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 Si3850ADV
Vishay Siliconix
Complementary MOSFET Half-Bridge (N- and P-Channel)
PRODUCT SUMMARY
VDS (V) N-Channel 20 rDS(on) () 0.300 at VGS = 4.5 V 0.410 at VGS = 3.0 V 0.640 at VGS = - 4.5 V 0.980 at VGS = - 3.0 V ID (A) 1.4 1.2 - 0.96 - 0.78
FEATURES
* 100 % Rg Tested
RoHS
COMPLIANT
P-Channel
- 20
TSOP-6 Top View
G1 D 1 6 S1 D G2
S2
2
5
D
G2
3
4
S2
G1
Ordering Information: SI3850ADV-T1-E3 (Lead (Pb)-free)
S1
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 C) Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipation (Surface Mounted on FR4 Board) Operating Junction and Storage Temperature Range TA = 25 C TA = 70 C TA = 25 C TA = 70 C Symbol VDS VGS ID IDM IS PD TJ, Tstg N-Channel 20 12 1.4 1.1 3.5 0.9 1.08 0.70 - 55 to 150 - 0.96 - 0.77 - 2.0 - 0.9 P-Channel - 20 Unit V
A
W C
THERMAL RESISTANCE RATINGS
Parameter Maximum Junction-to-Ambient (Sourface Mounted on FR4 Board, 10 sec) Symbol RthJA N- or P-Channel 115 Unit C/W
Notes: Maximum under Steady State condition is 150 C/W.
Document Number: 73789 S-60470-Rev. A, 27-Mar-06
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Si3850ADV
Vishay Siliconix
SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter Static Gate Threshold Voltage Gate-Body Leakage VGS(th) IGSS VDS = VGS, ID = 250 A VDS = VGS, ID = - 250 A VDS = 0 V, VGS = 12 V VDS = 20 V, VGS = 0 V Zero Gate Voltage Drain Current IDSS VDS = - 20 V, VGS = 0 V VDS = 20 V, VGS = 0 V, TJ = 70 C VDS = - 20 V, VGS = 0 V, TJ = 70 C On-State Drain Currentb ID(on) VDS = 5 V, VGS = 4.5 V VDS = - 5 V, VGS = - 4.5 V VGS = 4.5 V, ID = 0.5 A Drain-Source On-State Resistanceb rDS(on) VGS = - 4.5 V, ID = - 0.5 A VGS = 3.0 V, ID = 0.5 A VGS = - 3.0 V, ID = - 0.5 A Forward Transconductanceb Diode Forward Voltageb Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Body Diode Reverse Recovery Tme Body Diode Reverse Recovery Charge Qg Qgs Qgd Rg td(on) tr td(off) tf trr Qrr N-Channel VDD = 10 V, RL = 10 ID 0.9 A, VGEN = 4.5 V, RG = 1 P-Channel VDD = - 10 V, RL = 10 ID - 0.9 A, VGEN = - 4.5 V, RG = 1 IF = 0.9 A, di/dt = 100 A/s IF = - 0.9 A, di/dt = 100 A/s IF = 0.9 A, di/dt = 100 A/s IF = - 0.9 A, di/dt = 100 A/s P-Channel VDS = - 10 V, VGS = - 4.5 V, ID = - 1 A N-Ch N-Channel VDS = 10 V, VGS = 4.5 V, ID = 1 A P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 0.95 1.10 0.22 0.28 0.24 0.26 3.5 10.5 8 13 16 34 20 18 9 18 20 25 9 9 5.3 16 14 20 25 50 30 30 15 30 30 40 15 15 nC ns 1.4 1.7 nC gfs VSD VDS = 10 V, ID = 1 A VDS = - 10 V, ID = - 1 A IS = 0.9 A, VGS = 0 V IS = - 0.8 A, VGS = 0 V N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 3.0 - 1.5 0.240 0.510 0.325 0.780 1.8 1.1 0.87 - 1.0 1.2 - 1.3 0.300 0.640 0.410 0.980 S V N-Ch P-Ch 0.6 - 0.6 1.5 - 1.5 100 1 -1 10 - 10 A A V nA Symbol Test Conditions Min Typ Max Unit
Notes: a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width 300 s, duty cycle 2 %.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 73789 S-60470-Rev. A, 27-Mar-06
Si3850ADV
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS
3.5 VGS = 5.0 thru 4 V 3.0 3V I D - Drain Current (A) I D - Drain Current (A) 2.5 2.0 2.5 V 1.5 1.0 0.5 2V 0.0 0.0 0.0 0.7 1.4 2.1 2.8 3.5 0 1 2 3 4 2.4 25 C 1.8 TC = 125 C 1.2
25 C, unless noted
3.0 - 55 C
0.6
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
0.7 0.6 0.5 0.4 0.3 0.2 22 0.1 0.0 0.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 4 Crss VGS = 4.5 V VGS = 3 V C - Capacitance (pF) VGS = 2.5 V 88 110
Transfer Characteristics
r DS(on)- On-Resistance ()
66
Ciss
44 Coss
8
12
16
20
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
10 V GS - Gate-to-Source Voltage (V) ID = 1 A 8 VDS = 5 V rDS(on) - On-Resistance (Normalized) VDS = 10 V 1.6 1.8 ID = 1.2 A
Capacitance
VGS = 3 V
1.4 VGS = 4.5 V 1.2
6
4
VGS = 15 V
1.0
2
0.8
0 0.0
0.5
1.0
1.5
2.0
2.5
0.6 - 50
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 73789 S-60470-Rev. A, 27-Mar-06
www.vishay.com 3
Si3850ADV
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 C, unless noted
10 1.5
1
r DS(on)- On-Resistance ()
150 C I S - Source Current (A)
1.2
25 C 0.1
0.9
0.6
125 C
0.01
0.3
25 C
0.001 0.0 0.3 0.6 0.9 1.2 1.5
0.0 0 1 2 3 4 5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.2 30
On-Resistance vs. Gate-to-Source Voltage
0.1 24 V GS(th) Variance (V) - 0.0 Power (W) 18
- 0.1 ID = 5 mA - 0.2
12
- 0.3
ID = 250 A
6
- 0.4 - 50
- 25
0
25
50
75
100
125
150
0 0.001
0.01
0.1 Time (sec)
1
10
TJ - Temperature (C)
Threshold Voltage
Single Pulse Power
10
*Limited by rDS(on) I D - Drain Current (A) 1 1 ms
10 ms
0.1 TA = 25 C Single Pulse BVDSS Limited 0.1 1 10
100 ms 1s 10 s dc
0.01
100
VDS - Drain-to-Source Voltage (V) * VGS minimum VGS at which rDS(on) is specified
Safe Operating Area www.vishay.com 4 Document Number: 73789 S-60470-Rev. A, 27-Mar-06
Si3850ADV
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 C, unless noted
1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance
0.2 0.1 0.1 0.05 0.02
PDM t1 t2 1. Duty Cycle, D =
Notes:
2. Per Unit Base = RthJA = 100 C/W
t1 t2
Single Pulse 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
Document Number: 73789 S-60470-Rev. A, 27-Mar-06
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Si3850ADV
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 C, unless noted
2.5 VGS = 5 thru 4 V 2.0 I D - Drain Current (A) I D - Drain Current (A) 3.5 V 1.5 3V 1.0 2.5 V 0.5 2V 0.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 1 2 3 4 5 1.6 25 C 1.2 TC = 125 C 2.0 - 55 C
0.8
0.4
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
2.5 110
Transfer Characteristics
r DS(on)- On-Resistance ()
C - Capacitance (pF)
2.0
VGS = 2.5 V
88
Ciss
1.5
VGS = 3 V
66
1.0 VGS = 4.5 V 0.5
44
Coss
22
Crss
0.0 0.0
0 0.5 1.0 1.5 2.0 2.5 0 4 8 12 16 20 ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
10 V GS - Gate-to-Source Voltage (V) ID = 1 A VDS = 5 V 8 VDS = 10 V 6 VGS = 15 V rDS(on) - On-Resi stance (Normalized) 1.6 1.8 ID = 0.5 A
Capacitance
VGS = 3 V
1.4 VGS = 4.5 V
1.2
4
1.0
2
0.8
0 0.0
0.5
1.0
1.5
2.0
2.5
0.6 - 50
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
On-Resistance vs. Junction Temperature
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Document Number: 73789 S-60470-Rev. A, 27-Mar-06
Si3850ADV
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 C, unless noted
10 3.0
1
r DS(on)- On-Resistance ()
TJ = 150 C I S - Source Current (A)
2.4
25 C 0.1
1.8 125 C 1.2 25 C 0.6
0.01
0.001 0.0 0.4 0.8 1.2 1.6 2.0
0.0 0 1 2 3 4 5
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.4 30
On-Resistance vs. Gate-to-Source Voltage
0.3 V GS(th) Variance (V) ID = 250 A 0.2 Power (W) 18 24
0.1
ID = 5 mA
12
0.0 6
- 0.1
- 0.2 - 50
- 25
0
25
50
75
100
125
150
0 0.001
0.01
0.1 Time (sec)
1
10
TJ - Temperature (C)
Threshold Voltage
10
Single Pulse Power vs. Junction-to-Ambient
*Limited by rDS(on) I D - Drain Current (A) 1 1 ms
10 ms
0.1 TA = 25 C Single Pulse BVDSS Limited 0.1 1 10
100 ms 1s 10 s dc
0.01
100
VDS - Drain-to-Source Voltage (V) * VGS minimum VGS at which rDS(on) is specified
Safe Operating Area
Document Number: 73789 S-60470-Rev. A, 27-Mar-06
www.vishay.com 7
Si3850ADV
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 C, unless noted
1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance
0.2 0.1 0.1 0.05 0.02
PDM t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 100 C/W
Notes:
Single Pulse 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?73789.
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Document Number: 73789 S-60470-Rev. A, 27-Mar-06
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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