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| STL15N3LLH5 N-channel 30 V, 0.0045 15 A, PowerFLATTM (3.3 x 3.3) , STripFETTM V Power MOSFET Preliminary Data Features Type STL15N3LLH5 VDSS 30V RDS(on) <0.0054 ID 15A (1) 1. The value is rated according Rthj-pcb RDS(on) * Qg industry benchmark Extremely low on-resistance RDS(on) Very low switching gate charge High avalanche ruggedness Low gate drive power losses PowerFLATTM(3.3x3.3) (Chip scale package) Applications Switching applications Figure 1. Internal schematic diagram Description This product utilizes the 5th generation of design rules of ST's proprietary STripFETTM technology. The lowest available RDS(on)*Qg, in this chip scale package, makes this device suitable for the most demanding DC-DC converter applications, where high power density is to be achieved. Table 1. Device summary Order code Marking 15N3LLH5 Package PowerFLATTM (3.3 x 3.3) Packaging Tape and reel STL15N3LLH5 August 2008 Rev 1 1/10 www.st.com 10 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. Contents STL15N3LLH5 Contents 1 2 3 4 5 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test circuit ................................................ 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2/10 STL15N3LLH5 Electrical ratings 1 Electrical ratings Table 2. Symbol VDS VGS ID(1) ID (1) IDM (2) Absolute maximum ratings Parameter Drain-source voltage (VGS = 0) Gate-source voltage Drain current (continuous) at TC = 25 C Drain current (continuous) at TC=100 C Drain current (pulsed) Total dissipation at TC = 25 C Total dissipation at TC = 25 C Derating factor Value 30 22 15 9.3 60 50 2 0.4 -55 to 150 Unit V V A A A W W W/C C PTOT(3) PTOT(1) TJ Tstg Operating junction temperature storage temperature 1. The value is rated according Rthj-pcb 2. Pulse width limited by safe operating area. 3. The vaule is rated according Rthj-c Table 3. Symbol Rthj-case Rthj-pcb Rthj-pcb (1) (2) Thermal resistance Parameter Thermal resistance junction-case (drain) Thermal resistance junction-pcb Thermal resistance junction-pcb Value 2.5 42.8 63.5 Unit C/W C/W C/W 1. When mounted on FR-4 board of 1inch, 2oz Cu, t < 10sec 2. Steady state 3/10 Electrical characteristics STL15N3LLH5 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 4. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250 A, VGS= 0 VDS = Max rating, VDS = Max rating @125 C VGS = 22 V VDS= VGS, ID = 250 A VGS= 10 V, ID= 7.5 A VGS= 4.5 V, ID= 7.5 A 1 Min. 30 1 10 100 Typ. Max. Unit V A A nA V 2.5 0.0045 0.0054 0.006 0.0075 Table 5. Symbol Ciss Coss Crss Qg Qgs Qgd RG Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-source charge Gate-drain charge Test conditions VDS =25 V, f=1 MHz, VGS=0 VDD=15 V, ID = 15 A VGS =4.5 V (see Figure 3) f=1 MHz Gate DC Bias = 0 Test signal level = 20 mV Open drain 0.5 Min. Typ. 1500 295 39 12 4 4.7 Max. Unit pF pF pF nC nC nC Gate input resistance 1.5 2.5 4/10 STL15N3LLH5 Electrical characteristics Table 6. Symbol td(on) tr td(off) tf Switching times Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions VDD=15 V, ID= 7.5 A, RG=4.7 , VGS=4.5 V (see Figure 2) Min. Typ. 9.3 14.5 22.7 4.5 Max. Unit ns ns ns ns Table 7. Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD=15 A, VGS=0 ISD=15 A, di/dt = 100 A/s, VDD=20 V, Tj=150 C (see Figure 7) 25 17.5 1.4 Test conditions Min. Typ. Max. 15 60 1.1 Unit A A V ns nC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5% 5/10 Test circuit STL15N3LLH5 3 Figure 2. Test circuit Switching times test circuit for resistive load Figure 3. Gate charge test circuit Figure 4. Test circuit for inductive load Figure 5. switching and diode recovery times Unclamped inductive load test circuit Figure 6. Unclamped inductive waveform Figure 7. Switching time waveform 6/10 STL15N3LLH5 Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 7/10 Package mechanical data STL15N3LLH5 PowerFLATTM ( 3.3 x 3.3) mechanical data mm Dim Min A A3 b D D2 E E2 e L L1 0.45 0.29 3.200 2.24 2.20 1.660 0.950 0.200 0.34 3.300 2.29 3.30 1.710 0.650 0.40 0.50 0.55 0.017 0.39 3.400 2.34 3.40 1.760 0.011 0.126 0.088 0.086 0.065 Typ Max 1.000 Min 0.037 inch Typ Max 0.039 0.008 0.013 0.123 0.090 0.123 0.067 0.025 0.0157 0.0196 0.021 0.015 0.134 0.092 0.1338 0.069 8/10 STL15N3LLH5 Revision history 5 Revision history Table 8. Date 25-Aug-2008 Document revision history Revision 1 First release Changes 9/10 STL15N3LLH5 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
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