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HFA3765
AGC and Quadrature IF Demodulator
Description
The HFA3765 is a monolithic quadrature demodulator and a gain control amplifier stage with 90dB of dynamic range for CDMA/AMPS cellular applications. Two amplifier inputs are provided for interfacing different IF input filters. A local oscillator input requires low drive levels and a divide by two phase shifter with duty cycle compensation achieves excellent phase and amplitude balance properties. The HFA3765 is one of the four chips in the PRISMTM chip set and is housed in a 28 lead SSOP package ideally suited to cellular handset applications.
PRELIMINARY
February 1998
Features DescriptionIF Operation10MHz to 250MHz
* I/Q Amplitude and Phase Balance . . 0.5dB, 2 Degrees * Voltage Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>60dB * AGC Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90dB * Output P1dB With 20pF Load . . . . . . . . . . . . . . . 2.5VPP * Low LO Drive Level . . . . . . . . . . . . . . . . . . . . . . -10dBm * Power Enable/Disable Control * Single Supply Battery Operation . . . . . . . . . 2.7 to 3.3V
Ordering Information
PART NUMBER HFA3765IA HFA3765IA96 TEMP. RANGE ( oC) -40 to 85 -40 to 85 PACKAGE 28 Ld SSOP Tape and Reel PKG. NO. M28.15
Applications
* IS-95A CDMA/AMPS Dual Mode Handsets * Wideband CDMA Handsets * Full Duplex Transceivers * CDMA/TDMA Packet Protocol Radios
Pinout
HFA3765 (SSOP) TOP VIEW
BYP+ 1 IF_CDMA+ 2 IF_CDMA- 3 GND 4 IF_FM+ 5 IF_FM- 6 BYP- 7 AGC_CTRL 8 SEL 9 RX_PE 10 GND 11 GND_LO 12 V+_LO 13 LO_IN 14 28 V+_AGC 27 IF_OUT+ 26 IF_OUT-
PRISMTM and the PRISMTM logo are trademarks of Intersil Corporation.
Simplified Block Diagram
DEMOD+ IFOUTDEMODIFOUT+
24 GND_AGC 23 DEMOD22 DEMOD+ 21 V+_AMP 20 QOUT+ 19 QOUT18 GND 17 IOUT+ 16 IOUT15 GND_AMP
CDMA FM IF INPUT / FM
CDMA IF INPUT
25 GND
SEL
/2
0o/ 90o
BIAS NETWORK
AGC_CTRL
LO_IN
RX_PE
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002. All Rights Reserved 1
File Number
4300.3
Q OUTPUT
SW
I OUTPUT
HFA3765 Pin Descriptions
PIN NUMBER 1 2 NAME BYP+ IF_CDMA+ DESCRIPTION DC feedback pin for the AGC amplifier. Requires good RF decoupling to a solid ground. Non-inverting analog input of the AGC amplifier, CDMA channel.Requires a DC blocking capacitor. A parallel differential DC coupled resistor setting the input impedance with its complementary input is possible. Inverting analog input of the AGC amplifier, CDMA channel. Requires a DC blocking capacitor. A parallel differential DC coupled resistor setting the input impedance with its complementary input is possible. AC couple to ground if the port is to be used single ended. Ground. Connect to a solid ground plane. Non-inverting analog input of the AGC amplifier, FM channel. Requires a DC blocking capacitor. A parallel differential DC coupled resistor setting the input impedance with its complementary input is possible. Inverting analog input of the AGC amplifier, FM channel. Requires a DC blocking capacitor. A parallel differential DC coupled resistor setting the input impedance with its complementary input is possible. AC couple to ground if the port is to be used single ended. DC feedback pin for the AGC amplifier. Require good RF decoupling to a solid ground. AGC current control input. Requires a 15K 1% series resistor. Selects the CDMA or FM AGC Amplifier differential input. HIGH selects the CDMA input; LOW selects the FM input. Power enable control input. HIGH for normal operation. LOW for power down. Ground. Connect to a solid ground plane. LO_IN input ground return. Ground to Local Oscillator ground plane or transmission line. LO divider network Power Supply. Use high quality RF decoupling capacitors at the pin. Current input from the Local Oscillator. Use a 50 power to current converter. See applications diagram. Requires a DC blocking capacitor. IF output amplifiers ground return. Negative I channel baseband output. Requires a DC blocking capacitor. Positive I channel baseband output. Requires a DC blocking capacitor. Ground. Connect to a solid ground plane. Negative Q channel baseband output. Requires a DC blocking capacitor. Positive Q channel baseband output. Requires a DC blocking capacitor. IF output amplifier Power Supply. Use high quality RF decoupling capacitors at the pin. Positive input of the quadrature demodulator. Requires a DC blocking capacitor. Negative input of the quadrature demodulator. Requires a DC blocking capacitor. AGC amplifier main ground return. Ground. Connect to a solid ground plane. Negative output from the AGC amplifier. Requires a DC blocking capacitor. Positive output from the AGC amplifier. Requires a DC blocking capacitor. AGC amplifier Power Supply. Use high quality RF decoupling capacitors at the pin.
3
IF_CDMA-
4 5
GND IF_FM+
6
IF_FM-
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
BYP AGC_CTRL SEL RX_PE GND GND_LO V+_LO LO_IN GND_AMP IOUTIOUT+ GND QOUTQOUT+ V+_AMP DEMOD+ DEMOD GND_AGC GND IF_OUTIF_OUT+ V+_AGC
HFA3765
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V Voltage on Any Other Pin . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Thermal Information
Thermal Resistance (Typical, Note 1) JA ( oC/W) SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . -65oC TA 150oC Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC (Lead Tips Only)
Operating Conditions
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7 to 3.3V Temperature Range . . . . . . . . . . . . . . . . . . . . . . -40oC TA 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
(NOTE 2) TEST LEVEL B B B A A A B To 1dB Settling B A A 500 in, 5000 Differential load. AGC_CTRL set for 48 0.2dB of powergain (CDMA and FM mode) A A B B A A 500 in, 5000 load AGC_CTRL set for 38 0.2dB of powergain (CDMA and FM mode) 500 in, 5000 load AGC_CTRL set for 28 0.2dB of powergain (CDMA and FM mode) 500 in, 5000 load AGC_CTRL set for 18 0.2dB of powergain (CDMA and FM mode) B B B B B B B B B B B B
PARAMETER IF Frequency Range Baseband Frequency Range LO Frequency Range AGC Gain Control Voltage Range AGC Gain Control Sensitivity AGC Gain Control Slope Change Insertion Phase vs AGC Gain Switching Speed, Full Scale Amplitude Balance (Note 3) Phase Balance (Note 3) Power Gain Voltage Gain Noise Figure (CDMA, SEL = HIGH) Noise Figure (FM, SEL = LOW) IP3, Output P1dB Output Voltage Gain Noise Figure IP3, Output P1dB Output Voltage Gain Noise Figure IP3, Output P1dB Output Voltage Gain Noise Figure IP3, Output P1dB Output
TEST CONDITIONS
TEMP (oC) Full Full Full Full 25 25 25 25 Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full
MIN 10 0 20 0.5 -0.5 -2 0.5 -10 -
TYP 85 170 60 1.2:1 0.1 TBD 0 0 48 58 6.6 6.9 4.8 -5 48 8.4 4.4 -6 38 11 3.2 -8 28 14 -1.0 -11
MAX 250 1 500 2.4 3:1 10 0.5 +2 7.5 8.0
-
UNITS MHz MHz MHz V dB/V deg/dB s dB Degrees dB dB dB dB dBm dBm dB dB dBm dBm dB dB dBm dBm dB dB dBm dBm
OVERALL CASCADED SPECIFICATIONS, VCC = 2.7V, IF_IN = Differential - 60dBm or higher at 85MHz
-
-
-
-
HFA3765
Electrical Specifications
(Continued) (NOTE 2) TEST LEVEL B B B B 500 in, 5000 load AGC_CTRL set for -2 0.2dB of powergain (CDMA and FM mode) 500 in, 5000 load AGC_CTRL set for -12 0.2dB of powergain (CDMA and FM mode) 500 in, 5000 load AGC_CTRL set for -25 0.2dB of powergain (CDMA and FM mode) Single end Applications diagram B B B B A B A A A B A A C A B B B B Measured single end Set externally B B C C A VCC = 3.3V VCC = 3.3V A A B A A VIH = 2.0V, VCC = 3.3V VIL = 0.66V, VCC = 2.7V NOTES: 2. A = Production Tested, B = Based on Characterization, C = By Design 3. A positive frequency offset from the carrier produces the I channel leading the Q channel by 90 degrees. A A
PARAMETER Voltage Gain Noise Figure IP3, Output P1dB Output Voltage Gain Noise Figure IP3, Output P1dB Output Voltage Gain Noise Figure IP3, Output P1dB Output Voltage Gain Noise Figure IP3, Output P1dB Output LO Current Input Impedance LO Drive Level LO Drive Optimal Current Range Baseband Differential Load Resistance Baseband Single ended Load Capacitance Baseband Differential Load Capacitance Single end Input Impedance CDMA or FM AGC Gain Control Input Impedance AGC Amp Output Differential Impedance
TEST CONDITIONS 500 in, 5000 load AGC_CTRL set for 8 0.2dB of powergain (CDMA and FM mode)
TEMP (oC) Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full 25 25 25 Full Full Full 25 25 25 25 Full Full Full 25 Full Full Full Full
MIN -26 -36 -38 -48 50 15K 2.7 2.0 -50 -50
TYP 18 20 -7.2 -17 8 28 -15.2 -25 -2 37 -24.2 -33 -15 48 -35.2 -46 130 -10 200 5000 1500 3300 80 28 1 -
MAX -
UNITS dB dB dBm dBm dB dB dBm dBm dB dB dBm dBm dB dB dBm dBm dBm A pF pF V mA A s V V A A
-
-
-
300 20 10 3.3 100 10 0.2*V CC +50 +50
Differential Input Impedance CDMA or FM Measured differential
POWER SUPPLY AND LOGIC SPECIFICATIONS Supply Voltage Range Total Supply Current Power Down Supply Current Power Up/Down Speed RX_PE and SEL VIL RX_PE and SEL VIH RXPE and SEL Input Bias Current
Typical Applications Diagram
SAWTEK 855292 220n
1000p 1 BYP+ 560 + IF_CDMA GND + 1000p 1000p 0.01 680 IF_FM BYPAGC_CTRL SEL 0.01 RX_PE GND 0.03 100p 220 GND_LO V+_LO LO_IN QOUT V+_AGC IFOUT+ IFOUTGND
1000p
CDMA IF
22.7p 220n 220n 4.1p
FM IF
820n MURATA SX0439A 15K
1000p 1000p
GND_AGC DEMOD + V+_AMP + GND + IOUT -
1000p 0.1
AGC_CTRL
10p SEL
0.1
Q+ Q0.1 0.1
PE
0o/90o /2
I+ I0.1
GND_AMP
1000p
HFA3765
56
BEAD 0.1
IF_LO_INPUT VCC
HFA3765 Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 h x 45o L GAUGE PLANE 0.25(0.010) M BM
M28.15
28 LEAD SHRINK NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C D E
A2 C 0.10(0.004) BS
MILLIMETERS MIN 1.35 0.10 0.20 0.18 9.81 3.81 5.80 0.26 0.41 28 8o 0o 8o MAX 1.75 0.25 1.54 0.30 0.25 10.00 3.98 6.19 0.49 1.27 NOTES 9 3 4 5 6 7 Rev. 0 2/95
MIN 0.053 0.004 0.008 0.007 0.386 0.150 0.228 0.0099 0.016 28 0o
MAX 0.069 0.010 0.061 0.012 0.010 0.394 0.157 0.244 0.0196 0.050
e
B 0.17(0.007) M C A M
A1
e H h L N
0.025 BSC
0.635 BSC
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm (0.004 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact.

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