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 TC4426A/TC4427A/TC4428A
1.5A Dual High-Speed Power MOSFET Drivers
Features:
* High Peak Output Current - 1.5A * Wide Input Supply Voltage Operating Range: - 4.5V to 18V * High Capacitive Load Drive Capability - 1000 pF in 25 ns (typ.) * Short Delay Times - 30 ns (typ.) * Matched Rise, Fall and Delay Times * Low Supply Current: - With Logic `1' Input - 1 mA (typ.) - With Logic `0' Input - 100 A (typ.) * Low Output Impedance - 7 (typ.) * Latch-Up Protected: Will Withstand 0.5A Reverse Current * Input Will Withstand Negative Inputs Up to 5V * ESD Protected - 4 kV * Pin-compatible with TC426/TC427/TC428 and TC4426/TC4427/TC4428 * Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN Packages
General Description:
The TC4426A/TC4427A/TC4428A are improved versions of the earlier TC4426/TC4427/TC4428 family of MOSFET drivers. In addition to matched rise and fall times, the TC4426A/TC4427A/TC4428A devices have matched leading and falling edge propagation delay times. These devices are highly latch-up resistant under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against Electrostatic Discharge (ESD) up to 4 kV. The TC4426A/TC4427A/TC4428A MOSFET drivers can easily charge/discharge 1000 pF gate capacitances in under 30 ns. These devices provide low enough impedances in both the on and off states to ensure the MOSFET's intended state will not be affected, even by large transients.
Applications:
* Switch Mode Power Supplies * Line Drivers * Pulse Transformer Drive
Package Types
8-Pin MSOP/ PDIP/SOIC TC4426A TC4427A TC4428A
NC IN A GND IN B
1 8 NC 2 TC4426A 7 OUT A 3 TC4427A 6 VDD 4 TC4428A 5 OUT B
8-Pin DFN(1) TC4426A TC4427A TC4428A
NC 1 IN A 2 GND 3 IN B 4 TC4426A TC4427A TC4428A
8 7 6 5
NC OUT A VDD OUT B
NC OUT A VDD OUT B
NC OUT A VDD OUT B
NC OUT A VDD OUT B
NC OUT A VDD OUT B
Note 1: Exposed pad of the DFN package is electrically isolated.
(c) 2006 Microchip Technology Inc.
DS21423F-page 1
TC4426A/TC4427A/TC4428A
Functional Block Diagram
Inverting 500 A 300 mV Output VDD
Input Effective Input C = 12 pF (Each Input) GND 4.7V
Non-Inverting
TC4426A/TC4427A/TC4428A
Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting drivers. The TC4428A has one inverting and one non-inverting driver. 2: Ground any unused driver input.
DS21423F-page 2
(c) 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Supply Voltage ..................................................... +22V Input Voltage, IN A or IN B ..................................... (VDD + 0.3V) to (GND - 5V) Package Power Dissipation (TA 70C) DFN .............................................................. Note 2 MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance VOH VOL RO VDD - 0.025 -- -- -- -- -- -- -- -- -- 7 7 8 8 1.5 > 0.5 -- 0.025 9 10 11 12 -- -- V V DC Test DC Test IOUT = 10 mA, VDD = 18V, TA = +25C 0C TA +70C -40C TA +85C -40C TA +125C VDD = 18V Duty cycle 2%, t 300 sec VDD = 18V TA = +25C 0C TA +70C -40C TA +85C -40C TA +125C, Figure 4-1 TA = +25C 0C TA +70C -40C TA +85C -40C TA +125C, Figure 4-1 TA = +25C 0C TA +70C -40C TA +85C -40C TA +125C, Figure 4-1 TA = +25C 0C TA +70C -40C TA +85C -40C TA +125C, Figure 4-1 VIN = 3V (Both inputs) VIN = 0V (Both inputs), VDD = 18V VIH VIL IIN 2.4 -- -1.0 -10 -- -- -- -- -- 0.8 +1.0 +10 V V A 0V VIN VDD Sym Min Typ Max Units Conditions
Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time
IPK IREV
A A
tR
-- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
25 27 29 30 25 27 29 30 30 33 35 38 30 33 35 38 1.0 0.1
35 40 40 40 35 40 40 40 35 40 45 50 35 40 45 50 2.0 0.2
ns
Fall Time
tF
ns
Delay Time
tD1
ns
Delay Time
tD2
ns
Power Supply Power Supply Current Note 1: 2: IS mA
Switching times ensured by design. Package power dissipation is dependent on the copper pad area on the PCB.
(c) 2006 Microchip Technology Inc.
DS21423F-page 3
TC4426A/TC4427A/TC4428A
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC JA JA JA JA -- -- -- -- 33.2 206 125 155 -- -- -- -- C/W C/W C/W C/W TA TA TA TJ TA 0 -40 -40 -- -65 -- -- -- -- -- +70 +85 +125 +150 +150 C C C C C Sym Min Typ Max Units Conditions
DS21423F-page 4
(c) 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
100 80
tRISE (nsec)
CL = 2200 pF TA = +25C
100 80
tFALL (nsec)
CL = 2200pF CL = 2200 pF TA = +25C
60 40 20 0 5.0
CL = 100 pF
CL = 1500 pF CL = 1000 pF CL = 470 pF
60 40 20
CL= 100pF CL = 100 pF 0 5.0 7.5
CL = 1500 pF CL = 1000 pF CL = 470 pF
7.5
10.0
12.5 VDD (V)
15.0
17.5
10.0
12.5 VDD (V)
15.0
17.5
FIGURE 2-1: Voltage.
Rise Time vs. Supply
FIGURE 2-4: Voltage.
Fall Time vs. Supply
110 100 90 80 70 60 50 40 30 20 1 2 Delay Time (nsec)
tD1
60 Delay Time (nsec)
CL = 1000 pF VDD = 10V
55 50 45 40 35 30 25 20
tD2
tD1
CL = 1000 pF
tD2
3
4 5 6 7 Input Amplitude (V)
8
9
0
5
10 VDD (V)
15
20
FIGURE 2-2: Amplitude.
Delay Time vs. Input
FIGURE 2-5: Supply Voltage.
Propagation Delay Time vs.
28 Delay Time (nsec) 26 Time (nsec) 24 22 20 18 16 14 -100
tRISE tFALL
CL = 1000 pF VDD = 18V
40 35 30 25
tD2
CL = 1000 pF VDD = 18V
20 15 -100
tD1
-50
0
50
100
150
-50
0
50
100
150
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-3: Temperature.
Rise and Fall Times vs.
FIGURE 2-6: Temperature.
Propagation Delay Time vs.
(c) 2006 Microchip Technology Inc.
DS21423F-page 5
TC4426A/TC4427A/TC4428A
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
30 25
TA = +125C
30 25
TA = +125C
RDS(ON) ()
TA = +25C
RDS(ON) ()
20 15 10 5 0 0
20 15 10 5 0
TA = +25C
5
10 VDD (V)
15
20
0
5
10 VDD (V)
15
20
FIGURE 2-7: Resistance.
High-State Output
FIGURE 2-10: Resistance.
Low-State Output
60 50
ISUPPLY (mA)
CL = 2200 pF
60
CL = 1500 pF CL = 1000 pF
VDD = 18V
CL = 100 pF
2 MHz
VDD = 18V
50
ISUPPLY (mA)
900 kHz
40 30 20 10 0 0 500 1000
40 30 20
600 kHz
200 kHz
10
20 kHz
0 1500 2000 2500 0 500 FREQUENCY (kHz) 1000 1500 CLOAD (pF) 2000 2500
FIGURE 2-8: Frequency.
Supply Current vs.
FIGURE 2-11: Capacitive Load.
Supply Current vs.
80 70
ISUPPLY (mA)
VDD = 12V
CL = 2200 pF
80 70
ISUPPLY (mA) VDD = 12V
2 MHz
60 50 40 30 20 10 0 0 500 1000 1500
CL = 1500 pF CL = 1000 pF CL = 100 pF
60 50 40 30 20 10 0
900 kHz 600 kHz 200 kHz 20 kHz
2000
2500
0
500
1000
FREQUENCY (kHz)
1500 CLOAD (pF)
2000
2500
FIGURE 2-9: Frequency.
Supply Current vs.
FIGURE 2-12: Capacitive Load.
Supply Current vs.
DS21423F-page 6
(c) 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD 18V.
40 35
ISUPPLY (mA) VDD = 6V
CL = 2200 pF
40 35
ISUPPLY (mA) VDD = 6V
2 MHz
30 25 20 15 10 5 0 0 500 1000 1500
CL = 1500 pF CL = 1000 pF CL = 100 pF
30 25 20 15 10 5 0
900 kHz 600 kHz 200 kHz 20 kHz
2000
2500
0
500
1000
FREQUENCY (kHz)
1500 CLOAD (pF)
2000
2500
FIGURE 2-13: Frequency.
Supply Current vs.
FIGURE 2-15: Capacitive Load.
Supply Current vs.
IQUIESCENT (A)
TA = 25C
IQUIESCENT (A)
900 800 BOTH INPUTS = 1 700 600 500 400 300 200 BOTH INPUTS = 0 100 0 0 5
10
VDD (V)
15
20
1100 1000 900 BOTH INPUTS = 1 800 700 600 500 400 300 200 BOTH INPUTS = 0 100 0 -100 -50 0
VDD = 18V
50
100
150
TEMPERATURE (C)
FIGURE 2-14: vs. Voltage.
Quiescent Supply Current
FIGURE 2-16: vs. Temperature.
Quiescent Supply Current
(c) 2006 Microchip Technology Inc.
DS21423F-page 7
TC4426A/TC4427A/TC4428A
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
8-Pin PDIP/ MSOP/SOIC 1 2 3 4 5 6 7 8 -- Note 1:
PIN FUNCTION TABLE
8-Pin DFN 1 2 3 4 5 6 7 8 PAD Symbol NC IN A GND IN B OUT B VDD OUT A NC NC No connection Input A Ground Input B Output B Supply input Output A No connection Exposed Metal Pad Description
Duplicate pins must be connected for proper operation.
3.1
Inputs A and B
3.4
Supply Input (VDD)
MOSFET driver inputs A and B are high-impedance, TTL/CMOS compatible inputs. These inputs also have 300 mV of hysteresis between the high and low thresholds that prevents output glitching, even when the rise and fall time of the input signal is very slow.
The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 18V, with respect to the ground pin. The VDD input should be bypassed with local ceramic capacitors. The value of these capacitors should be chosen based on the capacitive load that is being driven.
3.2
Ground (GND) 3.5 Exposed Metal Pad
The exposed metal pad of the 6x5 DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board, to aid in heat removal from the package.
The ground pin is the return path for both the bias current and the high peak current that discharges the external load capacitance. The ground pin should be tied into a ground plane or have a very short trace to the bias supply source return.
3.3
Output A and B
MOSFET driver outputs A and B are low-impedance, CMOS push-pull style outputs. The pull-down and pullup devices are of equal strength, making the rise and fall times equivalent.
DS21423F-page 8
(c) 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
4.0 APPLICATIONS INFORMATION
+5V Input VDD = 18V 4.7 F 6 Input 2 7 Output CL = 1000 pF 4 5 +5V Input 3 Input: 100 kHz, square wave, tRISE = tFALL 10 ns 0V VDD Output 0V 10% 10% tD190% tR tD2 90% tF 10% 0.1 F 0V VDD Output 0V 10% 10% 10% tD1 tF 90% tD2 tR 90%
90%
Inverting Driver (TC4426A, 1/2 TC4428A)
90%
Non-Inverting Driver (TC4427A, 1/2 TC4428A) FIGURE 4-1: Switching Time Test Circuit.
(c) 2006 Microchip Technology Inc.
DS21423F-page 9
TC4426A/TC4427A/TC4428A
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead DFN Example:
XXXXXXX XXXXXXX XXYYWW NNN
TC4426A EMF 0420 256
8-Lead MSOP
Example:
XXXXX YWWNNN
4426AE 420256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: TC4427A EPA256 0420
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN
Example: TC4428A COA0420 256
Legend:
XX...X YY WW NNN
Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code).
DS21423F-page 10
(c) 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) - Saw Singulated
(c) 2006 Microchip Technology Inc.
DS21423F-page 11
TC4426A/TC4427A/TC4428A
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
E E1
p D 2 B n 1
A c A1 (F)
A2
L
Number of Pins Pitch A .043 Overall Height A2 .030 .037 Molded Package Thickness .000 .006 A1 Standoff E Overall Width E1 Molded Package Width D Overall Length L .016 .031 Foot Length Footprint (Reference) F Foot Angle 0 8 c Lead Thickness .003 .009 .009 .016 Lead Width B Mold Draft Angle Top 5 15 5 15 Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-187
Drawing No. C04-111
Units Dimension Limits n p
MIN
INCHES NOM 8 .026 BSC .033 .193 TYP. .118 BSC .118 BSC .024 .037 REF .006 .012 -
MAX
MIN
MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0 0.08 0.22 5 5 -
MAX
1.10 0.95 0.15
0.80 8 0.23 0.40 15 15
DS21423F-page 12
(c) 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
8-Lead Plastic Dual In-line (PA) - 300 mil (PDIP)
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
MAX Number of Pins Pitch Top to Seating Plane A .140 .170 4.32 Molded Package Thickness A2 .115 .145 3.68 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 8.26 Molded Package Width E1 .240 .250 .260 6.60 Overall Length D .360 .373 .385 9.78 Tip to Seating Plane L .125 .130 .135 3.43 c Lead Thickness .008 .012 .015 0.38 Upper Lead Width B1 .045 .058 .070 1.78 Lower Lead Width B .014 .018 .022 0.56 Overall Row Spacing eB .310 .370 .430 10.92 Mold Draft Angle Top 5 10 15 15 Mold Draft Angle Bottom 5 10 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
Units Dimension Limits n p
MIN
INCHES* NOM 8 .100 .155 .130
MAX
MIN
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
(c) 2006 Microchip Technology Inc.
DS21423F-page 13
TC4426A/TC4427A/TC4428A
8-Lead Plastic Small Outline (OA) - Narrow, 150 mil (SOIC)
E E1
p
D 2 B n 1
h 45
c A A2
L A1
MAX Number of Pins Pitch Overall Height A .053 .069 1.75 Molded Package Thickness A2 .052 .061 1.55 Standoff A1 .004 .010 0.25 Overall Width E .228 .244 6.20 Molded Package Width E1 .146 .157 3.99 Overall Length D .189 .197 5.00 Chamfer Distance h .010 .020 0.51 Foot Length L .019 .030 0.76 Foot Angle 0 8 8 c Lead Thickness .008 .010 0.25 Lead Width B .013 .020 0.51 Mold Draft Angle Top 0 15 15 Mold Draft Angle Bottom 0 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
Units Dimension Limits n p
MIN
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
DS21423F-page 14
(c) 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package XXX Tape & Reel X PB Free Examples:
a) TC4426ACOA: 1.5A Dual Inverting MOSFET driver, 0C to +70C, 8LD SOIC package. b) TC4426AEOA: 1.5A Dual Inverting MOSFET driver, -40C to +85C, 8LD SOIC package. c) TC4426AEMF: 1.5A Dual Inverting MOSFET driver, -40C to +85C, 8LD DFN package. a) TC4427ACPA: 1.5A Dual Non-Inverting MOSFET driver, 0C to +70C, 8LD PDIP package. b) TC4427AEPA: 1.5A Dual Non-Inverting MOSFET driver, -40C to +85C, 8LD PDIP package. c) TC4427AVMF713: 1.5A Dual Non-Inverting MOSFET driver, -40C to +125C, 8LD DFN package, Tape and Reel. a) TC4428AEPA: 1.5A Dual Complementary MOSFET driver, -40C to +85C, 8LD PDIP package. b) TC4428ACOA713: 1.5A Dual Complementary MOSFET driver, 0C to +70C 8LD SOIC package, Tape and Reel. c) TC4428AVMF: 1.5A Dual Complementary MOSFET driver, -40C to +125C, 8LD DFN package.
Device:
TC4426A: 1.5A Dual MOSFET Driver, Inverting TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting TC4428A: 1.5A Dual MOSFET Driver, Complementary
Temperature Range:
C E V
= 0C to +70C (PDIP & SOIC Only) = -40C to +85C = -40C to +125C
Package:
MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead UA713 = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel)
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
(c) 2006 Microchip Technology Inc.
DS21423F-page 15
TC4426A/TC4427A/TC4428A
NOTES:
DS21423F-page 16
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21423F-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
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ASIA/PACIFIC
India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/31/05
DS21423F-page 18
(c) 2006 Microchip Technology Inc.


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