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| Datasheet File OCR Text: |
| ZMD-Standard February 2004 Package TSOP32 (I/8x13,4) MDS 768 Dimensions in millimetres 1 Dimensions Detail Z Z A2 0,1 A A1 1 32 e D HD Dimensions of Sub-Group B1 Amax bPmin bPmax enom HDmin HDmax LPmin 1,20 0,17 0,27 0,50 13,20 13,60 0,50 bp 0,1 M E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* - 0,05 0,15 0,90 1,05 0,10 0,21 11,70 11,90 7,90 8,10 0 5 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,3 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends Dmax* Emin* Emax* min max * without mold-flash Zentrum Mikroelektronik Dresden Editor: signed Schoder Check: signed Marx Date: 18.02.2004 Quality: signed Tina Kochan Doc-No. QS-000768-HD-01 c LP |
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