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| Datasheet File OCR Text: |
| PDF: 1999 Apr 16 Philips Semiconductors Package outline Ceramic single-ended flat package; heatsink mounted; 2 mounting holes; 12 in-line tin (Sn) plated leads SOT347 D y U q P A F S U1 G E L 1 Z e b 12 wM vA Q A 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT mm A 6.0 5.6 b 0.51 0.38 c 0.25 D 36.2 35.8 E 18.2 17.8 e 2.54 F 2.0 G 25.5 24.5 L min. 6 P 4.15 3.85 Q 1.8 q 19 S 3.5 3.4 U 34.4 34.0 U1 22.2 21.8 v 0.3 w 0.25 y 0.1 Z max. 4.1 10 mm c OUTLINE VERSION SOT347 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-28 |
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