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DATA SHEET PHOTOCOUPLER PS2761B-1 4-PIN SOP PHOTOCOUPLER OPERATING AMBIENT TEMPERATURE 110C -NEPOC Series- DESCRIPTION The PS2761B-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor. This package is mounted in a plastic SOP (Small Outline Package) for high density applications. The package has shield effect to cut off ambient light. FEATURES * Operating ambient temperature: 110C * Isolation distance (0.4 mm MIN.) * High isolation voltage (BV = 3 750 Vr.m.s.) * SOP (Small Outline Package) type * High-speed switching (tr = 4 s TYP., tf = 5 s TYP.) * Ordering number of taping product: PS2761B-1-F3: 3 500 pcs/reel * Pb-Free product * Safety standards * UL approved: No. E72422 * CSA approved: No. CA 101391 * BSI approved: No. 8947, 8948 * SEMKO approved: No. 700105 * NEMKO approved: No. P07207735 * DEMKO approved: No. 314212 * FIMKO approved: No. FI 23239 1 2 4 PIN CONNECTION (Top View) 3 1. Anode 2. Cathode 3. Emitter 4. Collector APPLICATIONS * Power supply * Hybrid IC * Programmable logic controllers The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PN10651EJ03V0DS (3rd edition) Date Published December 2008 NS Printed in Japan The mark 2006, 2008 The revised points can be easily searched by copying an " PS2761B-1 PACKAGE DIMENSIONS (Unit: mm) 40.5 4 3 1 2 7.00.3 4.4 2.10.2 0.10.1 2.54 0.4 +0.10 -0.05 0.25 M 0.15 +0.10 -0.05 0.50.3 MARKING EXAMPLE Pb-Free Special version (Pb-Free and Halogen Free) No. 1 pin Mark Trade Mark No. 1 pin Mark 761B M831 Type Number Assembly Lot *1 761B M831 Trade Mark Type Number Assembly Lot *1 M 8 31 M 8 31 Week Assembled Year Assembled (Last 1 Digit) CTR Rank Code *1 Bar: Pb-Free Remark "PS" and "-1" are omitted from original type number Week Assembled Year Assembled (Last 1 Digit) CTR Rank Code *1 Bar: Pb-Free and Halogen Free Remark "PS" and "-1" are omitted from original type number PHOTOCOUPLER CONSTRUCTION Parameter Air Distance (MIN.) Outer Creepage Distance (MIN.) Isolation Distance (MIN.) PS2761B-1 5 mm 5 mm 0.4 mm 2 Data Sheet PN10651EJ03V0DS PS2761B-1 ORDERING INFORMATION Part Number Order Number Solder Plating Specification PS2761B-1 PS2761B-1-F3 PS2761B-1-A PS2761B-1-F3-A Pb-Free Magazine case 100 pcs Embossed Tape 3 500 pcs/reel Packing Style Safety Standard Approval Standard products (UL, CSA, BSI, SEMKO, NEMKO, DEMKO, FIMKO approved) PS2761B-1-V PS2761B-1-V-F3 PS2761B-1-V-A PS2761B-1-V-F3-A Magazine case 100 pcs Embossed Tape 3 500 pcs/reel DIN EN60747-5-2 (VDE0884 Part2) Approved (Option) PS2761B-1 PS2761B-1-F3 PS2761B-1Y-A PS2761B-1Y-F3-A Special version Magazine case 100 pcs (Pb-Free and Halogen Free) Embossed Tape 3 500 pcs/reel Standard products (UL, CSA, BSI, SEMKO, NEMKO, DEMKO, FIMKO approved) PS2761B-1-V PS2761B-1-V-F3 PS2761B-1Y-V-A PS2761B-1Y-V-F3-A Magazine case 100 pcs Embossed Tape 3 500 pcs/reel DIN EN60747-5-2 (VDE0884 Part2) Approved (Option) PS2761B-1 Application Part *1 Number PS2761B-1 *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Derating Power Dissipation Peak Forward Current Transistor *1 Symbol IF VR Ratings 25 6 0.8 80 1.0 70 5 40 1.5 150 3 750 -55 to +110 -55 to +150 Unit mA V mW/C mW A V V mA mW/C mW Vr.m.s. C C PD/C PD IFP VCEO VECO IC Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Derating Power Dissipation PC/C PC BV TA Tstg Isolation Voltage *2 Operating Ambient Temperature Storage Temperature *1 PW = 100 s, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together. Data Sheet PN10651EJ03V0DS 3 PS2761B-1 ELECTRICAL CHARACTERISTICS (TA = 25C) Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Transistor Collector to Emitter Dark Current Coupled Current Transfer Ratio (IC/IF) *1 Symbol VF IR Ct ICEO IF = 5 mA VR = 5 V Conditions MIN. TYP. 1.1 MAX. 1.4 5 Unit V A pF V = 0 V, f = 1 MHz IF = 0 mA, VCE = 24 V 15 100 nA CTR IF = 5 mA, VCE = 5 V IF = 1 mA, VCE = 5 V 50 10 100 50 400 % Collector Saturation Voltage Isolation Resistance Isolation Capacitance Rise Time Fall Time *2 VCE (sat) IF = 10 mA, IC = 2 mA 0.3 V RI-O CI-O tr tf VI-O = 1 kVDC V = 0 V, f = 1 MHz VCC = 5 V, IC = 2 mA, RL = 100 10 11 0.4 4 5 pF s *2 *1 CTR rank CTR rank K CTR (%) 200 to 400 40 to L 100 to 300 20 to M 50 to 150 10 to N 50 to 400 10 to Conditions IF = 5 mA, VCE = 5 V IF = 1 mA, VCE = 5 V IF = 5 mA, VCE = 5 V IF = 1 mA, VCE = 5 V IF = 5 mA, VCE = 5 V IF = 1 mA, VCE = 5 V IF = 5 mA, VCE = 5 V IF = 1 mA, VCE = 5 V *2 Test circuit for switching time VCC PW = 100 s Duty cycle = 1/10 IF In monitor 50 RL = 100 Output 10% tr tf VOUT 90% Input ton td ts toff 4 Data Sheet PN10651EJ03V0DS PS2761B-1 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 210 1.5 mW/C 180 150 120 90 60 30 0 25 50 75 100110 125 150 100 Diode Power Dissipation PD (mW) 0.8 mW/C 80 60 40 20 0 25 50 75 100110 125 150 Ambient Temperature TA (C) Ambient Temperature TA (C) FORWARD CURRENT vs. FORWARD VOLTAGE 100 50 Forward Current IF (mA) COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE 30 10 5 Collector Current IC (mA) TA = +100C +60C +25C 25 20 15 10 5 IF = 10 mA 1 0.5 0C -25C -55C 5 mA 2 mA 1 mA 0.1 0.05 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0 2 4 6 8 10 Forward Voltage VF (V) Collector to Emitter Voltage VCE (V) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE Collector to Emitter Dark Current ICEO (nA) COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 10 IF = 10 mA 5 mA 10 000 VCE = 24 V 100 70 V Collector Current IC (mA) 1 000 2 mA 1 1 mA 10 1 0.1 0 20 40 60 80 100 120 0.1 0 0.2 0.4 0.6 0.8 1.0 Ambient Temperature TA (C) Collector Saturation Voltage VCE (sat) (V) Remark The graphs indicate nominal characteristics. Data Sheet PN10651EJ03V0DS 5 PS2761B-1 NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE Normalized Current Transfer Ratio CTR Normalized Current Transfer Ratio CTR NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE 1.4 1.2 1.0 0.8 0.6 0.4 Normalized to 1.0 0.2 at TA = 25C, IF = 5 mA, VCE = 5 V 0 -60 -40 -20 0 20 CTR@100% 210% 1.4 1.2 1.0 0.8 0.6 210% 0.4 Normalized to 1.0 0.2 at TA = 25C, IF = 1 mA, VCE = 5 V 0 -60 -40 -20 0 20 CTR@100% 40 60 80 100 120 40 60 80 100 120 Ambient Temperature TA (C) Ambient Temperature TA (C) SWITCHING TIME vs. LOAD RESISTANCE 100 IC = 2 mA, VCC = 5 V, CTR = 236% tf tr SWITCHING TIME vs. LOAD RESISTANCE 1 000 IF = 5 mA, VCC = 5 V, CTR = 236% Switching Time t ( s) tf Switching Time t ( s) 10 td 100 ts 1 ts 10 tr 0.1 10 100 1 000 10 000 1 1 td 10 Load Resistance RL (k) 100 Load Resistance RL () CURRENT TRANSFER RATIO vs. FORWARD CURRENT 250 Current Transfer Ratio CTR (%) FREQUENCY RESPONSE 5 VCE = 5 V, n=3 Normalized Gain GV 200 150 100 50 0 0.01 Sample A B C 0 -5 100 -10 300 -15 -20 -25 0.1 IF = 5 mA, VCE = 5 V RL = 1 k 0.1 1 10 100 1 10 Frequency f (kHz) 100 1 000 Forward Current IF (mA) Remark The graphs indicate nominal characteristics. 6 Data Sheet PN10651EJ03V0DS PS2761B-1 TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) 2.00.05 4.00.1 1.750.1 1.5+0.1 -0 2.9 MAX. 12.00.2 5.50.05 1.550.1 7.40.1 4.60.1 8.00.1 2.40.1 0.3 Tape Direction PS2761B-1-F3 Outline and Dimensions (Reel) 2.00.5 3302.0 2.00.5 13.00.2 1001.0 R 1.0 21.00.8 13.00.2 13.51.0 17.51.0 Packing: 3 500 pcs/reel 11.9 to 15.4 Outer edge of flange Data Sheet PN10651EJ03V0DS 7 PS2761B-1 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 1.45 2.54 6.25 Remark All dimensions in this figure must be evaluated before use. 8 Data Sheet PN10651EJ03V0DS 0.8 PS2761B-1 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (C) (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C. Data Sheet PN10651EJ03V0DS 9 PS2761B-1 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. 10 Data Sheet PN10651EJ03V0DS PS2761B-1 SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Climatic test class (IEC 60068-1/DIN EN 60068-1) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.5 x UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 x UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Clearance distance Creepage distance Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) Material group (DIN EN 60664-1 VDE0110 Part 1) Storage temperature range Operating temperature range Isolation resistance, minimum value VIO = 500 V dc at TA = 25C VIO = 500 V dc at TA MAX. at least 100C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi Ris MIN. 10 9 Symbol Spec. 55/110/21 Unit UIORM Upr 707 1 060 Vpeak Vpeak Upr 1 325 Vpeak UTR 6 000 2 >5.0 >5.0 Vpeak mm mm CTI 175 III a Tstg TA -55 to +150 -55 to +110 C C Ris MIN. Ris MIN. 10 10 12 11 Tsi Isi Psi 150 300 500 C mA mW Data Sheet PN10651EJ03V0DS 11 PS2761B-1 * The information in this document is current as of December, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PN10651EJ03V0DS PS2761B-1 Caution This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. GaAs Products |
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