 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ZMD-Standard July 2000 Package SSOP14 (5,3 mm) Dimensions in millimetres Based on JEDEC JEP95: MO-150 1 Dimensions MDS 761 A2 A X View X k x 45 14 0,1 A1 Z 1 e D bp 0,15 M Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,3 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 1,99 0,25 0,38 0,65 7,65 7,90 0,63 1,22 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* kmin min max 1,73 0,05 0,21 1,68 1,78 0,09 0,20 6,07 6,33 5,20 5,38 0,25 0 10 * without mold-flash Zentrum Mikroelektronik Dresden Editor: Check: Date: Quality: Doc-No. QS-000761-HD-01 c LP |
Price & Availability of MDS761
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |