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| Surface Mount Chip LEDs Technical Data HSMF-C155/C156/C157 Features Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -30C to +85C * Three Color Combinations Available: Red/Green, Yellow/Green, and Orange/Green. * Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels * * * * * Description The HSMF-C15x series of bicolor chip-type LEDs is designed in an industry standard package for ease of handling and use. These bicolor LEDs are available as high efficiency red/green, yellow/ green and orange/green. The HSMF-C15x has the widely used 3.2 x 2.7 mm footprint and wide viewing angle make this LED exceptional for backlighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel indicators especially where space is a premium. Applications * * * * Push-Button Backlighting Symbol Backlighting Status Indicator Front Panel Indicator Device Selection Guide Part Number HSMF-C155 HSMF-C156 HSMF-C157 Color Combinations High Efficiency Red/Green Yellow/Green Orange/Green Parts Per Reel 3000 3000 3000 2 Package Dimensions LED DIE CATHODE MARK 1 2 1.4 (0.055) 2.7 (0.106) 3 4 3.2 (0.126 ) 0.60 (0.024) DIFFUSED EPOXY 2.00 (0.079) PART NUMBER POLARITY 1.10 (0.043) HSMF-C-155 1 2 4 GREEN RED HSMF-C-156 GREEN YELLOW HSMF-C-157 GREEN ORANGE PC BOARD 0.50 (0.020) 0.55 (0.022) R 0.25 (0.010) TYP. 0.55 (0.022) 3 POSITION OF COLOR SOURCE ON DEVICE SOLDERING TERMINAL 1.10 (0.043) 0.40 (0.016) 4 - 0.05 (0.002) MAX. CATHODE LINE NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. HSMF-C155/C156/C157 3 Absolute Maximum Ratings at TA=25C Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMF-C155/C156/C157 Units 25 mA 100 mA 65 mW 5 V 95 C -30 to +85 C -40 to +85 C See IR soldering profile (Figure 6) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Optical Characteristics at TA=25C Color HER Orange Yellow Green Luminous Intensity[1] Iv(mcd) @ 20mA Min. Typ. 2.50 10.0 2.50 8.0 2.50 8.0 4.00 15.0 Peak Wavelength peak(nm) Typ. 630 605 589 570 Dominant Wavelength d(nm) Typ. 626 604 586 572 Viewing Angle 2 1/2 Degrees[2] Typ. 170 170 170 170 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25C Color HER Orange Yellow Green Forward Voltage VF(V) @ IF= 20 mA Typ. Max. 2.1 2.6 2.2 2.6 2.1 2.6 2.2 2.6 Reverse Capacitance Breakdown VR(V) C(pF) @ IR = 100 A @ VF = 0, f = 1Mhz Min. Typ. 5 5 5 7 5 6 5 9 Thermal Resistance R J-P (C/W) Typ. 325 325 325 325 Note: The bicolor package contains two individual light sources of different color. The specifications above refer to each color of a particular package. 4 Color Bin Limits Green Color Bins[1] Bin ID A B C D E Dom. Wavelength (nm) Min. Max. 561.5 564.5 567.5 570.5 573.5 564.5 567.5 570.5 573.5 576.5 Orange Color Bins[1] Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 597.0 600.0 603.0 606.0 609.0 612.0 600.0 603.0 606.0 609.0 612.0 615.0 Yellow/Amber Color Bins[1] Bin ID A B C D H J Dom. Wavelength (nm) Min. Max. 582.0 584.5 587.0 589.5 592.0 594.5 584.5 587.0 589.5 592.0 594.5 597.0 Tolerance: 0.5 nm Tolerance: 1 nm Tolerance: 0.5 nm Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M Intensity (mcd) Min. Max. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Bin ID N P Q R S T U V W X Y Intensity (mcd) Min. Max. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Tolerance: 15% 1.0 GREEN RELATIVE INTENSITY YELLOW 0.5 ORANGE HER 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength. 5 100 IF - FORWARD CURRENT - mA 1.6 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) HER 10 GREEN 1.2 0.8 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 2.3 0.4 0 0 10 20 30 40 VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA Figure 2. Forward Current vs. Forward Voltage. Figure 3. Luminous Intensity vs. Forward Current (All Colors). IF MAX. - MAXIMUM FORWARD CURRENT - mA 35 RELATIVE INTENSITY - % 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 30 25 20 15 10 5 0 0 20 40 60 80 100 RJ-A = 600C/W RJ-A = 800C/W 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C ANGLE Figure 4. Maximum Forward Current vs. Ambient Temperature. Figure 5. Relative Intensity vs. Angle for HSMx-C155, C156 and C157. 10 to 20 SEC. 217 C TEMPERATURE 255 C (+5/-0) 3 C/SEC. MAX. 1.0 (0.039) 6 C/SEC. MAX. 140 - 160 C 0.4 (0.016) MAX. 120 SEC. 60 to 150 SEC. 1.0 (0.039) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX. Note: 1. All dimensions in millimeters (inches). Figure 6. Recommended Pb Free Reflow Soldering Profile. Figure 7. Recommended Solder Pad Pattern. 6 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling Orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.) O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Note: All dimensions in millimeters (inches). Figure 9. Reel Dimensions. 7 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.40 (0.055) HSMF-C15x SERIES 3.52 (0.139) 3.02 (0.119) Figure 10. Tape Dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2003 Agilent Technologies, Inc. Obsoletes 5988-6268EN October 28, 2003 5988-7414EN |
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