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 SSG9475
Elektronische Bauelemente 6.9A, 60V,RDS(ON) 40m[
N-Channel Enhancement Mode Power Mos.FET
RoHS Compliant Product
SOP-8
Description
The SSG9475 provide the designer with the best Combination of fast switching, ruggedized device design, Ultra low on-resistance and cost-effectiveness.
The SOP-8 is universally preferred for all commercial industrial surface mount application and suited for low voltage applications such as DC/DC converters.
0.35 0.49 1.27Typ. 4.80 5.00 0.100.25 6.20 5.80 0.25 3.80 4.00 0.40 0.90 0.19 0.25
45
o
0.375 REF
Features
* Simple drive requirement * Low gate charge
D 8 D 7 D 6 D 5
0 o 8
o
1.35 1.75
Dimensions in millimeters
D
* Fast switching Characteristic
Date Code
9475SC
G
1 S
2 S
3 S
4 G
S
Absolute Maximum Ratings
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1 3 3
Symbol
VDS VGS ID@TA=25 C ID@TA=70 C IDM PD@TA=25 C
o o o
Ratings
60
25 6.9 5.5 30 2.5 0.02
Unit
V V A A A W
W / oC
o
Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range
Tj, Tstg
-55~+150
C
Thermal Data
Parameter
Thermal Resistance Junction-ambient Max.
Symbol
Rthj-a
Ratings
50
o
Unit
C /W
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 1 of 4
SSG9475
Elektronische Bauelemente 6.9A, 60V,RDS(ON) 40m[
N-Channel Enhancement Mode Power Mos.FET
Electrical Characteristics( Tj=25 C Unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 oC) Drain-Source Leakage Current (Tj=70 oC) Static Drain-Source On-Resistance
2
o
Symbol
BVDSS BVDS/ Tj VGS(th) IGSS IDSS
Min.
60
_
Typ.
_
Max.
_ _
Unit
V
o V/ C
Test Condition
VGS=0V, ID=250uA
o Reference to 25 C,ID=1mA
0.073
_ _ _ _
1.0
_ _ _ _
3.0
100
V nA uA uA
VDS=VGS, ID=250uA VGS= 25V VDS=60V,VGS=0 VDS=48V,VGS=0 VGS=10V, ID=6A VGS=4.5V, ID=4A
1 25 40 50
30
_ _
_ _ 19 5 10 11 6 35 10 1670 160 116 10
1.58
RDS(ON) Qg Qgs Qgd Td(ON) Tr Td(Off) Tf Ciss Coss Crss Gfs
Rg
_ _ _ _ _ _ _ _ _ _ _
m[
Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Forward Transconductance
Gate Resistance
2
nC
ID=6A VDS=48V VGS=4.5V
_
_ _ _
VDD=30V ID=1A nS VGS=10V RG=3.3 [ RD=30 [
2670
_ _
pF
VGS=0V VDS=25V f=1.0MHz
_
_
S
[
VDS=10V, ID=6A
_
_
f=1.0MHz
Source-Drain Diode
Parameter
Forward On Voltage
2
Symbol
VDS
Min.
_
Typ.
_
Max.
1.2
Unit
V
Test Condition
IS=2A, VGS=0V.
Is=6A, VGS=0V dl/dt=100A/us
Reverse Recovery Time
2
Trr Qrr
_ _
34 50
_ _
nS nC
Reverse Recovery Charge
Notes: 1.Pulse width limited by safe operating area. 2.Pulse widthO 300us, dutycycleO2%. 3.Surface mounted on 1 inch2 copper pad of FR4 board; 125OC/W when mounted on min. copper pad.
http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 2 of 4
SSG9475
Elektronische Bauelemente 6.9A, 60V,RDS(ON) 40m[
N-Channel Enhancement Mode Power Mos.FET
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
http://www.SeCoSGmbH.com/
Fig 5. Forward Characteristics of Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 3 of 4
SSG9475
Elektronische Bauelemente 6.9A, 60V,RDS(ON) 40m [
N-Channel Enhancement Mode Power Mos.FET
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
http://www.SeCoSGmbH.com/
Any changing of specification will not be informed individual
01-Jun-2002 Rev. A
Page 4 of 4


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