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 EMP214
UPDATED 05/08/2008
12.50 - 15.50 GHz Power Amplifier MMIC
FEATURES
* * * * * * 12.5 - 15.5 GHz Operating Frequency Range 29.5dBm Output Power at 1dB Compression 16.0 dB Typical Small Signal Gain -42dBc OIMD3 @Each Tone Pout 18.5dBm
Dimension: 2650um X 2140um Thickness: 85um 15um
APPLICATIONS
Point-to-point and point-to-multipoint radio Military Radar Systems
Caution! ESD sensitive device.
ELECTRICAL CHARACTERISTICS (Ta = 25 C, 50 ohm, VDD=7V, IDQ=750mA)
SYMBOL PARAMETER/TEST CONDITIONS EMP214 F Operating Frequency Range EMP214H EMP214L P1dB Gss OIMD3 Input RL Output RL Idss VDD Rth Tb Output Power at 1dB Gain Compression Small Signal Gain Output 3rd Order Intermodulation Distortion @f=10MHz, Each Tone Pout 18.5dBm Ids=60%10%Idss Input Return Loss Output Return Loss Saturate Drain Current VDS =3V, VGS =0V Power Supply Voltage Thermal Resistance (Au-Sn Eutectic Attach) Operating Base Plate Temperature -35 920 MIN 12.5 13.5 12.5 28.5 13.0 29.5 16.0 -42 -15 -15 1150 7 11 +85
o
TYP
MAX 15.5 15.5 14.5
UNITS GHz dBm dB
-39 -10 -10 1380
dBc dB dB mA V C/W C
MAXIMUM RATINGS AT 25C1,2
SYMBOL VDS VGS IDD IGSF PIN TCH TSTG PT CHARACTERISTIC Drain to Source Voltage Gate to Source Voltage Drain Current Forward Gate Current Input Power Channel Temperature Storage Temperature Total Power Dissipation ABSOLUTE 12 V -8 V Idss 114mA 27dBm 175C -65/175C 12.4W CONTINUOUS 8V -4 V 1300mA 19mA @ 3dB compression 150C -65/150C 10.4W
1. Operating the device beyond any of the above rating may result in permanent damage. 2. Bias conditions must also satisfy the following equation VDS*IDS < (TCH -THS)/RTH; where THS = Base Plate temperature Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 1 of 3 Revised May 2008
EMP214
UPDATED 05/08/2008
12.50 - 15.50 GHz Power Amplifier MMIC
ASSEMBLY DRAWING
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 2140 x 2650 microns Chip Thickness: 85 15 microns PAD Dimensions: 100 x 100 microns All Dimensions in Microns
Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 2 of 3 Revised May 2008
EMP214
UPDATED 05/08/2008
12.50 - 15.50 GHz Power Amplifier MMIC
ORDERING INFORMATION Part Number EMP214 EMP214H EMP214L
Notes: Contact factory for military and hi-rel grades.
Frequency (GHz) 12.50-15.50 GHz 13.50-15.50 GHz 12.50-14.50 GHz
DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
page 3 of 3 Revised May 2008


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