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| EMIF02-USB01F2 2-line IPADTM, EMI filter including ESD protection Features 2-line low-pass filter + ESD protection High efficiency in EMI filtering Lead-free package Very low PCB space occupation: < 2.5 mm2 Very thin package: 0.65 mm High efficiency in ESD suppression (IEC61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Pin configuration (bump side view) 3 Pup Flip Chip (8 bumps) 2 1 Vbus Complies with the following standards DZ A B IEC 61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) D+ in GND Din D+ out C D Dout E Application ESD protection and EMI filtering for: Figure 2. Schematic Pup USB port Vbus 1.3K 33 DZ D+ out Description The EMIF02-USB01F2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB01F2 Flip Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV. D+ in GND 33 D- out D- in TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 3 1/8 www.st.com 8 Electrical characteristics EMIF02-USB01F2 1 Electrical characteristics Table 1. Symbol Tj Top Tstg Absolute ratings (Tamb = 25 C) Parameter junction temperature Operating temperature range Storage temperature range Value 125 -40 to +85 -55 to 150 Unit C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM Cline R1, R2 R3 Electrical characteristics (Tamb = 25 C) Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V @0V Tolerance 5 % Tolerance 5 % 40 33 1.30 Min 6 0.5 45 Typ Max Unit V A pF k slope: 1/Rd 2/8 EMIF02-USB01F2 Electrical characteristics Figure 3. 0.00 dB -5.00 -10.00 S21 (dB) attenuation measurement Figure 4. 0.00 dB -10.00 -20.00 -30.00 Analog crosstalk measurements EMIF02-USB01: filtering response of lines C1/C3 and E1/E3 -15.00 -40.00 -20.00 -50.00 -25.00 -30.00 -35.00 -40.00 -45.00 -50.00 1.0M E1_E3 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G C1_C3 3.0G -60.00 -70.00 -80.00 -90.00 -100.0 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Frequency/Hz f/Hz Figure 5. ESD response to IEC61000-4-2 (+15 kV air discharge) on one input V(in) and on one output (Vout) Figure 6. ESD response to IEC61000-4-2 (-15 kV air discharge) on one input V(in) and on one output (Vout) Vin : 10V/d Vin : 5V/d Vout : 10V/d 100ns/d Vout : 5V/d 100ns/d Figure 7. Capacitance versus reverse applied voltage (typical) C(pF) 40 35 30 25 20 15 VR(V) 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 3/8 Application information EMIF02-USB01F2 2 Application information Figure 8. 3.8nH C1 Csub rsub_1k3 rsub_1k3 Csub Aplac model (resistors, diodes and bumps and ground connections) R_1k3 A3 0.15nH D02_usb A1, A3, B2, C1, C3, E1, E3 Cbump Rsubump I/O bulk D2 Lbump 100m D2 bulk Rbump bulk 0.15nH cap_33R R_33R Csub rsub_33R Csub rsub_33R 0.23nH C3 cap_33R Lgnd_D Rsub_D D02_usb D02_Nw Lhole caphole Rhole D2 bulk bulk 0.3nH E1 cap_33R Csub rsub_33R Csub rsub_33R R_33R 0.7nH E3 cap_33R bulk Figure 9. Aplac model parameters R_33R 33.9 cap_33R 1.2pF R_1k3 1.3k Cz29pF Rsub_D 100 Csub0.3pF Rsub_33R 15 Rsub_1k3 50 lhole10pH Rhole400m Caphole0.4pF Lgnd_D 150pH Lbump50pH Rbump50m Cbump1.5pF Rsubump150 Model D02_Nw BV=100 IBV=1m CJO=6.8p M=0.3333 RS=2 VJ=0.6 TT=100n Model D02_usb BV=16 IBV=1m CJO=Cz M=0.3333 RS=2 VJ=0.6 TT=100n 4/8 EMIF02-USB01F2 Ordering information scheme 3 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip X = 2: Lead-free, pitch = 500 m, bump = 315 m yy - xxx zz Fx 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Package dimensions 700 50 315 50 650m 65 49 5 m 50 285 m 285m 1.27mm 50m 1.97mm 50m 5 49 m 50 5/8 Ordering information EMIF02-USB01F2 Figure 12. Footprint Copper pad Diameter: 250 m recommended, 300 m max Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 315 m copper pad diameter xxz y ww Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 1.75 0.1 3.5 0.1 2.07 0.73 0.05 All dimensions in mm 8 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 0.1 1.37 5 Ordering information Table 3. Ordering information Marking FF Package Flip Chip Weight 3.35 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF02-USB01F2 Note: More information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: "EMI filters: Recommendations and measurements" 6/8 EMIF02-USB01F2 Revision history 6 Revision history Table 4. Date 26-Oct-2004 16-Apr-2007 29-Apr-2008 Document revision history Revision 1 2 3 Initial release. Updated ECOPACK statement. Updated Figure 10, Figure 11 and Figure 14. Reformatted to current standards. Typographical errors corrected. Changes 7/8 EMIF02-USB01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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