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 S T M4550
S amHop Microelectronics C orp. Apr. 19. 2006
N-C hannel E nhancement Mode Field E ffect Transistor
P R ODUC T S UMMAR Y
V DS S
55V
F E AT UR E S
( m ) Max
ID
5A
R DS (ON)
S uper high dense cell design for low R DS (ON).
50 @ V G S = 10V 70 @ V G S = 4.5V
R ugged and reliable. S urface Mount P ackage.
S O-8 1
ABS OLUTE MAXIMUM R ATINGS (TA=25 C unless otherwise noted)
P arameter Drain-S ource Voltage R ating Drain-S ource Voltage Gate-S ource Voltage Drain C urrent-C ontinuous @ TJ=25 C a -P ulsed Drain-S ource Diode Forward C urrent b Maximum P ower Dissipation b Operating Junction and S torage Temperature R ange S ymbol Vspike VDS VGS ID IDM IS PD TJ, TS TG
d
Limit 60 55 20 5 20 1.7 2.5 -55 to 150
Unit V V V A A A W C
THE R MAL C HAR AC TE R IS TIC S
Thermal R esistance, Junction-to-Ambient a
1
R JA
50
C /W
S T M4550
E LE CTR ICAL CHAR ACTE R IS TICS (TA =25 C unless otherwise noted)
Parameter
5
S ymbol
BVDSS IDSS IGSS VGS(th) R DS (ON) ID(ON) gFS CISS COSS CRSS
b
Condition
VGS = 0V, ID = 250uA VDS = 44V, VGS = 0V VGS = 20V, VDS = 0V VDS = VGS, ID = 250uA VGS =10V, ID = 5A VGS =4.5V, ID= 3A VDS = 10V, VGS = 10V VDS = 10V, ID = 5A
Min Typ C Max Unit
55 1 V uA 100 nA 1 1.8 40 50 20 22 689 92 55 3 70 V
OFF CHAR ACTE R IS TICS
Drain-S ource Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage
ON CHAR ACTE R IS TICS a
Gate Threshold Voltage Drain-S ource On-S tate R esistance On-S tate Drain Current Forward Transconductance 50 m ohm
m ohm
A S
DYNAMIC CHAR ACTE R IS TICS b
Input Capacitance Output Capacitance R everse Transfer Capacitance
PF PF PF
VDS =20V, VGS = 0V f =1.0MHZ
S WITCHING CHAR ACTE R IS TICS
Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-S ource Charge Gate-Drain Charge
tD(ON) tr tD(OFF) tf Qg Qgs Qgd
2
VDD = 30V ID = 1A VGS = 10V R GE N = 6 ohm VDS =15V, ID = 5A,VGS =10V VDS =15V, ID = 5A,VGS =4.5V VDS =15V, ID = 5A VGS =10V
11 10.9 23 5 13.3 6.2 1.7 2.8
ns ns ns ns nC nC nC nC
S T M4550
E LE CTR ICAL CHAR ACTE R IS TICS (TA=25 C unless otherwise noted)
Parameter
Diode Forward Voltage
S ymbol
VSD
Condition
VGS = 0V, Is =1.7A
Min Typ C Max Unit
0.78 1.2 V
DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b
Notes a.Surface Mounted on FR 4 Board, t <=10sec. b.Pulse Test:Pulse Width<=300us, Duty Cycle<= 2%. c.Guaranteed by design, not subject to production testing. d.Guaranteed when external R g=6 ohm and tf < tf max.
25
V G S =10V
20
20
V G S =4.5V V G S =4V
15
ID, Drain C urrent (A)
15
V G S =3.5V
ID, Drain C urrent (A)
10
10
V G S =3V
5 125 C 1 25 C 0 0 -55 C
5
0 0 0.5 1 1.5 2 2.5 3
0.7
1.4
2.1
2.8
3.5
4.2
V DS , Drain-to-S ource Voltage (V )
V G S , G ate-to-S ource Voltage (V )
F igure 1. Output C haracteris tics
F igure 2. Trans fer C haracteris tics
90
2.0
R DS (ON), On-R es is tance Normalized
75
1.8 1.6 1.4 1.2 1.0 0
R DS (on) (m )
V G S =10V ID=5A
60 V G S =4.5V 45
V G S =10V
30 15 0
V G S =4.5V ID=3A
0
5
10
15
20
25
0
25
50
75
100
125
150
T j( C )
ID, Drain C urrent (A)
T j, J unction T emperature ( C )
F igure 3. On-R es is tance vs . Drain C urrent and G ate V oltage
3
F igure 4. On-R es is tance Variation with Drain C urrent and Temperature
S T M4550
B V DS S , Normalized Drain-S ource B reakdown V oltage V th, Normalized G ate-S ource T hres hold V oltage
1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 -50 -25 0 25 50 75 100 125 V DS =V G S ID=250uA 1.15 ID=250uA 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125
T j, J unction T emperature ( C )
T j, J unction T emperature ( C )
F igure 5. G ate T hres hold V ariation with T emperature
F igure 6. B reakdown V oltage V ariation with T emperature
90
20.0 ID=5A
125 C
75
Is , S ource-drain current (A)
R DS (on) (m )
10.0
60 75 C 45 25 C 30 15 0
125 C
25 C 75 C
1.0
0 2 4 6 8 10
0.2
0.4
0.6
0.8
1.0
1.2
V G S , G ate-S ource Voltage (V ) V S D, B ody Diode F orward V oltage (V )
F igure 7. On-R es is tance vs . G ate-S ource V oltage
F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent
4
S T M4550
900
V G S , G ate to S ource V oltage (V )
10 8 6 4 2 0 0 2 4 6 8 10 12 14 16
Qg, T otal G ate C harge (nC )
750
C is s
VDS =15V ID=5A
C , C apacitance (pF )
600 450 300 150 0 C rs s C os s
6
0
5
10
15
20
25
30
V DS , Drain-to S ource Voltage (V )
F igure 9. C apacitance
F igure 10. G ate C harge
600
ID, Drain C urrent (A) S witching T ime (ns )
50
L im
10
(O RD
S
it
100 60 10
T D (off)
N)
10
Tr
T D (on)
10
DC
ms
0m
1
1s
s
Tf
1 1
V DS =30V ,ID=1A V G S =10V
0.1 0.03
VGS =10V S ingle P ulse T A=25 C 0.1 1 10 50 80
6 10
60 100 300 600
R g, G ate R es is tance ()
V DS , Drain-S ource V oltage (V )
F igure 11.s witching characteris tics
F igure 12. Maximum S afe O perating Area
5
S T M4550
V DD ton V IN D VG S R GE N G
90%
toff tr
90%
RL V OUT
td(on) V OUT
td(off)
90% 10%
tf
5
10%
INVE R TE D
S
V IN
50% 10%
50%
P ULS E WIDTH
F igure 13. S witching T es t C ircuit
F igure 14. S witching Waveforms
9
r(t),Normalized E ffective T ransient T hermal Impedance
1
0.5
0.2
0.1
0.1 0.05 0.02 0.01
P DM t1 t2 1. 2. 3. 4. R thJ A (t)=r (t) * R thJ A R thJ A=S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2
0.01 0.00001 0.0001
Single Pulse 0.001 0.01 0.1 1 10
100
1000
S quare Wave P uls e Duration (s ec)
F igure 15. Normalized T hermal T rans ient Impedance C urve
6
S T M4550
PAC K AG E OUT LINE DIME NS IONS S O-8
1 L
E D
0.015X45
A
e
0.05 TYP.
0.016 TYP.
B
A1
0.008 TYP.
C
H
S Y MB OLS A A1 D E H L
MILLIME T E R S MIN 1.35 0.10 4.80 3.81 5.79 0.41 0 MAX 1.75 0.25 4.98 3.99 6.20 1.27 8 MIN 0.053 0.004 0.189 0.150 0.228 0.016 0
INC HE S MAX 0.069 0.010 0.196 0.157 0.244 0.050 8
7
S T M4550
SO-8 Tape and Reel Data
SO-8 Carrier Tape
unit:
PACKAGE SOP 8N 150 A0
6.40
B0
5.20
K0
2.10
D0
1.5 (MIN)
D1
1.5 + 0.1 - 0.0
E
12.0 0.3
E1
1.75
E2
5.5 0.05
P0
8.0
P1
4.0
P2
2.0 0.05
T
0.3 0.05
SO-8 Reel
UNIT:
TAPE SIZE
12
REEL SIZE
330
M
330 1
N
62 1.5
W
12.4 + 0.2
W1
16.8 - 0.4
H
12.75 + 0.15
K
S
2.0 0.15
G
R
V
8


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