Part Number Hot Search : 
IL34119N MQC02008 SX206007 ICE2B265 FE150H MBM200A6 C3B06 95ABCP
Product Description
Full Text Search
 

To Download HD74HC09FPEL Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HD74HC09
Quad. 2-input AND Gates (with open drain outputs)
REJ03D0537-0200 (Previous ADE-205-409) Rev.2.00 Oct 06, 2005
Features
* * * * * * High Speed Operation: tpd = 8 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 1 A max (Ta = 25C) Ordering Information
Part Name HD74HC09P HD74HC09FPEL HD74HC09RPEL Package Type DILP-14 pin SOP-14 pin (JEITA) SOP-14 pin (JEDEC) Package Code (Previous Code) PRDP0014AB-B (DP-14AV) PRSP0014DF-B (FP-14DAV) Package Abbreviation P FP -- EL (2,000 pcs/reel) EL (2,500 pcs/reel) ELL (2,000 pcs/reel) Taping Abbreviation (Quantity)
PRSP0014DE-A RP (FP-14DNV) PTSP0014JA-B HD74HC09TELL TSSOP-14 pin T (TTP-14DV) Note: Please consult the sales office for the above package availability.
Function Table
Inputs A L L H H H: L: High level Low level B L H L H Output Y L L L H
Rev.2.00, Oct 06, 2005 page 1 of 6
HD74HC09
Pin Arrangement
1A 1B 1Y 2A 2B 2Y GND
1 2 3 4 5 6 7 (Top view)
14 VCC 13 4B 12 4A 11 4Y 10 3B 9 8 3A 3Y
Absolute Maximum Ratings
Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Symbol VCC Vin, Vout IIK, IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to VCC +0.5 20 25 50 500 -65 to +150 Unit V V mA mA mA mW C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time.
Recommended Operating Conditions
Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time*1 Note: Symbol VCC VIN, VOUT Ta tr, tf Ratings 2 to 6 0 to VCC -40 to 85 0 to 1000 0 to 500 Unit V V C ns Conditions
0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Rev.2.00, Oct 06, 2005 page 2 of 6
HD74HC09
Electrical Characteristics
Item Input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 6.0 Min 1.5 3.15 4.2 -- -- -- -- -- -- -- -- -- -- -- Ta = 25C Typ Max -- -- -- -- -- -- 0.0 0.0 0.0 -- -- -- -- -- -- -- -- 0.5 1.35 1.8 0.1 0.1 0.1 0.26 0.26 0.5 0.1 1.0 Ta = -40 to+85C Unit Min Max 1.5 3.15 4.2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 5.0 1.0 10 V Test Conditions
VIL
V
Output voltage
VOL
V
Vin = VIH or VIL IOL = 20 A
IOL = 4 mA IOL = 5.2 mA A Vin = VIH or VIL, Vout = VCC or GND A Vin = VCC or GND A Vin = VCC or GND, Iout = 0 A
Off-state output current Input current Quiescent supply current
Io(off) Iin ICC
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Item Propagation delay time Symbol VCC (V) tPLH 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- Min -- -- -- -- -- -- -- -- -- -- Ta = 25C Ta = -40 to +85C Unit Typ Max Min Max -- 10 -- -- 6 -- -- 5 -- 5 90 18 15 90 18 15 75 15 13 10 -- -- -- -- -- -- -- -- -- -- 115 23 20 112 22 18 95 19 16 10 ns Test Conditions
tPHL
ns
Output fall time
tTHL
ns
Input capacitance
Cin
pF
Rev.2.00, Oct 06, 2005 page 3 of 6
HD74HC09
Test Circuit
VCC
RL = 1 k
CL*
Note: C L includes the probe and jig capacitance.
Waveforms
* Waveform - 1
tr 90% 50% 10% t PLH Output 10% 90% 50% 10% t PHL 90% 50% 10% t THL Notes: 1. Input waveform: PRR 1 MHz, Zo = 50 , tr 6 ns, tf 6 ns 2. The output are measured one at a time with one transition per measurement. VOH VOL tf VCC 0V
Input
Rev.2.00, Oct 06, 2005 page 4 of 6
HD74HC09
Package Dimensions
JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B Previous Code DP-14AV MASS[Typ.] 0.97g
D
14
8
1 b3
7
Z
A
E
Reference Symbol
A1
Dimension in Millimeters
Min
e
bp
e1
c
( Ni/Pd/Au plating )
e1 D E A A1 bp b3 c e Z L
Nom Max 7.62 19.2 20.32 6.3 7.4 5.06
L
0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0 15 2.29 2.54 2.79 2.39 2.54
JEITA Package Code P-SOP14-5.5x10.06-1.27
RENESAS Code PRSP0014DF-B
Previous Code FP-14DAV
MASS[Typ.] 0.23g
*1
D 8
F
14
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
7 bp x M L1
Reference Dimension in Millimeters Symbol
c
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 10.06 10.5 5.50
0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0 8 7.50 7.80 8.00 1.27 0.12 0.15 1.42 0.50 0.70 0.90 1.15
Rev.2.00, Oct 06, 2005 page 5 of 6
A
HD74HC09
JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A Previous Code FP-14DNV MASS[Typ.] 0.13g
*1
D 8
F
14
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
*2
Index mark
HE
E
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
c
Reference Dimension in Millimeters Symbol
Min
7 bp x M L1
A1
L
y
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Nom Max 8.65 9.05 3.95
0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0 8 5.80 6.10 6.20 1.27 0.25 0.15 0.635 0.40 0.60 1.27 1.08
JEITA Package Code P-TSSOP14-4.4x5-0.65
RENESAS Code PTSP0014JA-B
Previous Code TTP-14DV
MASS[Typ.] 0.05g
*1
D
A
F 8
14
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
*2
E
Index mark
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
c
7 bp x M L1
Reference Dimension in Millimeters Symbol
A1
L
y
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 5.00 5.30 4.40
0.03 0.07 0.10 1.10 0.15 0.20 0.25 0.10 0.15 0.20 0 8 6.20 6.40 6.60 0.65 0.13 0.10 0.83 0.4 0.5 0.6 1.0
Rev.2.00, Oct 06, 2005 page 6 of 6
A
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, China Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .5.0


▲Up To Search▲   

 
Price & Availability of HD74HC09FPEL

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X