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STW13009
High voltage fast-switching NPN power transistor
Features

Low spread of dynamic parameters High voltage capability Minimum lot-to-lot spread for reliable operation Very high switching speed
3 2 1
Application
Switch mode power supplies
TO-247
Description
The device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and medium voltage capability. It uses a Hollow emitter structure to enhance switching speeds. Figure 1. Internal schematic diagram
Table 1.
Device summary
Marking (1) W13009 L Package TO-247 W13009 H Packaging Tube
Order code STW13009
1. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to ship either groups according to production availability. Please contact your nearest STMicroelectronics sales office for delivery details.
October 2007
Rev 1
1/11
www.st.com 11
Contents
STW13009
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 4 5
Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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STW13009
Electrical ratings
1
Electrical ratings
Table 2.
Symbol VCEV VCEO VEBO IC ICM IB IBM Ptot Tstg TJ
Absolute maximum rating
Parameter Collector-emitter voltage (VBE = -1.5 V) Collector-emitter voltage (IB = 0) Emitter-base voltage (IC = 0) Collector current Collector peak current (tP < 5ms) Base current Base peak current (tP < 5ms) Total dissipation at Tc = 25C Storage temperature Max. operating junction temperature Value 700 400 12 12 24 6 12 125 -65 to 150 150 Unit V V V A A A A W C C
Table 3.
Symbol Rthj-case
Thermal data
Parameter Thermal resistance junction-case ____M __mMax Value 1 Unit C/W
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Electrical characteristics
STW13009
2
Electrical characteristics
(Tcase = 25C unless otherwise specified) Table 4.
Symbol ICEV IEBO
Electrical characteristics
Parameter Collector cut-off current (VBE = -1.5 V) Emitter cut-off current (IC = 0) Test conditions VCE = 700 V VCE = 700 V VEB = 10 V TC = 100C Min. Typ. Max. 10 500 10 Unit A A A
Collector-emitter VCEO(sus) (1) sustaining voltage (IB = 0)
IC = 10 mA IC = 4 A _ __ IB = 0.8 A IB = 1 A IB = 1.6 A IB = 3 A IB = 1 A IB = 1.6 A VCE = 5 V
400
V
VCE(sat) (1)
Collector-emitter saturation voltage
IC = 5 A
IC = 8 A _ _ IC = 12 A _ _
0.85 0.9 1.25 2.5 1.2 1.6
V V V V V V
VBE(sat) (1)
Base-emitter saturation voltage
IC = 5 A IC = 8 A IC = 5 A
_ __ _
hFE (1)(2)
DC current gain
Group L Group H IC = 8 A _ _ IC = 5 A
15 23 VCE = 5 V VCC = 250 V IB2 = -2 A 1.6 60 VCC = 125 V 2.3 110 10
28 36 30
Inductive load ts tf Storage time Fall time
IB1 = 1 A L = 200 H see Figure 9
2.5 110
s ns
Inductive load ts tf Storage time Fall time
IC = 5 A L = 200 H see Figure 9
IB1 = - IB2 = 1.6 A tc = 125 C
s ns
1. Pulsed duration = 300 ms, duty cycle 1.5 % 2. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to ship either groups according to production availability. Please contact your nearest STMicroelectronics sales office for delivery details.
4/11
STW13009
Electrical characteristics
2.1
Electrical characteristics (curves)
Figure 2. Safe operating area Figure 3. Derating curve
Figure 4.
DC current gain
Figure 5.
DC current gain
Figure 6.
Collector-emitter saturation voltage
Figure 7.
Base-emitter saturation voltage
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Electrical characteristics Figure 8. Reverse biased operating area
STW13009
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STW13009
Test circuit
3
Test circuit
Figure 9. Inductive load switching test circuit
1) Fast electronic switch 2) Non-inductive resistor 3) Fast recovery rectifier
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Package mechanical data
STW13009
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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STW13009
Package mechanical data
TO-247 Mechanical data
mm. Min. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 14.80 4.30 Typ Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75
Dim. A A1 b b1 b2 c D E e L L1 L2 oP oR S
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Revision history
STW13009
5
Revision history
Table 5.
Date 25-Oct-2007
Document revision history
Revision 1 Initial release Changes
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STW13009
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