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NLAST4599 Low Voltage Single Supply SPDT Analog Switch The NLAST4599 is an advanced high speed CMOS single pole - double throw analog switch fabricated with silicon gate CMOS technology. It achieves high speed propagation delays and low ON resistances while maintaining low power dissipation. This switch controls analog and digital voltages that may vary across the full power-supply range (from VCC to GND). The device has been designed so the ON resistance (RON) is much lower and more linear over input voltage than RON of typical CMOS analog switches. The channel select input structure provides protection when voltages between 0 V and 5.5 V are applied, regardless of the supply voltage. This input structure helps prevent device destruction caused by supply voltage - input/output voltage mismatch, battery backup, hot insertion, etc. Features http://onsemi.com MARKING DIAGRAMS TSOP-6 DT SUFFIX CASE 318G 1 A1AYWG G * * * * * * * * * * * Select Pin Compatible with TTL Levels Channel Select Input Over-Voltage Tolerant to 5.5 V Fast Switching and Propagation Speeds Break-Before-Make Circuitry Low Power Dissipation: ICC = 2 mA (Max) at TA = 25C Diode Protection Provided on Channel Select Input Improved Linearity and Lower ON Resistance over Input Voltage Latch-up Performance Exceeds 300 mA ESD Performance: HBM > 2000 V; MM > 200 V Chip Complexity: 38 FETs Pb-Free Packages are Available SC-88/SC-70/SOT-363 DF SUFFIX CASE 419B 1 A1 M G G A1 A Y W M G = Specific Device Code = Assembly Location = Year = Work Week = Date Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position and underbar may vary depending upon manufacturing location. SELECT 1 V+ 2 GND 3 6 5 4 FUNCTION TABLE NO Select COM NC L H ON Channel NC NO Figure 1. Pin Assignment ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 2X1 COM U Figure 2. Logic Symbol (c) Semiconductor Components Industries, LLC, 2006 May, 2006 - Rev. 8 U U CHANNEL SELECT 2X0 NO NC 1 Publication Order Number: NLAST4599/D NLAST4599 MAXIMUM RATINGS (Note 1) Parameter Positive DC Supply Voltage Analog Input Voltage (VNO or VCOM) Digital Select Input Voltage DC Current, Into or Out of Any Pin Power Dissipation in Still Air Storage Temperature Range Lead Temperature, 1mm from Case for 10 seconds Junction Temperature Under Bias ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 125C (Note 5) SC-88 TSOP6 SC-88 TSOP6 Symbol VCC VIS VIN IIK PD TSTG TL TJ VESD Value -0.5 to +7.0 -0.5 VIS VCC )0.5 -0.5 VI + 7.0 $50 200 200 -65 to +150 260 150 2000 200 N/A $300 333 333 Unit V V V mA mW C C C V Latchup Performance Thermal Resistance ILATCHUP qJA mA C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22-A114-A 3. Tested to EIA/JESD22-A115-A 4. Tested to JESD22-C101-A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Characteristics DC Supply Voltage Digital Select Input Voltage Analog Input Voltage (NC, NO, COM) Operating Temperature Range Input Rise or Fall Time SELECT VCC = 3.3 V + 0.3 V VCC = 5.0 V + 0.5 V Symbol VCC VIN VIS TA tr, tf 0 0 100 20 Min 2.0 GND GND -55 Max 5.5 5.5 VCC +125 Unit V V V C ns/V NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature 5C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C 100 TIME, YEARS 1 1 10 1000 Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 NLAST4599 DC CHARACTERISTICS - Digital Section (Voltages Referenced to GND) Guaranteed Limit Parameter Minimum High-Level Input Voltage, Select Input Maximum Low-Level Input Voltage, Select Input Maximum Input Leakage Current, Select Input Power Off Leakage Current Maximum Quiescent Supply Current VIN = 5.5 V or GND VIN = 5.5 V or GND Select and VIS = VCC or GND Condition Symbol VIH VCC 3.0 4.5 5.5 3.0 4.5 5.5 5.5 0 5.5 -55 to 255C 2.0 2.0 2.0 0.5 0.8 0.8 +0.1 +10 1.0 <855C 2.0 2.0 2.0 0.5 0.8 0.8 +1.0 +10 1.0 <1255C 2.0 2.0 2.0 0.5 0.8 0.8 +1.0 +10 2.0 Unit V VIL V IIN IOFF ICC mA mA mA DC ELECTRICAL CHARACTERISTICS - Analog Section Guaranteed Limit Parameter Maximum "ON" Resistance (Figures 17 - 23) Condition VIN = VIL or VIH VIS = GND to VCC IINI < 10.0 mA VIN = VIL or VIH IINI < 10.0 mA VIS = 1V, 2V, 3.5V VIN = VIL or VIH IINI < 10.0 mA VNO or VNC = 3.5 V VIN = VIL or VIH VNO or VNC = 1.0 VCOM 4.5 V VIN = VIL or VIH VNO 1.0 V or 4.5 V with VNC floating or VNO 1.0 V or 4.5 V with VNO floating VCOM = 1.0 V or 4.5 V Symbol RON VCC 2.5 3.0 4.5 5.5 4.5 -55 to 255C 85 45 30 25 4 <855C 95 50 35 30 4 <1255C 105 55 40 35 5 Unit W ON Resistance Flatness (Figures 17 - 23) ON Resistance Match Between Channels NO or NC Off Leakage Current (Figure 9) COM ON Leakage Current (Figure 9) RFLAT (ON) W DRON (ON) 4.5 2 2 3 W INC(OFF) INO(OFF) ICOM(ON) 5.5 5.5 1 1 10 10 100 100 nA nA http://onsemi.com 3 NLAST4599 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Max Limit VCC Parameter Turn-On Time (Figures 12 and 13) Test Conditions RL = 300 W, CL = 35 pF (Figures 5 and 6) Symbol tON (V) 2.5 3.0 4.5 5.5 2.5 3.0 4.5 5.5 2.5 3.0 4.5 5.5 VIS (V) 2.0 2.0 3.0 3.0 2.0 2.0 3.0 3.0 2.0 2.0 3.0 3.0 -55 to 25_C Min 5 5 2 2 1 1 1 1 1 1 1 1 Typ* 23 16 11 9 7 5 4 3 12 11 6 5 Max 28 21 16 14 12 10 9 8 <85_C Min 5 5 2 2 1 1 1 1 1 1 1 1 Max 30 25 20 20 15 15 12 12 <125_C Min 5 5 2 2 1 1 1 1 1 1 1 1 Max 30 25 20 20 15 15 12 12 Unit ns Turn-Off Time (Figures 12 and 13) RL = 300 W, CL = 35 pF (Figures 5 and 6) tOFF ns Minimum Break-Before- Make Time VIS = 3.0 V (Figure 4) RL = 300 W, CL = 35 pF tBBM ns Typical @ 25, VCC = 5.0 V Maximum Input Capacitance, Select Input Analog I/O (switch off) Common I/O (switch off) Feedthrough (switch on) *Typical Characteristics are at 25_C. CIN CNO or CNC CCOM C(ON) 8 10 10 20 pF Parameter Maximum On-Channel -3dB Bandwidth or Minimum Frequency Response (Figure 10) Maximum Feedthrough On Loss Condition VIN = 0 dBm VIN centered between VCC and GND (Figure 7) VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC and GND (Figure 7) f = 100 kHz; VIS = 1 V RMS VIN centered between VCC and GND (Figure 7) VIN = VCC to GND, FIS = 20 kHz tr = tf = 3 ns RIS = 0 W, CL = 1000 pF Q = CL * DVOUT, (Figure 8) Off-Channel Isolation (Figure 10) Charge Injection Select Input to Common I/O (Figure 15) Total Harmonic Distortion THD + Noise (Figure 14) FIS = 20 Hz to 100 kHz, RL = Rgen = 600 W, CL = 50 pF VIS = 5.0 VPP sine wave ORDERING INFORMATION Device Nomenclature Circuit Indicator Device Function Package Suffix DF NL AS 4599 DT T1 Tape & Reel Suffix T2 Device NLAST4599DFT2 NLAST4599DFT2G NLAST4599DTT1 NLAST4599DTT1G Technology SC-88/SC-70/SOT-363 SC-88/SC-70/SOT-363 (Pb-Free) TSOP-6 TSOP-6 (Pb-Free) 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII IIII Symbol BW VONL VISO Q THD Package ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) VCC V 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 5.5 Typical 25C 170 200 200 -2 -2 -2 -93 -93 -93 1.5 3.0 Unit MHz dB dB pC % 5.5 0.1 Shipping NLAST4599 DUT VCC 0.1 mF 300 W Output VOUT 35 pF Input VCC GND tBMM 90% Output 90% of VOH Switch Select Pin GND Figure 4. tBBM (Time Break-Before-Make) VCC DUT VCC 0.1 mF Open Output VOUT 300 W 35 pF Output VOL tON tOFF Input 0V VOH 90% 90% 50% 50% Input Figure 5. tON/tOFF VCC DUT Output Open 300 W VOUT 35 pF Input VCC 50% 0V VOH Output VOL 10% tOFF tON 10% 50% Input Figure 6. tON/tOFF http://onsemi.com 5 NLAST4599 50 W Reference Input Output 50 W Generator 50 W DUT Transmitted Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VISO = Off Channel Isolation = 20 Log VONL = On Channel Loss = 20 Log VOUT VIN for VIN at 100 kHz VOUT for VIN at 100 kHz to 50 MHz VIN Bandwidth (BW) = the frequency 3 dB below VONL Figure 7. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT Open Output VIN VCC GND CL Output Off Off DVOUT VIN On Figure 8. Charge Injection: (Q) 100 10 LEAKAGE (nA) 1 ICOM(ON) 0.1 ICOM(OFF) 0.01 VCC = 5.0 V INO(OFF) 0.001 -55 -20 25 70 85 125 TEMPERATURE (C) Figure 9. Switch Leakage vs. Temperature http://onsemi.com 6 NLAST4599 0 -20 Bandwidth (ON-RESPONSE) PHASE (Degree) 0 10 -40 (dB) Off Isolation 20 -60 VCC = 5.0 V TA = 25_C 30 VCC = 5.0 V TA = 25_C -80 -100 0.01 0.1 1 10 FREQUENCY (MHz) 100 200 0.01 0.1 1 10 FREQUENCY (MHz) 100 200 Figure 10. Bandwidth and Off-Channel Isolation Figure 11. Phase vs. Frequency 30 25 20 15 10 5 0 2.5 tOFF (ns) tON (ns) TIME (ns) 30 VCC = 4.5 V 25 20 15 10 5 0 -55 tON tOFF TIME (ns) 3 3.5 4 4.5 5 -40 25 Temperature (C) 85 125 VCC (VOLTS) Figure 12. tON and tOFF vs. VCC at 255C Figure 13. tON and tOFF vs. Temp 1 VINpp = 3.0 V VCC = 3.6 V THD + NOISE (%) 3.0 2.5 2.0 Q (pC) 1.5 1.0 0.5 0 VCC = 3 V VCC = 5 V 0.1 VINpp = 5.0 V VCC = 5.5 V 0.01 1 10 FREQUENCY (kHz) 100 -0.5 0 1 2 VCOM (V) 3 4 5 Figure 14. Total Harmonic Distortion Plus Noise vs. Frequency Figure 15. Charge Injection vs. COM Voltage http://onsemi.com 7 NLAST4599 100 10 1 ICC (nA) 0.1 0.01 0.001 0.0001 0.00001 -40 VCC = 3.0 V 20 VCC = 5.0 V -20 0 20 60 80 100 120 0 0.0 1.0 VCC = 5.5 V 2.0 3.0 VIS (VDC) 4.0 5.0 6.0 RON (W) 60 VCC = 2.5 V 40 VCC = 3.0 V VCC = 4.0 V 100 VCC = 2.0 V 80 Temperature (C) Figure 16. ICC vs. Temp, VCC = 3 V & 5 V Figure 17. RON vs. VCC, Temp = 255C 100 90 80 70 RON (W) RON (W) 125C 25C -55C 85C 0.5 1.0 1.5 2.0 2.5 60 50 40 30 20 10 0 0.0 100 90 80 70 60 50 40 30 20 10 0 0.0 125C 0.5 -55C 85C 1.0 1.5 VIS (VDC) 2.0 2.5 3.0 25C VIS (VDC) Figure 18. RON vs Temp, VCC = 2.0 V Figure 19. RON vs. Temp, VCC = 2.5 V 50 45 40 35 RON (W) RON (W) 30 25 20 15 10 5 0 0.0 -55C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 125C 85C 25C 30 25 20 15 10 5 0 0.0 -55C 85C 125C 25C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VIS (VDC) VIS (VDC) Figure 20. RON vs. Temp, VCC = 3.0 V Figure 21. RON vs. Temp, VCC = 4.5 V http://onsemi.com 8 NLAST4599 25 125C 25 20 20 125C RON (W) 25C 10 85C 5 -55C RON (W) 15 15 25C 10 85C 5 -55C 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VIS (VDC) VIS (VDC) Figure 22. RON vs. Temp, VCC = 5.0 V Figure 23. RON vs. Temp, VCC = 5.5 V CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS DIRECTION OF FEED TAPE LEADER NO COMPONENTS 400 mm MIN Figure 24. Tape Ends for Finished Goods TAPE DIMENSIONS mm 2.00 4.00 4.00 1.50 TYP 1.75 8.00 $0.30 3.50 $0.50 1 1.00 MIN DIRECTION OF FEED Figure 25. SC70-6/SC-88/SOT-363 DFT2 and SOT23-6/TSOP-6/SC59-6 DTT1 Reel Configuration/Orientation http://onsemi.com 9 NLAST4599 t MAX 1.5 mm MIN (0.06 in) 20.2 mm MIN (0.795 in) 13.0 mm $0.2 mm (0.512 in $0.008 in) A 50 mm MIN (1.969 in) FULL RADIUS G Figure 26. Reel Dimensions REEL DIMENSIONS Tape Size 8 mm T and R Suffix T1, T2 A Max 178 mm (7 in) G 8.4 mm, + 1.5 mm, -0.0 (0.33 in + 0.059 in, -0.00) t Max 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET HOLE Figure 27. Reel Winding Direction http://onsemi.com 10 NLAST4599 PACKAGE DIMENSIONS TSOP-6 CASE 318G-02 ISSUE S D 6 5 1 2 4 3 HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10 - INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 - b e q 0.05 (0.002) A1 A L c DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0 MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0 MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10 SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 NLAST4599 PACKAGE DIMENSIONS SC-88/SC70-6/SOT-363 CASE 419B-02 ISSUE W D e NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B-01 OBSOLETE, NEW STANDARD 419B-02. MILLIMETERS MIN NOM MAX 0.80 0.95 1.10 0.00 0.05 0.10 0.20 REF 0.10 0.21 0.30 0.10 0.14 0.25 1.80 2.00 2.20 1.15 1.25 1.35 0.65 BSC 0.10 0.20 0.30 2.00 2.10 2.20 INCHES NOM MAX 0.037 0.043 0.002 0.004 0.008 REF 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 0.045 0.049 0.053 0.026 BSC 0.004 0.008 0.012 0.078 0.082 0.086 MIN 0.031 0.000 6 5 4 HE 1 2 3 -E- b 6 PL 0.2 (0.008) M E M DIM A A1 A3 b C D E e L HE A3 C A A1 L SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 12 NLAST4599/D |
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