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| MQFP-ED Exposed Drop-in Heat Slug Metric Quad Flat Pack * 14 x 20mm to 32 x 32mm * 100 to 240 lead count * Lead pitch range from 0.80mm to 0.50mm FEATURES * Body Sizes: 14 x 20mm to 32 x 32mm * Package Height: 3.4mm * Lead Counts: 100L to 240L * Lead Pitch: 0.80mm to 0.50mm * JEDEC standard compliant * Lead-free and Green material sets available DESCRIPTION STATS ChipPAC's Exposed Drop-In Heat Slug Metric Quad Flat Pack (MQFP-ED) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by adding a drop-in exposed anodized aluminum heat spreader during the molding process, using a standard leadframe. MQFP-ED typically has 60% higher thermal performance over the standard MQFP and the QFP-d for higher power applications. APPLICATIONS * ASIC * DSP * FPGA * PLD * Logic, microprocessors / controllers * High speed logic, high power microprocessors * 3D graphics, telecom, wireless, audio, CPU / GUI www.statschippac.com MQFP-ED Exposed Drop-in Heat Slug Metric Quad Flat Pack SPECIFICATIONS Die Thickness Gold Wire Lead Finish Marking Packing Options 380-560m (15-22mils) range preferred 25/30m (1.0/1.2mils) diameter, 99.999% Au 85/15 Sn/Pb or Matte Tin Laser / ink JEDEC tray / tape and reel RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temperature Storage Pressure Cooker Test Liquid Thermal Shock (opt) JEDEC Level 3 -65C/150C, 1000 cycles 150C, 500 hrs 121C 100% RH, 2 atm, 168 hrs -55C/125C, 1000 cycles THERMAL PERFORMANCE, ja (C/W) Package 208L Body Size (mm) 28 x 28 x 3.4 Pad Size (mm) 14.0 x 14.0 Die Size (mm) 10.2 x 10.2 Thermal Performance, ja (C/W) 14.9 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2. ELECTRICAL PERFORMANCE Package 208L Body Size (mm) 28 x 28 x 3.4 Pad Size (mm) 10.5 x 10.5 Frequency 100MHz Self Inductance (nH) 11.6~14.7 Self Capacitance (pF) 1.43~1.56 Notes: *Results are simulated. Data is available through 2.5GHz. CROSS-SECTION PACKAGE CONFIGURATIONS Package Size (mm) 14 x 20 28 x 28* 32 x 32 Lead Count 100, 128 128, 144, 160, 208 160, 240 Note: *Cavity down configuation available. Corporate Office Global Offices 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-43-351-3320 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. (c)Copyright 2005. STATS ChipPAC Ltd. All rights reserved. January 2005 |
Price & Availability of MQFP-ED
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