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 YAS525B
MS-1C
Magnetic field Sensor
Overview
YAS525B is the biaxial geomagnetic sensor IC integrating a high sensitivity biaxial magnetic sensor, a buffer amplifier, an AD converter (ADC), a clock generator, and serial data interface (supports I2C bus) on one chip. YAS525B allows you to make up a high sensitive, compact and low-power electronic compass in a portable GPS system or a mobile phone.
Features
A manufacturing process that makes magnetic sensor on a Si wafer with high precision realizes integration with peripheral circuits. High sensitive geomagnetic sensor IC is realized by integrating a magnetic sensor and a low noise buffer amplifier. High noise immunity is improved by digitizing output from geomagnetic sensor IC. External interface supports I2C bus (100kbps/400kbps, slave mode). Geomagnetic sensor with superior high board density and low-power consumption. Automatic power-down control mode is available after measurements. Others. Manufacturing process .......................... CMOS + Magnetic Sensor Package ................................................. Lead-free 8-ball WLCSP Package (YAS525B-WZ) Power supply voltage ............................ 2.5 3.3V Operating temperature .......................... -20 +85C Power consumption during operation ... 10mW (VDD=3.0Vwhen magnetic field is measured.) Magnetic sensor section Measuring magnetic field range ... 300T Resolution ..................................... 0.6T/count Measuring time ..................................... within 10ms/magnetic sensor mono-axial measurement
YAS525B CATALOG CATALOG No.: LSI-BAS525B21 2007.6
YAS525B
Pin Description
Here is a figure for pin assignment and a table for pin descriptions.
3 2 1 8 5 6 7 7 5 6 8 3 2 1
4
4
8Pin WLCSP Top View
8Pin WLCSP Bottom View
Pin Descriptions Pin No. Name I/O Function 1 T2 I+ Test input (Use in non-connection) 2 VSS Ground 3 T1 I+ Test mode (Use in non-connection) 4 SCL Is Serial Clock 5 NC Non-connection 6 VDD Power supply (typ 3V) 7 NC Non-connection 8 SDA Is/Od Serial data Note: Pin 1 and pin 3 are used in non-connection. Pin 5 is connected to pin 7 in the chip. I+ : Input with pull-up resistor Is : Schmitt trigger input Od : Open drain output
Pin Functions Power Supply (VDD, VSS)
These pins are for power supply of YAS525B.
Serial Data Interface (SCL, SDA)
SCL Serial clock input pin. This pin is used with an external pull-up register. SDA Serial data input/output pin. This pin is used with an external pull-up register.
Others (T1, T2)
T1 T2 Test mode control pin. Use this pin in non-connection. Test input pin. Use this pin in non-connection.
2
YAS525B
Block Diagram
Here is the internal block diagram of YAS525B. T1
X-axis Magnetic Sensor Initialization Coils
T2 VDD
Buffer Amplifier A/D Converter
Power-down Controller
Y-axis Magnetic Sensor Thermal Sensor
Serial Data Interface (Registers)
SCL SDA
Clock Generator
Power-on Reset Circuit
VSS
Block Diagram
3
YAS525B
Function Descriptions Analog Circuit Section
Magnetic Sensor A sensor for X-axis and Y-axis is embedded independently. (As for sensitivity direction of X-axis and Y-axis, see the following figure.)
Y-axis
X-axis
Chip alignment and X,Y-axis Buffer Amplifier The amplifier amplifies a signal from the magnetic sensor output. Thermal Sensor The sensor is a thermal sensor for the compensation of temperature characteristics of the magnetic sensor. A/D Converter (ADC) The ADC converts magnetic sensor output and temperature sensor output into digital data. Clock Generator The clock generation section supplies clocks for ADC and digital circuits. Power-on Reset The section detects a rising of the power-on and initializes circuits. Initialization Coil The coil is used when the magnetic sensor cannot give original characteristics due to receiving strong magnetic field. Generating magnetic field by the initialization coil initializes the magnetic sensor characteristics. The initialization coil is operated by setting Config register CONFR [3:0].
Digital Circuit Section
Serial Data Interface YAS525B serial data interface supports I2C serial interface and operates in the slave mode.
4
YAS525B
Example of System Configuration
Here is an example of system configuration.
3V
VDD
SCL
YAS525
GND VSS SDA
T1 T2
Host CPU (I2C master)
I2C Device
I2C Device
Example of system configuration
5
YAS25B
Package Outline Drawing
Caution * The product of the WLCSP package should be used under light-shielded conditions. Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the wafer, the device may malfunction (leak current increase etc.) due to electric charge internally generated by the photoelectric effect. * Please mount the package without underfill because temperature correction may not be normally performed when mounting YAS525B on a board.
6
YAS525B
YAS525B


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