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100336 E006890 NDUA116T LW1141C YMF753 IRF4905S LF248 CM709
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  Datasheet File OCR Text:
 RS2A THRU RS2K
Features
* For surface mounted applications in order optimize board space * Low profile package * Built-in strain relief, ideal for automated placement * Fast switching speed * Plastic package has Unerwrites Laboratory Flammability Classification 94V-0 * Low forward voltage drop * Glass passivated chip junction * High temperature soldering : 250E /10 seconds at terminals
CURRENT 1.5 Amperes VOLTAGE 50 to 800 Volts
DO-214AA (SMB)
0.083(2.11) 0.075(1.91) 0.155(3.94) 0.130(3.30)
0.185(4.70) 0.160(4.06) 0.012(0.31) 0.006(0.15) 0.096(2.44) 0.083(2.13) 0.050(1.27) 0.030(0.76) 0.008(0.203) MAX. 0.220(5.59) 0.200(5.08)
Mechanical Data
* Case : JEDEC SMB(DO-214AA) molded plastic body * Terminals : Plated axial lead solderable per MIL-STD-750, method 2026 * Polarity : Color band denotes cathode end * Weight : 0.003 ounce, 0.093 gram
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
(Ratings at 25E ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%)
Symbols
Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=100E Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Maximum instantaneous forward voltage at 1.5A Maximum reverse current at rated voltage TA=25E TA=125E VRRM VRMS VDC I(AV) IFSM VF IR Trr Re JL Re JA CJ TJ TSTG
RS2A
50 35 50
RS2B
100 70 100
RS2D
200 140 200 1.5 50.0 1.30 5.0 200 150 18.0 55.0 50.0
RS2G
400 280 400
RS2J
600 420 600
RS2K
800 560 800
Units
Volts Volts Volts Amps Amps Volts iA
Maximum reverse recovery time (Note 1) Typical thermal resistance (Note 3) Typical junction capacitance (Note 2) Operating junction and storage temperature range
250
500
nS E /W pF E
-55 to +150
Notes:
(1) Test conditions: IF=0.5A, IR=1.0A, Irr=0.25A. (2) Measured at 1MHz and applied reverse voltage of 4.0 Volts. (3) Thermal resistance from junction to ambient and junction to lead mounted on PCB mounted on 0.27 0.27"(7.0 7.0mm) copper pad areas
RATINGS AND CHARACTERISTIC CURVES RS2A THRU RS2K
FIG.1-FORWARD CURRENT DERATING CURVE FIG.2-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT
PEAK FORWARD SURGE CURRENT (AMPERES) 50
TL=100E 8.3m SINGLE HALF SINE WAVE (JEDEC Method)
AVERAGE FORWARD CURRENT (A)
1.5
RESISTIVE OR INDUCTIVE LOAD
40
1.0
30
0.5
P.C.B.MOUNTED ON 0.27X0.27"(7.0X7.0mm) COPPER PAD AREAS
20
0
10
50
60
70
80
90
100 110
120
130 140
150
160
LEAD TEMPERATURE ( E )
0 1 2 4 6 8 10 20 40 60 100 NUMBER OF CYCLES AT 60Hz
FIG.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
20 10
FIG.4-TYPICAL JUNCTION CAPACITANCE
30
TJ=25E f=1.0MHz Vsig=50mVp-p
INSTANTANEOUS FORWARD CURRENT (AMPERES)
1
TJ=25E
JUNCTION CAPACITANCE (pF)
10 0.1 1 10 REVERSE VOLTAGE. (V)
PULSE WIDTH=300ms 1% DUTY CYCLE
100
0.01 0.4 0.6 0.8 1.0 1.2
1.4
1.6
1.8
FIG.5-TYPICAL REVERSE CHARACTERISTICS
100
TJ=125E
INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
INSTANTANEOUS REVERSE CURRENT MICROAMPERES
10
1
0.1 0 20 40 60 80
TJ=25E
100
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)


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