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 HVD369B
Variable Capacitance Diode for VCO
REJ03G0502-0100 (Previous: ADE-208-850) Rev.1.00 Jan 24, 2005
Features
* * * * Low capacitance and to be usable at GHz. High capacitance ratio. (n = 2.3 min) Low series resistance. (rs = 0.5 max) Super small Flat Lead Package (SFP) is suitable for surface mount design.
Ordering Information
Type No. HVD369B Laser Mark D Renesas Code PUSF0002ZB-A Previous Code SFP
Pin Arrangement
Cathode mark Mark 1
D
2 1. Cathode 2. Anode
Rev.1.00 Jan 24, 2005 page 1 of 4
HVD369B
Absolute Maximum Ratings
(Ta = 25C)
Item Reverse voltage Junction temperature Storage temperature Symbol VR Tj Tstg Value 15 125 -55 to +125 Unit V C C
Electrical Characteristics
(Ta = 25C)
Item Reverse current Capacitance Capacitance ratio Symbol IR1 IR2 C1 C4 n Min -- -- 4.65 1.85 2.3 Typ -- -- -- -- -- Max 10 100 5.15 2.15 -- Unit nA pF -- Test Condition VR =15 V VR = 15 V, Ta = 60C VR = 1 V, f = 1 MHz VR = 4 V, f = 1 MHz C1 / C4
Series resistance rS -- -- 0.5 VR = 1 V, f = 470 MHz Note: Please do not use the soldering iron due to avoid high stress to the SFP package.
Rev.1.00 Jan 24, 2005 page 2 of 4
HVD369B
Main Characteristic
10-10 12 f=1MHz 10 10-11
Reverse current IR (A)
Capacitance C (pF)
0 8 12 16
8
10-12
6
4
10
-13
2
10-14
4
20
0 0.1
1.0 Reverse voltage VR (V)
10
Reverse voltage VR (V) Fig.1 Reverse current vs. Reverse voltage
Fig.2 Capacitance vs. Reverse voltage
0.6 f=470MHz 0.5
0
LF = (LogC)/(LogVR)
Series resistance rS ()
0.4
-0.5
0.3
0.2
-1.0
0.1 0 0.1 -1.5 0.1
1.0 Reverse voltage VR (V)
10
1.0 Reverse voltage VR (V)
5.0
Fig.3 Series resistance vs. Reverse voltage
Fig.4 Linearity factor vs. Reverse voltage
Rev.1.00 Jan 24, 2005 page 3 of 4
HVD369B
Package Dimensions
JEITA Package Code RENESAS Code PUSF0002ZB-A Previous Code SFP / SFPV MASS[Typ.] 0.0010g
D b
E
HE
c
A
b
e1
Reference Symbol
Dimension in Millimeters
Pattern of terminal position areas
A b c D E HE b e1
Min 0.50 0.25 0.08 0.55 0.90 1.30
Nom 0.30 0.13 0.60 1.00 1.40 0.50 1.40
Max 0.55 0.35 0.18 0.65 1.10 1.50
Rev.1.00 Jan 24, 2005 page 4 of 4
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 2.0


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