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| *Customer : SPECIFICATION Preliminary ITEM MODEL REVISION FLASH LED DEVICE SSC-FCW211Z Rev.0.1 (07.07.27) [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Soldering profile 5. Outline dimension 6. Precaution for use Drawn by Checked by Approved by SSC-QP-0401-06(REV1.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FCW211Z - 1/ 7- 1. Features Package : 3.5 x 3.0 x 0.75 mm White colored SMT package Applications : * Mobile Handset 2. Absolute Maximum Ratings*1 Parameter Power Dissipation*1 Forward Current Peak Forward Current*2 Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM VR Topr Tstg Value 2.04 600 2000 5 -30 ~ 85 -40 ~ 100 (Ta=25) Unit W V C C *1.Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product. *2. IFM conditions is Pulse width Tw 10ms, Duty ratio 1/20 3. Electro-Optical Characteristics Characteristics Forward Voltage Reverse Current Symbol VF IR Condition IF=600 IF=1600 VR=5V IF=600 Luminous Intensity *1 IV IF=1600 (Peak current mode I) *2 IF=2000 (Peak current mode II) *3 IF=600 IF=1600 IF=1600 IF=600 IF=600 IF=600 Min Typ 3.4 4.0 40 81 95 40 81 257 0.310 0.320 120 (Ta=25) Max 100 lux @1m Unit V cd Illumination Luminous flux Chromaticity Coordinates Viewing Angle*4 lx lm X Y 2 1/2 lm - deg *1. The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 10%. *2. Peak current mode I condition is Pulse width Tw = 300msec, Duty ratio = 1/ 10 *3. Peak current mode II condition is Pulse width Tw = 10msec, Duty ratio = 1/ 20 Note : All measurements were made under the standardized environment of SSC. ( Tolerance : IV10%, color coordinate 0.005, VF 0.1 ) SSC-QP-0401-06(REV1.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FCW211Z - 2/ 7- Forward Current vs. Forward Voltage 10000 3 Luminous Intensity vs. Forward Current C u rre nt [ m A ] 1000 [a.u.] L u m i n o s it y R e l a ti v e 2 1 0 0.0 100 Forw ard 10 1 2.5 Forw ard 3.0 V o lt a g e [ V ] 3.5 4.0 0.2 0.4 0.6 Forw ard 0.8 1.0 C u rre n t [A ] 1.2 1.4 1.6 1.8 2.0 Forward Current Derate Curve 800 700 600 500 400 300 200 100 0 -25 0.36 Forward Current vs Chromaticity Coordinate 0.35 x y Forward current IF(mA) C o ordin ate C h r o m a tis it y 0 25 50 o 0.34 0.33 0.32 0.31 75 100 0.30 400 F o r w a r 800 C u r r e n t 1200 A ] d [m 1600 2000 Ambient temperature Ta( C) SSC-QP-0401-06(REV1.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FCW211Z - 3/ 7- (Ta=25, IF=250mA) Radiation Diagram 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 120 130 140 150 160 170 180 110 100 90 80 70 60 50 40 30 20 10 0 Spectrum 1.0 Ta = 25 C o 0.8 Intensity [a.u.] 0.6 0.4 0.2 0.0 400 450 500 550 600 650 700 750 Wavelength [nm] SSC-QP-0401-06(REV1.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FCW211Z - 4/ 7- 4. Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface temperature C Operation heating 240 150 ~ Pre-heating Temperature rise: 5C/sec. Cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 260max. for 10 seconds max. (3) Hand Soldering conditions -Not more than 3 seconds @MAX280, under Soldering iron. SSC-QP-0401-06(REV1.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 LED Surface temperature C Operation heating 260 150 ~ 120 0 Pre-heating Temperature rise: 5C/sec. MAX. Cooling: -5C/sec. 60 to 150 sec. 10 sec SSC-FCW211Z - 5/ 7- 5. Outline Dimension Tolerance: 0.05, Unit: [TOP VIEW] [SIDE VIEW] [BOTTOM VIEW] [INNER CIRCUIT] * Recommend solder pad pattern - Please refer to the "Thermal Design Guideline for Hi Power Flash LED" for heat dissipation pattern design. SSC-QP-0401-06(REV1.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FCW211Z - 6/ 7- 6. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desicator) with a desiccant . Otherwise, to store them in the following environment is recommended. Temperature : 5~30 (2) Attention after opened However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. Temperature : 5 ~ 40 Humidity : less than 30% b. Keeping of a fraction Humidity : 60%HR max. (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 605. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. (15) Static Electricity and surge damages the Blue LEDs. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be properly grounded. (16) It is recommended to use individual resistor separately when the LEDs applies in parallel circuit so that it may improve the light deviations. SSC-QP-0401-06(REV1.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FCW211Z - 7/ 7- |
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