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BUZ16 B3713 BUZ16 MT9041BP STBN5XX D1416 ULH200 MMSZ5258
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  Datasheet File OCR Text:
 (R)
Thermal Data
DIP 24
24 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cmC 0.01 W/cmC
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 m
molding compound
3 mm
0.0063W/cmC
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size
February 1998
1/2
Thermal Data
DIP 24
Rth(j-a) (C/W) 85
copper frame thickness = 0.25 mm die pad = 150 x 280 sq.mils die size = 10.000 sq.mils
1)
80
75
70
floating in air
65
60
mounted on board
55 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 dissipated power ( Watt ) 2 2.2 2.4 2.6 2.8 3
Transient Thermal Resistance (C/W) 100
copper frame thickness = 0.25 mm die pad = 110 x 280 sq.mils
50 30 20
2)
10
on die dissipating area = 2000 sq.mils mounted on board pd = 2 Watt
5 3 2
1 0.001
0.01
0.1
1 10 Time or pulse width ( s )
100
1,000
2/2


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