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WIREWOUND CHIP INDUCTORS
1. PART NO. EXPRESSION :
SDI322520 SERIES
SDI322520-1R0MF
(a) (b) (c) (d)(e)
(a) Series code (b) Dimension code (c) Inductance code : 1R0 = 1.0uH
(d) Tolerance code : J = 5%, K = 10%, M = 20% (e) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
B
E
F
E I J I
C
PCB Pattern
Unit:m/m A 3.20.3 B 2.50.2 C 2.00.3 E 0.7 Min. F 0.7 Min. H 2.0 Ref. I 1.5 Ref. J 1.0 Ref.
3. SCHEMATIC : 1
2
4. GENERAL SPECIFICATION : a) Ambient temp. : 20C b) Operating temp. : -25C to 85C c) Rated current : Base on temp. rise & L/L0A=10% Max.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
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WIREWOUND CHIP INDUCTORS
5. ELECTRICAL CHARACTERISTICS : Part No. SDI322520-R10 F SDI322520-R18 F SDI322520-R27 F SDI322520-R39 F SDI322520-R56 F SDI322520-R68 F SDI322520-R82 F SDI322520-1R0 F SDI322520-1R2 F SDI322520-1R5 F SDI322520-1R8 F SDI322520-2R2 F SDI322520-2R7 F SDI322520-3R3 F SDI322520-3R9 F SDI322520-4R7 F SDI322520-5R6 F SDI322520-6R8 F SDI322520-8R2 F SDI322520-100 F SDI322520-120 F SDI322520-150 F SDI322520-180 F SDI322520-220 F SDI322520-270 F SDI322520-330 F SDI322520-390 F SDI322520-470 F SDI322520-560 F SDI322520-680 F SDI322520-820 F Inductance tolerance : : J = 5% K = 10% M = 20% Inductance ( uH ) 0.10 0.18 0.27 0.39 0.56 0.68 0.82 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 Tolerance M M M M M M M M M M, K M, K M, K M, K M, K M, K M, K M, K M, K M, K K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J Test Frequency ( Hz ) 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M Q Min. 20 20 25 25 30 30 30 20 20 20 20 20 20 20 20 20 20 20 20 35 35 35 35 35 35 40 40 40 40 40 40 Test Frequency ( Hz ) 25.2M 25.2M 25.2M 25.2M 25.2M 25.2M 25.2M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M 1M
SDI322520 SERIES
SRF ( MHz ) Min. 200 200 200 200 160 160 120 100 100 75 60 50 43 38 35 31 28 25 23 20 18 16 15 14 13 12 11 11 10.0 9.0 8.5
DCR () Max. 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.50 0.60 0.60 0.70 0.80 0.90 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.5 2.8 3.1 3.5 3.9 4.3 4.9 5.5 6.2
IDC ( mA ) Max. 700 650 600 530 530 470 450 445 425 400 390 370 320 300 290 270 250 240 225 190 180 170 165 150 125 115 110 100 85 80 70
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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WIREWOUND CHIP INDUCTORS
5. ELECTRICAL CHARACTERISTICS : Part No. SDI322520-101 F SDI322520-121 F SDI322520-151 F SDI322520-181 F SDI322520-221 F SDI322520-271 F SDI322520-331 F SDI322520-391 F SDI322520-471 F SDI322520-561 F Inductance tolerance : : J = 5% K = 10% M = 20% Inductance ( uH ) 100 120 150 180 220 270 330 390 470 560 Tolerance K, J K, J K, J K, J K, J K, J K, J K, J K, J K, J Test Frequency ( Hz ) 1M 1M 1M 1M 1M 1M 1M 1M 1K 1K Q Min. 40 40 40 40 40 40 40 50 50 50 Test Frequency ( Hz ) 796K 796K 796K 796K 796K 796K 796K 796K 796K 796K
SDI322520 SERIES
SRF ( MHz ) Min. 8.0 7.5 7.0 6.0 5.5 5.0 5.0 5.0 5.0 5.0 ( Ref. )
DCR () Max. 7.0 8.0 9.3 10.2 11.8 12.5 15.0 22.0 25.0 28.0
IDC ( mA ) Max. 80 75 70 65 65 65 65 50 45 40
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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6. RELIABILITY AND TEST CONDITION :
SDI322520 SERIES
ITEM
Environmental Tests
High Temperature Storage Test Reference documents: MIL-STD-202G Method 108A
PERFORMANCE
TEST CONDITION
1. No case deformation or change in appearance. 2. L/L<30% (Closed Magnetic Circuit) L/L<10% 3. Q/Q < 30% 4. DCR/DCR<10%
Temperature : 852C Time : 962 hours Tested after 1 hour (less than 2 hours) at room temperature
Temp 85C Room Temp 0 High temperature 1H 96H Test Time
Low Temperature Storage Test Reference documents: IEC 68-2-1A 6.1 6.2
1. No case deformation or change in appearance. 2. L/L<30% (Closed Magnetic Circuit) L/L<10% 3. Q/Q < 30% 4. DCR/DCR<10%
Temperature : -252C Time : 962 hours Tested after 1 hour (less than 2 hours) at room temperature
Room Temp 0 -25C Temp Low temperature
96H Test Time
Humidity Test Reference documents: MIL-STD-202G Method 103B
1. No case deformation or change in appearance. 2. L/L<30% (Closed Magnetic Circuit) L/L<10% 3. Q/Q < 30% 4. DCR/DCR<10%
Dry oven at temperature of 405C for 24 hours Measured after 24 hours Exposure : Temperature : 402C, Humidity : 933% RH, Time : 962 hours Tested while the specimens are still in the chamber Tested after 1 hour (less than 2 hours) at room temperature
40C 93%RH Temp & Humidity High temperature High humidity Room Conditions
1H 0 96H Test Time
Thermal shock test Reference documents: MIL-STD-202G Method 107G
1. No case deformation or change in appearance. 2. L/L<30% (Closed Magnetic Circuit) L/L<10% 3. Q/Q < 30% 4. DCR/DCR<10% T : weight< 28g : 15 Min. 28gConditions of 1 cycle : Step 1 : -40C for T time Step 2 : 125C for T time Total : 20 cycles
Temp 125C Room Temp 0 -40C T Time Change time < 5 min T
Physical Characteristics Tests
Solderability Test Reference documents: MIL-STD-202G Method 208H IPC J-STD-002B More than 95% of termincal electrode should be covered with solder. Solder temperature : 2455C Dip time : 5 secs. Solder : Sn(63)/Pb(37) Flux : rosin flux
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
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WIREWOUND CHIP INDUCTORS
6. RELIABILITY AND TEST CONDITION :
SDI322520 SERIES
ITEM
Heat Endurance of Reflow Soldering Reference documents: IPC J-STD-020B
PERFORMANCE
1. No case deformation or change in appearance. 2. L/L<30% (Closed Magnetic Circuit) L/L<10% 3. Q/Q < 30% 4. DCR/DCR<10% 1. No case deformation or change in appearance. 2. L/L<30% (Closed Magnetic Circuit) L/L<10% 3. Q/Q < 30% 4. DCR/DCR<10%
TEST CONDITION
Refer to reflow curve. No. of cycle : 3 Peak temp. : 2455C
Vibration Test Reference documents: MIL-STD-202G Method 201A
Frequency : 10~55Hz Amplitude : 0.75mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours).
Freq 55Hz
10Hz 1Min Time
Drop Test Reference documents: MIL-STD-202G Method 203C
1. No case deformation or change in appearance. 2. L/L<30% (Closed Magnetic Circuit) L/L<10% 3. Q/Q < 30% 4. DCR/DCR<10% Pulling Test : A : Sectional area of terminal
Drop from a height of 1m with 981m/s (100G) altitude (1 angle, 1 ridge and 2 surface orientations)
Terminal Strength Push Test Reference documents: JIS C 5321:1997
Bend PCB at middle point, the deflection shall be 2mm. Pulling Test :
Force A<8mm 8mm5N >10N >20N
Time (sec) 30 10 10
X Bending Test : R0.5 1.0
Y
Bending Test : The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
Sample
Reflow Curve
300 250 270 200 150 100 50
Preheat Ramp-up Peak Ramp-down
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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7. SOLDERING AND MOUNTING : 7-1. Recommended PC Board Pattern
1.50 1.00 1.50
SDI322520 SERIES
7-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 7-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 240C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Figure 2. 7-2.3 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150C. b) 280C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs.
Preheating Soldering Natural cooling Preheating Soldering Natural cooling
TEMPERATURE C
2.50
TEMPERATURE C
Over 1min. Over 1min. Gradual Cooling Within 10secs.
230 150
250 230 150
Over 2mins.
Gradual Cooling Within 3secs.
Preheating
Soldering
TEMPERATURE C
Figure 1. Re-flow Soldering
280 230 150
Natural cooling
Figure 2. Wave Soldering
Over 1min.
Gradual Cooling Within 3secs.
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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WIREWOUND CHIP INDUCTORS
8. PACKAGING INFORMATION : ( Unit : mm ) 8-1. Reel & Tape Dimension 178
SDI322520 SERIES
2.50.5
12 0
131 231
1.50 +0.10 -0.00
40.1
4
Tape trailer 160mm Min.
1.750.1
8
Components
Tape leader 388mm Min.
Cover tape 250mm Min.
4R7
4R7
Direction of feed
4R7
4R7
4R7
4R7
8-2. Quantity & G.W. per package INNER : REEL SERIES SDI322520 Q'TY (PCS) 2000 G.W. (Kg) 0.18 OUTER : CARTON Q'TY (PCS) 120000 G.W. (Kg) 15 SIZE (cm) 39 x 39 x 23
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 7
WIREWOUND CHIP INDUCTORS
SDI322520 SERIES
8-3. Tearing Off Force
F
165 to 180
Top cover tape The force for tearing off cover tape is 10 to 60 grams in the arrow direction. Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
31.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8

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