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tenx technology
GENERAL DESCRIPTION
TM8713
4 Bit Microcontroller
The TM8713 is an embedded high-performance 4-bit microcomputer with LCD/LED driver. It contains all the necessary functions, such as 4-bit parallel processing ALU, ROM, RAM, I/O ports, timer, clock generator, dual clock operation, EL panel driver, LCD driver, look-up table, watchdog timer and key matrix scanning circuitry in a signal chip. FEATURES 1. Low power dissipation. 2. Powerful instruction set (135 instructions). Binary addition, subtraction, BCD adjust, logical operation in direct and index addressing mode. Single bit manipulation (set, reset, decision for branch). Various conditional branch. 16 working registers and manipulation. Table look-up. LCD driver data transfer. 3. LCD/LED driver output. 5 common outputs and 27 segment outputs (up to drive 135 LCD/LED segments). 1/2 Duty, 1/3 Duty, 1/4 Duty or 1/5 Duty for both LCD/LED drivers is selected by MASK option. 1/2 Bias or 1/3 Bias for LCD driver is selected by MASK option. Single instruction to turn off all segments. Segment outputs(SEG1~12,21~35) could be defined as CMOS or P_open drain type output by mask option. 4. Memory capacity. ROM capacity RAM capacity 1536 96 x 16 bits. x 4 bits.
5. Input/output ports. Port IOA 4 pins (with internal pull-low), muxed with SEG24~27. Port IOB 4 pins (with internal pull-low), muxed with SEG28~31. Port IOC 4 pins (with internal pull-low / low-level-hold), muxed with SEG32 ~ SEG35. IOC port had built-in input signal chattering prevention circuitry. 6. 8 level subroutine nesting. 7. Interrupt function. External factors Internal factors 3 2 (INT pin, Port IOC & KI input). (Pre-Divider, Timer1).
8. Built-in EL panel driver.
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
ELC, ELP (Muxed with SEG28, SEG29). 9. Built in Alarm, clock or single tone melody generator. BZB, BZ (Muxed with SEG30, SEG31). 10. Built in key matrix scanning function. K1~K12 (Shared with SEG1~SEG12). KI1~KI4 (Muxed with SEG32~SEG35). 11. One 6-bit programmable timer with programmable clock source. 12. Watch dog timer. 13. Built-in Voltage doubler, halver, tripler charge pump circuit. 14. Dual clock operation. slow clock oscillation can be defined as X'tal or external RC type oscillator by mask option. fast clock oscillation can be defined as internal R or external R type oscillator by mask option. 15. HALT function. 16. STOP function.
BLOCK DIAGRAM
B1-4 ELC,ELP BZ,BZB B-PORT EL DRIVER ALARM C1-4 KI1~KI4 SEG1-12,21-35 K1~K12
A1-4
COM1-5
VDD1-3
A-PORT
C-PORT KEY-IN
LCD DRIVER SEGMENT PLA
4 BITS DATA BUS FREQUENCY GENERATOR TABLE ROM 256(12-N) X 8 BITS ALU DATA RAM 96 X 4 BITS
PRE-DIVIDER
6 BITS PRESET TIMER 1 CONTROL CIRCUIT RESET INT
8 LEVELS STACK 11 BITS PROGRAM COUNTER
INSTRUCTION DECODER PROGRAM ROM 128N X 16 BITS
N:1->12
OSCILLATOR
CUP1,2
XTIN,OUT
2
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
PAD DIAGRAM
1 44 32
12 19 21
The substrate of chip should be connected to GND. PAD COORDINATE No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Name BAK XIN XOUT GND VDD1 VDD2 VDD3 CUP1 CUP2 COM1 COM2 COM3 COM4 COM5 SEG1(K1) SEG2(K2) SEG3(K3) SEG4(K4) SEG5(K5) SEG6(K6) SEG7(K7) SEG8(K8) X 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 207.50 322.50 437.50 552.50 667.50 782.50 1366.80 1481.80 1602.50 1602.50 Y 1399.10 1269.10 1154.10 1039.10 924.10 809.10 694.10 579.10 464.10 349.10 224.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 77.50 224.50
3
No 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44
Name SEG9(K9) SEG10(K10) SEG11(K11) SEG12(K12) SEG21 SEG22 SEG23 SEG24/IOA1 SEG25/IOA2 SEG26/IOA3 SEG27/IOA4 SEG28/IOB1/ELC SEG29/IOB2/ELP SEG30/IOB3/BZB SEG31/IOB4/BZ SEG32/IOC1/KI1 SEG33/IOC2/KI2 SEG34/IOC3/KI3 SEG35/IOC4/KI4 RESET INT TEST
X 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1602.50 1472.50 1357.50 1242.50 1127.50 1012.50 897.50 782.50 667.50 552.50 437.50 322.50 207.50
Y 344.70 464.10 579.10 694.10 809.10 924.10 1039.10 1154.10 1269.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10 1399.10
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
PIN DESCRIPTION
Name BAK VDD1,2,3 I/O P P Description Power Back-up pin(+). . At Li Mode, connect a 0.1u capacitor to GND. LCD supply voltage and positive supply pins. . In Ag power mode, connect positive power to VDD1. . In Li or ExtV power mode, connect positive power to VDD2. Input pin for external reset request signal, built-in internal pull-down resistor. . Reset cycle time can be defined as "PH15/2" or "PH12/2" by mask option. . Reset Type can be defined as "Level reset" or "Pulse reset" by mask option. Input pin for external interrupt request signal. . Falling edge or rising edge triggered is defined by mask option. . Internal pull-down or pull-up resistor is defined by mask option. Test signal input pin. Switching pins for supply the LCD driving voltage to the VDD1,2,3 pins. . Connect the CUP1 and CUP2 pins with non-polarized electrolytic capacitor when chip operated in 1/2 or 1/3 bias mode. . In no BIAS mode application, leave these pins opened Time base counter frequency (clock specified. LCD alternating frequency. Alarm signal frequency) or system clock oscillation. . 32KHz Crystal oscillator. . In FAST ONLY mode option, connect an external resistor could compose a RC oscillator. Output pins for driving the common pins of the LCD or LED panel. Output pins for driving the LCD or LED panel segment. Input / Output port A. Input / Output port B. Input / Output port C. Output port for EL driver. Output port for alarm, clock or single tone melody generator Output port for key matrix scanning.(Shared with SEG1~SEG16) Input port for key matrix. Negative supply voltage.
RESET
I
INT
I
TESTA CUP1,2
I O
XIN XOUT
I O
COM1~5 SEG1-12,2135 IOA1-4 IOB1-4 IOC1-4 ELC/ELP BZB/BZ K1~16 KI1~4 GND
O O I/O I/O I/O O O O I P
4
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
ABSOLOUTE MAXIMUM RATINGS
(GND= 0V) Name Symbol VDD1 Maximum Supply Voltage VDD2 VDD3 Maximum Input Voltage Maximum output Voltage Vin Vout1 Vout2 Maximum Operating Temperature Maximum Storage Temperature Topg Tstg Range -0.3 to 5.5 -0.3 to 5.5 -0.3 to 8.5 -0.3 to VDD1/2+0.3 -0.3 to VDD1/2+0.3 -0.3 to VDD3+0.3 -20 to +70 -25 to +125 Unit V V V V V V
POWER CONSUMPTION
at Ta=-20 to 70,GND= 0V Name HALT mode Sym. Condition Min. Typ. 2 Max. Unit uA
IHALT1 Only 32.768KHz Crystal oscillator operating, without loading. Ag mode, VDD1=1.5V, BCF = 0 IHALT2 Only 32.768KHz Crystal oscillator operating, without loading. Li mode, VDD2=3.0V, BCF = 0
2
uA
STOP mode ISTOP 1 uA Note : When RC oscillator function is operating, the current consumption will depend on the frequency of oscillation.
INTERNAL RC FREQUENCY RANGE
Option Mode 250KHz BAK 1.2V~1.5V 2.4V~5.0V 500KHz 1.2V~1.5V 2.4V~5.0V Min. 300KHz 200KHz 550KHz 400KHz Typ. 350KHz 250KHz 650KHz 500KHz Max. 400KHz 300KHz 750KHz 600KHz
5
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
ALLOWABLE OPERATING CONDITIONS
at Ta=-20 to 70,GND= 0V Name Symb. VDD1 Supply Voltage VDD2 VDD3 Oscillator Start-Up Voltage Oscillator Sustain Voltage Supply Voltage Supply Voltage Input "H" Voltage Input "L" Voltage Input "H" Voltage Input "L" Voltage Input "H" Voltage Input "L" Voltage Input "H" Voltage Input "L" Voltage Input "H" Voltage Input "L" Voltage Input "H" Voltage Input "L" Voltage Operating Freq VDDB VDD1 VDD2 Vih1 Vil1 Vih2 Vil2 Vih3 Vil3 Vih4 Vil4 Vih5 Vil5 Vih6 Vil6 Fopg1 Fopg2 Crystal Mode RC Mode OSCIN at Ag Battery Mode Li Battery Mode Crystal Mode Ag Mode EXT-V, Li Mode Ag Battery Mode 1.2 1.2 2.4 1.65 5.25 V V V V V V V V V V V V V V V KHZ 1000 KHZ VDDB Crystal Mode 1.3 V Condition Min. 1.2 2.4 2.4 Max. 5.25 5.25 8.0 Unit V V V
VDD1-0.7 VDD1+0.7 -0.7 0.7
VDD2-0.7 VDD2+0.7 -0.7 0.8xVDD1 0 0.7 VDD1 0.2xVDD1 VDD2 0.2xVDD2 VDD2 0.2xVDD2 VDDO 0.2xVDDO
OSCIN at Li Battery 0.8xVDD2 Mode 0
CFIN at Li Battery 0.8xVDD2 or EXT-V Mode RC Mode 0 0.8xVDDO 0 32 10
6
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
ELECTRICAL CHARACTERISTICS
at#1:VDD1=1.2V(Ag); at#2:VDD2=2.4V(Li): at#3:VDD2=4V(Ext-V);
Input Resistance
Name "L" Level Hold Tr(IOC) Symb. Rllh1 Rllh2 Rllh3 IOC Pull-Down Tr Rmad1 Rmad2 Rmad3 INT Pull-up Tr Rintu1 Rintu2 Rintu3 INT Pull-Down Tr Rintd1 Rintd2 Rintd3 RES Pull-Down R Rres1 Rres2 Rres3 Condition Vi=0.2VDD1,#1 Vi=0.2VDD2,#2 Vi=0.2VDD2,#3 Vi=VDD1,#1 Vi=VDD2,#2 Vi=VDD3,#3 Vi=VDD1,#1 Vi=VDD2,#2 Vi=VDD3,#3 Vi=GND,#1 Vi=GND,#2 Vi=GND,#3 Vi=GND or VDD1,#1 Vi=GND or VDD2,#2 Vi=GND or VDD2,#3 Min. 10 10 5 200 200 100 200 200 100 200 200 100 5 5 5 Typ. 40 40 20 500 500 250 500 500 250 500 500 250 20 20 20 Max. 100 100 50 1000 1000 500 1000 1000 500 1000 1000 500 50 50 50 Unit Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm
DC Output Characteristics
Name Symb. Condition Port Min. 0.8 1.5 SEG1~12 SEG13~35 2.5 0.2 0.3 0.5 Typ. 0.9 1.8 3.0 0.3 0.6 1.0 Max. 1.0 2.1 3.5 0.4 0.9 1.5 Unit V V V V V V Voh1c Ioh=-200uA,#1 Output "H" Voltage Voh2c Ioh=-1mA,#2 Voh3c Ioh=-3mA,#3 Vol1c Output "L" Voltage Vol2c Vol3c Iol=400uA,#1 Iol=2mA,#2 Iol=6mA,#3
7
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
Segment Driver Output Characteristics
Name Symb. Condition Static Display Mode Voh1d Ioh=-1uA,#1 Output "H" Voltage Voh2d Ioh=-1uA,#2 Voh3d Ioh=-1uA,#3 Vol1d Output "L" Voltage Vol2d Vol3d Iol=1uA,#1 Iol=1uA,#2 Iol=1uA,#3 1.0 2.2 COM-n 3.8 0.2 0.2 0.2 SEG-n 1.0 2.2 3.8 0.2 0.2 0.2 V V V V V V V V V V V V For Min. Typ. Max. Unit.
Voh1e Ioh=-10uA,#1 Output "H" Voltage Voh2e Ioh=-10uA,#2 Voh3e Ioh=-10uA,#3 Vol1e Output "L" Voltage Vol2e Vol3e Iol=10uA,#1 Iol=10uA,#2 Iol=10uA,#3 1/2 Bias Display Mode Output "H" Voltage Voh12f Ioh=-1uA,#1,#2 Voh3f Output "L" Voltage Ioh=-1uA,#3 SEG-n
2.2 3.8 0.2 0.2 2.2 COM-n 3.8 1.0 COM-n 1.8 1.4 2.2 0.2 0.2
V V V V V V V V V V
Vol12f Iol=1uA,#1,#2 Vol3f Iol=1uA,#3
Output "H" Voltage
Voh12g Ioh=-10uA,#1,#2 Voh3g Ioh=-10uA,#3
Output "M" Voltage
Vom12g Iol/h=+/-10uA,#1,#2 Vom3g Iol/h=+/-10uA,#3
Output "L" Voltage
Vol12g Iol=10uA,#1,#2 Vol3g Iol=10uA,#3 1/3 Bias display Mode
Output "H" Voltage
Voh12i Ioh=-1uA,#1,#2 Voh3i Ioh=-1uA,#3
3.4 5.8 1.0 SEG-n 1.8 2.2 3.8 1.4 2.2 2.6 4.2 0.2 0.2 8
V V V V V V V V
Output "M1" Voltage
Vom12i Iol/h=+/-10uA,#1,#2 Vom13i Iol/h=+/-10uA,#3
Output "M2" Voltage
Vom22i Iol/h=+/-10uA,#1,#2 Vom23i Iol/h=+/-10uA,#3
Output "L" Voltage
Vol12i Vol3i
Iol=1uA,#1,#2 Iol=1uA,#3
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
Output "H" Voltage Voh12j Ioh=-10uA,#1,#2 Voh3j Output "M1" Voltage Ioh=-10uA,#3 3.4 5.8 1.0 COM-n 1.8 2.2 3.8 1.4 2.2 2.6 4.2 0.2 0.2 V V V V V V V V
Vom12j Iol/h=+/-10uA,#1,#2 Vom13j Iol/h=+/-10uA,#3
Output "M2" Voltage
Vom22j Iol/h=+/-10uA,#1,#2 Vom23j Iol/h=+/-10uA,#3
Output "L" Voltage
Vol12j Vol3j
Iol=10uA,#1,#2 Iol=10uA,#3
9
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
TYPICAL APPLICATION CIRCUIT This application circuit is simply an example, and is not guaranteed to work.
LCD Panel
15P XIN 15P 32.768KHz Crystal XOUT
COM1~5, SEG1~12, SEG21~35 CUP1
0.1u
CUP2 VDD3 VDD2
RH RT RR CX
VDD1 BAK
0.1u
0.1u
0.1u 1.5V 0.1u
GND
0.1u
TM8713
ELP RESET
L
EL Plant
External INT. I/O Port
INT IOA,IOB,IOC
ELC
Choke BZ(BZB)
Buzzer
K1~12
KI1~KI4
Key Scaning
Key Matrix
Ag power mode, 1/3 Bias, 1/5 Duty
10
tenx technology, inc.
Rev.1.4 2001/9/4

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