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Features
n n n n n n n n n n
Operating frequency range 10 MHz to 15 MHz RF interface optimized for 13.56 MHz operation Laser programmed memory array (64 data bit + 16 CRC bit) Modulator switch designed to preserve supply voltage Miller coding Default data rate is 26484 Baud Other data rates possible (mask programmable) On chip rectifier On chip resonant capacitor On chip supply buffer capacitor
EM MICROELECTRONIC-MARIN SA
L
H4006
13.56 MHz 64 Data bit Read Only Contactless Identification Device
Typical Operating Configuration
C1
H4006
C2
L: typical 1.4 H for fo = 13.56 MHz
Figure 1
Description
The H4006 is a CMOS integrated circuit intended for use in electronic Read Only transponders. The exited coil connected to the device generates the power supply via a Graetz bridge and an integrated decoupling capacitor. The clock used for the logic is also extracted from the coil. The logic is mainly composed by a miller code generator and the LROM control. The memory is factory programmed so that each IC is unique.
Pad Assignment
TESTn TOUT VDD C2 VSS C1
H4006
Applications n Logistics automation n Anticounterfeiting n Access control n Industrial transponder
Figure 2
1
Absolute Maximum Ratings
Parameter Maximum DC Current forced on COIL1 and COIL2 Power Supply
Storage Temperature
Electrostatic discharge maximum to MIL-STD-883C method 3015
EM MICROELECTRONIC-MARIN SA
Symbol I CMAX VDD Tst Conditions 30mA Parameter Operating Temp. Maximum Coil Current -0.3V to 7.5V -55 to +200C 2000V AC Voltage on Coil VESD Supply Frequency
H4006
Typ. Max. +85 10 14* 13.56 15 Units C mA Vpp MHz -10 3 10
Operating Conditions
Symbol Min. Top -40 Icoil
Vcoil fcoil
Table 1 Stresses above these listed maximum ratings may cause permanent damage to the device. Exposure beyond specified operating conditions may affect device reliability or cause malfunction.
Table 2 *) The AC Voltage on Coil is limited by the on chip voltage limitation circuitry. This is according to the parameter Icoil.
Handling Procedures
This device has built-in protection against high static voltages or electric fields; however due to the unique properties of this device, anti-static precautions should be taken as for any other CMOS component.
System Principle
Transceiver Transponder
Oscillator
Antenna Driver
C1
H4006
Data Decoder Filter & Gain Demodulator C2
Data received from transponder
Signal on Transponder coil
Signals on coils
Signal on Transceiver coil
RF Carrier
Data
Figure 3
2
Electrical Characteristics
V DD = 2V, VSS = 0V, fC1 = 13.56MHz sine wave, VC1 = 1.0Vpp centered at (V DD - V SS)/2, Ta = 25C unless otherwise specified Parameter Symbol Test Conditions Min. Typ. Max.
Supply Voltage Supply current VDD I DD 1.9
1)
Rectifier Voltage Drop Modulator ON DC voltage drop 2) Power on reset
3)
EM MICROELECTRONIC-MARIN SA
VREC VON1 VON2 I C1C2 = 1mA, modulator switch on VREC = (V C1-VC2) - (VDD - V SS) I VDD VSS = 1mA I VDD VSS = 10mA 1.9 2.4 1.2 0.1 Vcoil=100mVRMS f=10kHz 92.6 VR VR - V MIN C RES RS C sup
H4006
Units
V A V V V V V pF pF Table 3
60
150 1.8
2.3 2.8 1.4 0.25 94.5 3 140
2.8 3.3 1.7 0.5 96.4
Coil1 - Coil2 Capacitance Series resistance of CRES Power Supply Capacitor
1) 2)
Maximum voltage is defined by forcing 10 mA on C1 - C2 Measured between VDD and VSS 3) According to Figure 7
Block Diagram
Clock extractor Divider Chain Sequencer
Miller Code Generator
VDD C1
CRES AC1 + CSUP -
HF Rectifier
AC2
Modulator VSS Power Management
Power on Reset
LASER ROM
C2
Figure 4
3
General description
The transponder will be activated when illuminated by a RF field of sufficient power and at any frequency that is compatible with its associated antenna and its internal power supply circuit input characteristics. The chip will Poweron-Reset itself when powered by this incoming energy that exceeds its reset threshold. After resetting itself the chip will start to transmit its memory contents as a stream of Miller code. The memory contents is transmitted by modifying the antenna matching impedance at its internal clock rate, thereby causing varying amounts of RF energy to be reflected from the antenna. This impedance variation will be achieved by connecting a modulating device across the antenna terminals. When switched on the modulating device will present a low impedance to the antenna. This will cause a change in the matching of the antenna and therefore in the amount of RF energy reflected by the transponder to the reader. This reflected signal combines with the transmitted signal in the receiver to yield an amplitude modulated signal representative of the IC memory contents. The "ON" impedance of the modulating device needs to be comparable to about 100 Ohms to affect the matching of the antenna and therefore its reflectivity. The RF signal received from the transponder antenna will serve several purposes : * power the chip * provide a global reset to the chip through its POR (Power-On-Reset) function * provide a carrier for the data transmission * provide the input of the internal clock generation circuit (frequency division)
EM MICROELECTRONIC-MARIN SA
H4006
Functional description
Output Sequence Transmission from the transponder will be accomplished through variation of the antenna load impedance by switching the modulating device ON and OFF. Output sequence is composed of cycles which are repeated. Each cycle is composed of 82 bits Standard Message Structure (STDMS) which is Miller coded and a pause (LW) during which the modulating device is OFF (see figure 6 for details of Miller code). The pause (LW) is 9bits length. The 82 bit STDMS consists of 1 start bit, 64 data bits, 16 CRC bits and 1 stop bit.
Start bit (1) Data(64) CRC (16) Stop bit (1) LW(9)
Table 4 Memory organisation As already mentioned above the 82 bits are stored in laser programmed ROM (LROM). The 82 bits of this LROM is partioned as followed (see table 5): Wafer Number Factory reserved IC name Customer ID Extended lot number IC position Cyclic redundancy check Start and stop bits First bit sent is bit 0. 5 bits 4 bits 10 bits 13 bits 18 bits 14 bits 16 bits 2 bits
4
Memory Map
0 1 2 3 4 5 start Wafer Number 6 7 8 9 Factory Reserved 10 20 33 51 65 11 21 34 52 66 12 22 35 53 67
EM MICROELECTRONIC-MARIN SA
13 23 36 54 68 14 15 16 IC Name 24 37 55 69 17 18 28 19 29 25 26 27 Customer ID 38 56 39 30 31 32 45 63 77 46 64 78 79 80 47 48
H4006
40 41 42 43 44 Extended lot number 60 61 62 76
49
50
57 58 59 IC position
70 71 72 73 74 75 Cyclic redundancy check
81 stop Table 5
Wafer number Each wafer has a number between 1 and 25. This 5 bit wafer number contains the wafer number where the IC was. Factory reserved bits These 4 bits are reserved. Default value is 0hex. IC name bits They contains the 3 first characters device name. For this device, the value is 006hex. Customer ID bits This field contains a code which is defined by EM Microelectronic-Marin S.A. For standard version, the code is 0001hex. Extended lot number The code on the chips is unique and reflects the production lot number system of EM Microelectronic. This numbering allows full traceability of each chip.
IC position These 14 bits give the precise position on the processed wafer. Cyclic redundancy check The shift register is reset to all zero with each Stop Bit. CRC code is calculated on 64 data bits. The CRC code is calculated according to CCITT / ISO 3309 - 1984 standarts. See figure 5 for principle block schematic and generating polynomial of the CRC code. Start and stop bits Start bit is set to logic 1 and stop bit is set to logic 0.
5
CRC Block Diagram
EM MICROELECTRONIC-MARIN SA
SERIAL QUOTIENT
H4006
X5
X12
X16
FEEDBACK BEFORE SHIFT
15 14 13 12 11 MSB
10
9
8
7
6
5
4
3
2
1
0 LSB
BCC REGISTER
x
= BCC(Block Check Characters) REGISTER STAGE data input = EXCLUSIVE - OR
CRC-CCITT GENERATING POLYNOMIAL = X16 + X12 + X5 + X0
Figure 5
6
RF Interface Resonant capacitor, Rectifier, Limiter and Modulator Switch form the unit which is interfacing to the incoming RF signal. These blocks are interdependent so they are developed as unit. They interface to the antenna which typical characteristics are: Ls 1400 nH Rs 3 Ohms 30 < Q < 40 at 13.56 MHz.
EM MICROELECTRONIC-MARIN SA
H4006
Resonant Capacitor The capacitor value is adjusted by laser fusing. It can be trimmed in factory by 1pF steps to achieve the absolute value of 94.5pF typically. This option, which is available on request, allows a smaller capacitor tolerance over the whole production. Rectifier and Limiter A full wave rectifier (Graetz Bridge) is used to provide supply voltage to the IC. The reverse breakdown of the diodes is also used to protect the IC from overvoltages.
Modulator Switch Due to the low impedance of the antenna and resonant capacitor the Modulator Switch has to present low RF impedance when switched ON (about 100 ohms). The minimum time period with the Modulator Switch ON is 38 s. At lower data rates this time is even much longer. The current consumption of divider chain running at 13 MHz is near 60 A. Putting together this two figures it is clear that it is not possible to supply the IC during the time the Modulator Switch is ON from the integrated Supply Buffer Capacitor which value is approximately 140 pF. The IC has to get power from the RF field also during the time the Modulator Switch is ON. This problem is solved by putting the Modulator Switch on the output of the Rectifier (between VDD and VSS) and regulating its ON resistance in function of supply voltage. When the supply voltage is high the ON impedance is low. When the supply voltage drops near the region where the operation of the IC at 13.56 MHz is not guaranteed the ON impedance is increased in order to prevent further drop.
1
0
1
1
0
0
0
1
1
0
1
NRZ-L STREAM
DM-M CODED
Bit i-1 Bit i x 1 0 0 1 0
no transition at the beginning of Bit i, transition at the beginning of Bit i, no transition at the beginning of Bit i,
transition in the middle of Bit i no transition in the middle of Bit i no transition in the middle of Bit i Figure 6
7
Power Supply Management For a correct operation, the device must be initialised. When the transponder is put in the RF field, the supply voltage increases until it achieves Vr limit (see Figure 7). During this time and for an additionnal 64 bit period, the modulator switch is on and the device initialises its internal logic.
supply voltage VDD
EM MICROELECTRONIC-MARIN SA
chip operating voltage range : from Vmin to Vmax
H4006
At this point, the data transmission starts and runs while the supply voltage is higher than Vmin. If the supply voltage decreases under this limit, the device is again in an initialising state and the modulator is on.
Vmax (voltage clipping)
chip on board supply voltage
Vr (Read wake up) Vmin
time modulator ON/OFF ON
64 bits period
READ
OFF
time
Figure 7
8
Miller Encoder The input to Miller encoder is NRZ data coming from LROM. The output is coded according to Miller format and is driving the modulator Switch. See figure 6 for example of Miller code.
Clock Generation The clock of the logic is extracted from the RF signal. The clock extracted from RF signal is driving the divider chain consisting of toggle flipflops. The output of this divider chain is data clock with which the data from Laser ROM (LROM) is addressed, encoded and sent to Modulator Switch. The layout of divider chain is designed in a way that different data rates can be chosen with metal mask (options). The following division factors are possible on request: LDB
EM MICROELECTRONIC-MARIN SA
H4006
128, 256, 1024, 2048, 4094 and 8192. The standard is 512. Others As mentioned in Output Sequence, during the pause (LW) the Modulator Switch is OFF. When observing the pause duration one has to remember that the time with Modulator Switch OFF effectively observed can vary due to different terminations of STDMS. The stop bit at 0 can be represented either by Modulator Switch ON or OFF depending on the data. The start bit at 1 adds 1/2 of data period OFF (transition in the middle of bit period). Figure below show the four possible terminations of STDMS and its influence on entire period passed by Modulator Switch OFF. Level LOW represents Modulator Switch OFF. LDB stands for last data bit.
1 1 0 0
Last data bit Stop bit at 0 Pause 8 +1 bit periods This transition is not due to Miller encoding. Figure 8 Start bit at 1
Pad Description
Name C2 C1 VDD Tout TESTn VSS Description connection to antenna connection to antenna positive supply test output test input with pull up negative supply Table 6
9
Pad position
137 160 VSS
141
TESTn TOUT
VDD
TOP VIEW
H4006
40.2
1600
60.2
C1 317 150 1041
C2
MARKING AREA
150
Dimensions in m
R0.50.1
PCB package
4.0 mm 1.0 mm max.
0.5 0.12
Coil2
1.3 0.05
Coil1
1.3 0.05 0.40.1
8.0 mm
EM
Dimensions in mm
Ordering Information
Coil2
Dimensions in mm
Coil1
The H4006 is available in : - Chip form * H4006 501 IC - CIDpack H4006 501 CID - PCB package H4006 501 COB *Chip will be delivered in wafer form. Thickness of the wafer: 180 m 20 m (7 mils)
EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the specifications without notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up to date version. (c) 1997 EM Microelectronic-Marin SA, 01/98 Rev. A/194
8.50.3
0.1270.012
EM MICROELECTRONIC-MARIN SA
CID package
339 189 259
H4006
0.4850.015
FRONT VIEW
10
EM MICROELECTRONIC-MARIN SA
CH-2074 Marin, Switzerland Tel. +41 32 755 51 11, Fax. +41 32 755 5403

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