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| HDJD-J822 Color Management System Feedback Controller Data Sheet Description The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of JEDEC. Avago Technologies tests parts at the absolute maximum rated conditions recommended for the device. The actual performance you obtain from Avago Technologies parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1. Failure Rate Prediction The junction temperature of the device determines the failure rate of semiconductor devices. The relationship between ambient temperature and actual junction temperature is given by the following: TJ(C) = TA(C) + JAPAVG where: TA = ambient temperature in C JA = thermal resistance of junction-to-ambient in C/ Watt PAVG = average power dissipated in Watt The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table below using activation energy of 0.7eV. Table 1. Life Tests Demonstrated Performance Performance in Time (60% confidence) MTBF [1] 2.52 x 105 Failure Rate [2] (FIT) 3968 Test Name High Temperature Operating Life Stress Test Conditions TA = 85C, AVdd = 5.5V, DVdd = 5.5V Total Device Hrs 231,000 Units Tested 231 Units Failed 0 Table 2. Ambient Temperature (C) 85 75 65 55 45 35 25 Junction Temperature [3] (C) 87 82 77 57 47 37 27 Performance in Time (60% Confidence) MTBF [1] (hrs) 2.52 x 105 4.81 x 105 9.52 x 105 1.97 x 106 4.25 x 106 9.65 x 106 2.32 x 107 Failure Rate [2] (FIT) 3968 2080 1050 508 235 104 43 Performance in Time (90% Confidence) MTBF (hrs) 1.00 x 105 1.91 x 105 3.79 x 105 7.83 x 105 1.69 x 106 3.84 x 106 9.22 x 106 Failure Rate (FIT) 9970 5225 2638 1277 591 260 108 Notes: 1. The 60% or 90% confidence MTBF represents the minimum level of reliability performance which is expected from 60% or 90% of all samples. The confidence level is established based on the chi-square distribution. 2. Failure rate (FIT) is 1/MTBF x 109, assuming the failures are exponentially distributed. 3. Calculated from data generated at 85C biased at DVdd 5.5V, AVdd 5.5V and JA = 45C/watt Table 3. Environmental Tests Test Name Temperature Cycle HAST Autoclave High Temperature Storage Test Conditions -65C/+150C, 500 cycles 130C/85%RH, 96 hrs 121C, 15psig, 96 hrs 150C, 1000hrs Units Tested 231 231 231 45 Units Failed 0 0 0 0 Table 4. Electrostatic Discharge (ESD) Classification Test Results: Test Name ESD Human Body Model ESD Machine Model Latch up at 125C Reference MILSTD 883, Method 3015 MILSTD 883, Method 3015 AEC-Q100-004 Results 2000V 200V Pass (+/-100mA) Moisture Sensitivity Classification: Class 3 Pre-conditioning per JESD22-A113-A class 3 was performed on all devices prior to reliability testing except for High Temperature Operating Life and electrical verification test. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. 5989-4106EN - April 21, 2006 |
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