25 C; RON [m] 160 140 120 100 80 60 40 20 0 0 5 10 15 20 25 30 35 40 45 Vbb [V] Semiconductor Group Page 6 20.06.96 BSP 550 Package: all dimensions in mm. SOT 223/4: Edition 7.97 Published by Siemens AG, Bereich Halbleiter Vetrieb, Werbung, Balanstrae 73, 81541 Munchen (c) Siemens AG 1997 All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes a type of component and shall not be considered as warranted characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Siemens Office, Semiconductor Group. Siemens AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! 1 Critical components of the Semiconductor Group of Siemens AG, may only be used in life-support devices or 2 systems with the express written approval of the Semiconductor Group of Siemens AG. 1) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain and/or protecf human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Semiconductor Group Page 7 20.06.96 |
Price & Availability of BSP550
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |